Abstract: A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.

Abstract: A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.

Abstract: A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.

Abstract: Provided are a semiconductor inspection system and a method for preventing condensation at an interface part. The inspection system is characterized by being equipped with: a probe apparatus configured to bring a probe into contact with a target object whose temperature is controlled so that the probe is electrically connected with the target object; a tester configured to inspect the target object by supplying an inspection signal to the target object and detect an output signal outputted from the target object; an interface part which electrically connects the probe with the tester; a vacuum seal mechanism configured to seal the interface part in an airtight state; a gas exhaust unit configured to evacuate the interior of the interface part to a depressurized atmosphere; and a dry gas supply unit configured to supply a dry gas into the evacuated interface part while controlling a flow rate of the dry gas.

Abstract: A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.

Abstract: In an inkjet printing apparatus which holds a printhead for performing printing by using ink supplied from an ink tank via an ink supply channel, the ink tank has a tank-side terminal for detecting the presence state of ink in the ink tank. The printhead has a head-side terminal for detecting the presence state of ink in the printhead. The printing apparatus detects at least one of the presence state of ink in the ink tank, printhead, and ink supply channel by selecting a terminal used for detection between the tank-side terminal and the head-side terminal.

Abstract: In an inkjet printing apparatus which holds a printhead for performing printing by using ink supplied from an ink tank via an ink supply channel, the ink tank has a tank-side terminal for detecting the presence state of ink in the ink tank. The printhead has a head-side terminal for detecting the presence state of ink in the printhead. The printing apparatus detects at least one of the presence state of ink in the ink tank, printhead, and ink supply channel by selecting a terminal used for detection between the tank-side terminal and the head-side terminal.

Abstract: A nose landing gear assembly on an airplane with a front fuselage section having a wheel bay defined therein and a pair of laterally spaced side compartments defined therein on each side of the wheel bay by respective laterally spaced side walls. A nose landing gear is mounted on the fuselage section for pivotal lifting and lowering movement into and out of the wheel bay. The nose landing gear assembly includes an actuator disposed in one of the side compartments for lifting the nose landing gear into and lowering the nose landing gear out of the wheel bay, and a steering device disposed in the other of the side compartments for steering the nose landing gear while the airplane is taxiing. Since the actuator and the steering device are concealed in the respective side compartments, they are protected from foreign-object damage. The nose landing gear assembly allows the airplane cabin to have increased space because the actuator and the steering device are positioned laterally of the nose landing gear.