Patents by Inventor Takaaki Kumazawa
Takaaki Kumazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10789974Abstract: A tonearm unit includes: an arm member having a tip to which a cartridge is attached; and a raising and lowering mechanism which raises and lowers the arm member with respect to a phonograph record along an axis. The raising and lowering mechanism includes: a cam base supporting the arm member; a ring cam provided to be rotatable about the axis with respect to the cam base; a first guide portion on the cam base, extending at an angle along a rotation direction of the ring cam; and a second guide portion on the ring cam, extending at an angle along the rotation direction so as to face the first guide portion. When the ring cam rotates with respect to the cam base, the cam base is raised and lowered with respect to the ring cam as a result of the second guide portion sliding along the first guide portion.Type: GrantFiled: October 23, 2017Date of Patent: September 29, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tomoyuki Yamashiro, Takaaki Kumazawa, Takeru Sakamoto
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Publication number: 20200058321Abstract: A tonearm unit includes: an arm member having a tip to which a cartridge is attached; and a raising and lowering mechanism which raises and lowers the arm member with respect to a phonograph record along an axis. The raising and lowering mechanism includes: a cam base supporting the arm member; a ring cam provided to be rotatable about the axis with respect to the cam base; a first guide portion on the cam base, extending at an angle along a rotation direction of the ring cam; and a second guide portion on the ring cam, extending at an angle along the rotation direction so as to face the first guide portion. When the ring cam rotates with respect to the cam base, the cam base is raised and lowered with respect to the ring cam as a result of the second guide portion sliding along the first guide portion.Type: ApplicationFiled: October 23, 2017Publication date: February 20, 2020Inventors: Tomoyuki YAMASHIRO, Takaaki KUMAZAWA, Takeru SAKAMOTO
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Patent number: 7899567Abstract: An inspection-required product selection method and program for minimizing the number of investigation steps at the time of a defect occurrence for a product placed on the market are disclosed. A combination of product lots to be inspected is assumed based on the information on the material lots used for a product lot scheduled for production for a predetermined future period and the number of the product lots inspected during the same period. The number of the material lots not included in the product lots to be inspected is totalized for each product lot, and the statistical values are calculated for all the conceivable combinations of the product lots. The combination of the product lots optimizing the statistical values is selected for inspection.Type: GrantFiled: April 25, 2008Date of Patent: March 1, 2011Assignee: Hitachi, Ltd.Inventors: Masataka Tanaka, Takaaki Kumazawa, Masayuki Ichinohe
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Patent number: 7840361Abstract: A technology is provided in which it is not necessary to modify a system on a production side, and in which man-hours required for registering an environmental load value on a supplier side are not increased, in cases of an item having a mismatch between units, in a process of adding up the environmental load values of a post-production product. The technology includes generating correction information for calculating the environmental load that is registered by the supplier at design time, and calculating the environmental load value at design time by using the correction information. In cases of calculating the environmental load value of a product actually produced from a designed product, the environmental load value is calculated using the correction information generated at design time.Type: GrantFiled: November 21, 2007Date of Patent: November 23, 2010Assignee: Hitachi, Ltd.Inventors: Takaaki Kumazawa, Noriaki Yamamoto, Yoshiharu Sekiya
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Publication number: 20080269936Abstract: An inspection-required product selection method and program for minimizing the number of investigation steps at the time of occurrence of a defect of a product placed on the market are disclosed. A combination of product lots to be inspected is assumed based on the information on the material lots used for a product lot scheduled for production for a predetermined future period and the number of the product lots inspected during the same period. The number of the material lots not included in the product lots to be inspected is totalized for each product lot, and the statistical values are calculated for all the conceivable combinations of the product lots. The combination of the product lots optimizing the statistical values is selected for inspection.Type: ApplicationFiled: April 25, 2008Publication date: October 30, 2008Inventors: Masataka TANAKA, Takaaki KUMAZAWA, Masayuki ICHINOHE
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Publication number: 20080208473Abstract: A technology is provided in which it is not necessary to modify a system on a production side, and in which man-hours required for registering an environmental load value on a supplier side are not increased, in cases of an item having a mismatch between units, in a process of adding up the environmental load values of a post-production product. The technology includes generating correction information for calculating the environmental load that is registered by the supplier at design time, and calculating the environmental load value at design time by using the correction information. In cases of calculating the environmental load value of a product actually produced from a designed product, the environmental load value is calculated using the correction information generated at design time.Type: ApplicationFiled: November 21, 2007Publication date: August 28, 2008Inventors: Takaaki Kumazawa, Noriaki Yamamoto, Yoshiharu Sekiya
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Publication number: 20070061310Abstract: A system for inspecting components by evaluating the degree of accuracy of component attribute information provided by third parties, wherein a performance unit for performing the evaluation of the component attribute information comprises a unit for extracting components similar to target components; a unit for determining the abnormality of component attribute information when the component attribute information can take limited kinds of values; a unit for determining the degree of the abnormality of the component attribute information when the component attribute information can take unlimited kinds of values; and a unit for sorting the components in the order of descending degree of abnormality of the component attribute information to clarify the reason for the evaluation result.Type: ApplicationFiled: August 21, 2006Publication date: March 15, 2007Inventors: Noriyasu Ninagawa, Noriaki Yamamoto, Yasuhiro Hamatsuka, Takaaki Kumazawa, Masanori Ikuzawa
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Publication number: 20060053070Abstract: The system comprises a design information management unit for storing the parts information including each part number to identify a product and a part of the product corresponding to the part number and the quantity of the product and a child part of the part, the subsidiary part information including each subsidiary part number for identifying the subsidiary part and the corresponding subsidiary part number and quantity of the child part of the subsidiary part, and the relating information including each combination of a part number and a part category with the corresponding subsidiary part number. The design information management unit, by specifying the part number and the subsidiary part number corresponding to the part number and the part category for identifying the designated product, prepares a parts table indicating the part number for identifying the designated product, the specified part number and the specified subsidiary part number with the quantity thereof.Type: ApplicationFiled: September 6, 2005Publication date: March 9, 2006Inventor: Takaaki Kumazawa
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Patent number: 6895346Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: GrantFiled: October 10, 2002Date of Patent: May 17, 2005Assignee: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Kazuyuki Tsunokuni, Aritoshi Sugimoto
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Publication number: 20050071259Abstract: A method is established which, through the use of a parts table, makes it possible to recognize amounts of chemical substances contained in in-company manufactured parts. This establishment allows implementation of the compliance with regulations on the chemical substances based on laws or the like. Taking advantage of the following four types of data, types and amounts of chemical substances contained within a product are computed and displayed, thereby presenting laws or the like which regulate the chemical substances: Parts data indicating a list of parts and in-company manufactured parts used in the product and chemical substances contained in the manufacturing processes, supply-maker data indicating supply sources of the parts and materials, parts chemical-substance data indicating the chemical substances contained in the parts, and law-and-others regulated-substance data indicating contents of the law-based regulations, client-based safety criterions, or the like.Type: ApplicationFiled: July 30, 2004Publication date: March 31, 2005Inventors: Shinichi Arai, Takaaki Kumazawa, Nortyuki Haga, Yoshiharu Sekiya, Yuzo Hiroshige
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Patent number: 6841405Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: GrantFiled: October 10, 2002Date of Patent: January 11, 2005Assignee: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni
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Patent number: 6780660Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: GrantFiled: October 10, 2002Date of Patent: August 24, 2004Assignee: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni
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Patent number: 6771077Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: GrantFiled: April 19, 2002Date of Patent: August 3, 2004Assignee: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni
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Patent number: 6770496Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: GrantFiled: October 10, 2002Date of Patent: August 3, 2004Assignee: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni
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Patent number: 6704495Abstract: An audio-video playback device in which a plane formed by the right sides of the device body and a plane formed by the right side of the monitor portion are on a substantially same plane, and the plane is substantially orthogonal to the rotation axis (R-R) of rotatably supporting portions. The center of gravity of the device body is located toward the right side, whereby the stable side-down setting of the device in the manner that the right sides (1R and 2R) face downward is realized. While, operation switches and the like are not disposed on the right sides, a user lying down can operate the device and watch natural display images and listen to natural sounds if the device is sidewards.Type: GrantFiled: February 9, 1999Date of Patent: March 9, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takaaki Kumazawa, Genichi Yamada, Ko Hamano, Tadashi Maeoka, Yoshihiro Fujimoto, Takamichi Nakagawa
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Publication number: 20030199107Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: ApplicationFiled: April 19, 2002Publication date: October 23, 2003Applicant: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Kazuyuki Tsunokuni, Aritoshi Sugimoto
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Publication number: 20030197522Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: ApplicationFiled: October 10, 2002Publication date: October 23, 2003Applicant: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni
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Publication number: 20030199110Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: ApplicationFiled: October 10, 2002Publication date: October 23, 2003Applicant: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Kazuyuki Tsunokuni, Aritoshi Sugimoto
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Publication number: 20030199111Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: ApplicationFiled: October 10, 2002Publication date: October 23, 2003Applicant: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni
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Publication number: 20030197523Abstract: A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.Type: ApplicationFiled: October 10, 2002Publication date: October 23, 2003Applicant: Hitachi, Ltd.Inventors: Yuichi Hamamura, Takaaki Kumazawa, Hisao Asakura, Aritoshi Sugimoto, Kazuyuki Tsunokuni