Patents by Inventor Takaaki Matsumoto

Takaaki Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11814548
    Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: November 14, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Tomohiro Iwano, Takaaki Matsumoto, Tomoyasu Hasegawa
  • Patent number: 11773291
    Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: October 3, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Tomohiro Iwano, Takaaki Matsumoto, Tomoyasu Hasegawa
  • Patent number: 11767448
    Abstract: A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: September 26, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Takaaki Matsumoto, Tomohiro Iwano, Tomoyasu Hasegawa, Tomomi Kukita
  • Patent number: 11702569
    Abstract: A slurry containing abrasive grains, a liquid medium, and a salt of a compound represented by formula (1) below, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, and the second particles contain a hydroxide of a tetravalent metal element. [In formula (1), R represents a hydroxyl group or a monovalent organic group].
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: July 18, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Takaaki Matsumoto, Tomohiro Iwano, Tomoyasu Hasegawa
  • Patent number: 11518920
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 0.1% by mass, an absorbance for light having a wavelength of 380 nm in a liquid phase obtained when the slurry is subjected to centrifugal separation for 5 minutes at a centrifugal acceleration of 5.8×104 G exceeds 0.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: December 6, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomoyasu Hasegawa, Tomohiro Iwano, Takaaki Matsumoto
  • Patent number: 11505731
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 0.1% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 60 minutes at a centrifugal acceleration of 1.1×104 G is 40 m2/g or more.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 22, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Takaaki Matsumoto, Tomohiro Iwano, Tomoyasu Hasegawa, Tomomi Kukita
  • Patent number: 11499078
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and an Rsp value calculated by Formula (1) below is 1.60 or more: Rsp=(Tb/Tav)?1??(1) [in the formula, Tav represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of the slurry in a case where a content of the abrasive grains is 2.0% by mass, and Tb represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of a supernatant solution obtained when the slurry is subjected to centrifugal separation for 50 minutes at a centrifugal acceleration of 2.36×105 G in a case where the content of the abrasive grains is 2.0% by mass.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 15, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomomi Kukita, Tomohiro Iwano, Takaaki Matsumoto, Tomoyasu Hasegawa
  • Patent number: 11492526
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 2.0% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 30 minutes at a centrifugal acceleration of 1.1×104 G is 24 m2/g or more.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 8, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomoyasu Hasegawa, Tomohiro Iwano, Takaaki Matsumoto, Tomomi Kukita
  • Patent number: 11359121
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and an Rsp value calculated by Formula (1) below is 1.60 or more: Rsp=(Tb/Tav)?1??(1) [in the formula, Tav represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of the slurry in a case where a content of the abrasive grains is 2.0% by mass, and Tb represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of a supernatant solution obtained when the slurry is subjected to centrifugal separation for 50 minutes at a centrifugal acceleration of 2.36×105 G in a case where the content of the abrasive grains is 2.0% by mass.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: June 14, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomomi Kukita, Tomohiro Iwano, Takaaki Matsumoto, Tomoyasu Hasegawa
  • Patent number: 11352523
    Abstract: According to an aspect of the present invention, there is provided a polishing liquid containing abrasive grains, a hydroxy acid, a polyol, at least one zwitterionic compound selected from the group consisting of an aminocarboxylic acid and an aminosulfonic acid, and a liquid medium, in which a zeta potential of the abrasive grains is positive, an isoelectric point of the aminocarboxylic acid is smaller than 7.0, and pKa of the aminosulfonic acid is larger than 0.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: June 7, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomohiro Iwano, Takaaki Matsumoto, Tomomi Kukita, Tomoyasu Hasegawa
  • Patent number: 11292939
    Abstract: According to an aspect of the present invention, there is provided a polishing liquid containing abrasive grains, a hydroxy acid, a polyol, at least one zwitterionic compound selected from the group consisting of an aminocarboxylic acid and an aminosulfonic acid, and a liquid medium, in which a zeta potential of the abrasive grains is positive, an isoelectric point of the aminocarboxylic acid is smaller than 7.0, and pKa of the aminosulfonic acid is larger than 0.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: April 5, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomohiro Iwano, Takaaki Matsumoto, Tomomi Kukita, Tomoyasu Hasegawa
  • Publication number: 20220033680
    Abstract: A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, and the second particles contain a cerium compound.
    Type: Application
    Filed: September 25, 2018
    Publication date: February 3, 2022
    Inventors: Tomohiro IWANO, Takaaki MATSUMOTO, Tomomi KUKITA, Tomoyasu HASEGAWA
  • Publication number: 20220017783
    Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Inventors: Tomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA
  • Patent number: 11198796
    Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 14, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomohiro Iwano, Takaaki Matsumoto, Tomoyasu Hasegawa
  • Publication number: 20210324237
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 0.1% by mass, an absorbance for light having a wavelength of 380 nm in a liquid phase obtained when the slurry is subjected to centrifugal separation for 5 minutes at a centrifugal acceleration of 5.8×104 G exceeds 0.
    Type: Application
    Filed: July 22, 2019
    Publication date: October 21, 2021
    Inventors: Tomoyasu HASEGAWA, Tomohiro IWANO, Takaaki MATSUMOTO
  • Publication number: 20210309884
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and when the slurry is brought into contact with a surface to be polished to bring the abrasive grains into contact with the surface to be polished, the slurry yields 0.13 or more in X-ray photoelectron spectroscopy as a ratio of the lowest valence among the plurality of valences of the metal.
    Type: Application
    Filed: September 25, 2018
    Publication date: October 7, 2021
    Inventors: Satoyuki NOMURA, Tomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA, Tomomi KUKITA
  • Publication number: 20210301179
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy.
    Type: Application
    Filed: September 25, 2018
    Publication date: September 30, 2021
    Inventors: Satoyuki NOMURA, Tomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA, Tomomi KUKITA
  • Publication number: 20210261821
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 0.1% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 60 minutes at a centrifugal acceleration of 1.1×104 G is 40 m2/g or more.
    Type: Application
    Filed: September 25, 2018
    Publication date: August 26, 2021
    Inventors: Takaaki MATSUMOTO, Tomohiro IWANO, Tomoyasui HASEGAWA, Tomomi KUKITA
  • Publication number: 20210261820
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and an Rsp value calculated by Formula (1) below is 1.60 or more: Rsp=(Tb/Tav)?1??(1) [in the formula, Tav represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of the slurry in a case where a content of the abrasive grains is 2.0% by mass, and Tb represents a relaxation time (unit: ms) obtained by pulsed NMR measurement of a supernatant solution obtained when the slurry is subjected to centrifugal separation for 50 minutes at a centrifugal acceleration of 2.36×105 G in a case where the content of the abrasive grains is 2.0% by mass.
    Type: Application
    Filed: September 25, 2018
    Publication date: August 26, 2021
    Inventors: Tomomi KUKITA, Tomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA
  • Publication number: 20210246346
    Abstract: A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 2.0% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 30 minutes at a centrifugal acceleration of 1.1×104 G is 24 m2/g or more.
    Type: Application
    Filed: September 25, 2018
    Publication date: August 12, 2021
    Inventors: Tomoyasu HASEGAWA, Tomohiro IWANO, Takaaki MATSUMOTO, Tomomi KUKITA