Abstract: A wiring substrate includes a core substrate. The core substrate includes an accommodation hole extending through the core substrate from. A first wiring layer is formed on a first surface of the core substrate. A second wiring layer is formed on a second surface of the core substrate located opposite to the first surface. An electronic component, which includes a connection terminal, is accommodated in the accommodation hole. A conductive film is formed on a wall surface of the accommodation hole at a location corresponding to the connection terminal of the electronic component. The conductive film is connected to at least one of the first wiring layer and the second wiring layer. A thermal conductor thermally connects the connection terminal of the electronic component and the conductive film.

Abstract: A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and wherein the electronic part is held by the inward protruding portion.

Abstract: A wiring substrate includes a core substrate. The core substrate includes an accommodation hole extending through the core substrate from. A first wiring layer is formed on a first surface of the core substrate. A second wiring layer is formed on a second surface of the core substrate located opposite to the first surface. An electronic component, which includes a connection terminal, is accommodated in the accommodation hole. A conductive film is formed on a wall surface of the accommodation hole at a location corresponding to the connection terminal of the electronic component. The conductive film is connected to at least one of the first wiring layer and the second wiring layer. A thermal conductor thermally connects the connection terminal of the electronic component and the conductive film.

Abstract: A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and wherein the electronic part is held by the inward protruding portion.