Abstract: An information processing apparatus comprises a processor configured to execute a program so as to: acquire viewpoint information, motion information and object information; process an object image wherein: the object image is an image representing a virtual substance and is updated based on the viewpoint information and the motion information; calculate a position when superimposing a background image and the object image, wherein: the background image is an image according to the field of view of the user; generate visual information superimposing the background image and the object image based on the position calculated, and output the generated visual information to a display device; and generate tactile information for an ultrasound generator irradiating the user with ultrasound corresponding to the object based on the position calculated, the motion information and the object information, and output the generated tactile information to the ultrasound generator.

Abstract: An article management system includes an acquirer and a management unit. The acquirer is configured to acquire identification information and management information. The identification information is information read from an electronic tag by the reading device in each of a plurality of bases in a distribution channel for an article, the electronic tag being attached to the article and storing the identification information. The management information is information collected in association with the identification information in a corresponding one of the plurality of bases, the management information relating to management of the article. The management unit is configured to manage the article with reference to the identification information and the management information which are acquired by the acquirer in each of the plurality of bases.

Abstract: Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.

Abstract: Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.

Abstract: A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.

Abstract: A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.

Abstract: A cutting apparatus includes a chuck table for holding a workpiece, a cutting blade for cutting the workpiece which is held by the chuck table, and a blade cover disposed in covering relation to an outer circumference of the cutting blade. The workpiece is cut in a dry state by the cutting blade while cut dusts produced from the workpiece and rotating with the cutting blade are being discharged through a tubular member under suction by a cut dusts retrieving unit mounted on the blade cover.

Abstract: An accommodation cassette including: a plurality of rear accommodating grooves that are formed at least in the laterally central area of the inner surface of a rear wall connecting the rear edges of right and left side walls and extend laterally and parallel to each other at vertical spacings in such a manner as to be associated with right and left accommodating grooves.

Abstract: The invention is to provide a resin hose capable of sufficiently ensuring the flow rate of fluid flowing through the resin hose while ensuring flexibility of wiring. The resin hose includes a round portion having a round flow-passage; and a flat portion that includes a flat flow-passage and has a flow-passage cross-section area equal to or larger than a flow-passage cross-section area of a minimum inner diameter portion in the round portion, a short width of the flat flow-passage being smaller than an inner diameter of the minimum inner diameter portion and a long width of the flat flow-passage being larger than the inner diameter of the minimum inner diameter portion.

Abstract: An accommodation cassette including: a plurality of rear accommodating grooves that are formed at least in the laterally central area of the inner surface of a rear wall connecting the rear edges of right and left side walls and extend laterally and parallel to each other at vertical spacings in such a manner as to be associated with right and left accommodating grooves.

Abstract: An accommodation cassette including: a plurality of rear accommodating grooves that are formed at least in the laterally central area of the inner surface of a rear wall connecting the rear edges of right and left side walls and extend laterally and parallel to each other at vertical spacings in such a manner as to be associated with right and left accommodating grooves.

Abstract: The game machine and game program of the present invention display, at the start of a game, multiple static symbols by constantly changing to various types of symbols including the wild symbol. The game machine then executes a static display by displaying such changing symbols statically again in each display area and recognizes the arrangements of each static symbol. Then, the game machine visually displays the arrangement of the symbols by which multiple wins are established or the win line related to such arrangements of the symbols, when the pre-determined combinations of symbols, in which at least one wild symbol is included, are arranged so that multiple wins are established. The game machine and game program according to the present invention increases the player's interest and arouses the player's anticipation.

Abstract: The game machine and game program of the present invention display, at the start of a game, multiple static symbols by constantly changing to various types of symbols including the wild symbol. The game machine then executes a static display by displaying such changing symbols statically again in each display area and recognizes the arrangements of each static symbol. Then, the game machine visually displays the arrangement of the symbols by which multiple wins are established or the win line related to such arrangements of the symbols, when the pre-determined combinations of symbols, in which at least one wild symbol is included, are arranged so that multiple wins are established. The game machine and game program according to the present invention increases the player's interest and arouses the player's anticipation.

Abstract: A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.

Abstract: An automatic synthesis machine is used for synthesis of compounds using a plurality of vessels, allowing reagents to chemically react with each other. The automatic synthesis machine comprises a selection means for selecting a specific vessel among a plurality of vessels, a display device for displaying the vessel selected by the selection means in a manner such that it can be identified, together with the operation contents (suction and injection) related to the selected vessel, and an analysis means for analyzing a protocol prescribing a series of operational procedures for synthesis of compounds and picked-out commands related to the selected vessel from the protocol.

Abstract: A conveying device for a plate-like workpiece, comprising a suction-holding device for suction-holding the plate-like workpiece and a moving device for moving the suction-holding device between a first predetermined position and a second predetermined position, wherein the suction-holding device comprises a plate-like workpiece holding member, non-contact suction-holders disposed on the under surface of the center area of the plate-like workpiece holding member, a restricting device which is mounted on the under surface of the peripheral area of the plate-like workpiece holding member and restricts the movement in the horizontal direction of the plate-like workpiece, and a plurality of falling prevention devices which are mounted in the peripheral area of the plate-like workpiece holding member at predetermined intervals in the circumferential direction and prevent the falling of the plate-like workpiece adsorbed by the non-contact suction-holders.

Abstract: In a game system having a monitor, an input unit for supplying a signal corresponding to a player's operation, and a game controller for executing a predetermined card game on a game screen of the monitor with reference to the signal supplied from the input unit, the game controller decides a plurality of cards displayed on the game screen in a matrix. The game controller sets the number of lines of a plurality of lines formed by the cards on the game screen, each as an effective line and all of which are in a single, common direction, depending on the value of a play a player sets by operating the input device, and controls a dividend for the player according to a combination of the cards on any of the effective line and a combination of the cards in a direction different from the direction of the effective lines.

Abstract: A cutting machine equipped with a cassette placing unit having a cassette table for placing a cassette storing a workpiece supported to an annular support frame via an adhesive tape. The cassette placing unit comprises an ultraviolet light irradiation unit which is disposed below the cassette table, stores a workpiece supported to the support frame by the adhesive tape and irradiates the adhesive tape with ultraviolet rays and an ascending and descending mechanism which positions the cassette placed on the cassette table at a first workpiece carrying-in/carrying-out position which is located in the carrying-in/carrying-out area for the workpiece carrying-in/carrying-out means and the ultraviolet light irradiation unit at a second workpiece carrying-in/carrying-out position which is located in the carrying-in/carrying-out area for the workpiece carrying-in/carrying-out means.

Abstract: A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.

Abstract: An automated chemical synthesizer including a plurality of reaction vessels and an execution time calculator. Synthetic reactions are to be carried out in the plurality of reaction vessels according to a synthesizing process. The execution time calculator is configured to calculate presumed execution time to carry out a predetermined scope of the synthesizing process before the predetermined scope of the synthesizing process is actually carried out.