Abstract: The present invention relates to an adhesive film with which a flexible metal-clad laminate is obtained with suppressed dimensional changes occurred when produced by a laminating method; and a flexible metal-clad laminate comprising the adhesive film and a metal foil bonded thereto. The adhesive film comprises a polyimide film and, formed on at least one side thereof, an adhesive layer comprising a thermoplastic polyimide and has coefficients of linear expansion satisfying the relationship 1.0>(coefficient of linear expansion in the MD direction)/(coefficient of linear expansion in the TD direction)>0.1. This adhesive film may be one produced continuously and further satisfying the relationship 1.70>(elastic modulus in the MD direction)/(elastic modulus in the TD direction)>1.05 when the adhesive film has an MD modulus of 5 GPa or higher throughout the whole width thereof. That adhesive film may be one produced continuously and further satisfying the relationship 2.

Abstract: A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.

Abstract: It is an object of the present invention to provide a heat-resistant adhesive sheet for suppressing fluctuation in dimensional stability of a flexible printed board or, in particular, of a two-layer flexible printed board which has recently been increasingly demanded and which is required to be more highly heat-resistant and reliable. The foregoing problems can be solved by a heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.

Abstract: A polyimide film which, when used in FPC production, is reduced in dimensional change during the production steps. In particular, a metal-clad laminate apt to have abnormal parts such as rumples is produced from the film, and an FPC reduced in dimensional change is obtained in high yield. The polyimide film has a tan ? peak temperature within a range of 320° C. or more and lower than 380° C. in measuring a dynamic viscoelasticity, and is characterized by having a maximum sag of 13 mm or less.

Abstract: The present invention relates to a method for continuously producing a synthetic resin film that has stable physical properties across the full width and that is useful for an electronic field. In particular, the present invention relates to a method for continuously producing a synthetic resin film having molecular orientation controlled in the MD direction. That is, the present invention provides a method for continuously producing a synthetic resin film, the method including (A) a step of continuously flow-casting and applying a composition containing a polymer and an organic solvent onto a support to form a gel film; (B) a step of stripping the gel film from the support and fixing both ends of the gel film; and (C) a step of transporting the film with both ends being fixed in a oven, wherein in at least part of step (C), the film is fixed so that substantially no tension is applied in the width direction of the film (TD direction).

Abstract: A polyimide film that can provide a flexible metal-clad laminate plate which causes no significant dimensional change upon etching of the metal layer. The polyamide film is characterized in that, in the whole width of a continuously produced polyimide film, the ratio of the coefficient of humidity expansion (b) in a direction perpendicular to a molecular orientation axis and the coefficient of humidity expansion. (a) in the direction parallel to the molecular orientation axis, i.e., b/a, is not less than 1.01 to not more than 2.00 and the difference between the maximum value of the coefficient of humidity expansion ratio and the minimum value of the coefficient of humidity expansion ratio is not more than 0.30. The polyimide film in another aspect is characterized in that the coefficient of humidity expansion in a direction parallel to the molecular orientation axis is not less than 3.0 ppm/° C. and not more than 15.

Abstract: The present invention relates to an adhesive film with which a flexible metal-clad laminate is obtained with suppressed dimensional changes occurred when produced by a laminating method; and a flexible metal-clad laminate comprising the adhesive film and a metal foil bonded thereto. The adhesive film comprises a polyimide film and, formed on at least one side thereof, an adhesive layer comprising a thermoplastic polyimide and has coefficients of linear expansion satisfying the relationship 1.0>(coefficient of linear expansion in the MD direction)/(coefficient of linear expansion in the TD direction)>0.1. This adhesive film may be one produced continuously and further satisfying the relationship 1.70>(elastic modulus in the MD direction)/(elastic modulus in the TD direction)>1.05 when the adhesive film has an MD modulus of 5 GPa or higher throughout the whole width thereof. That adhesive film may be one produced continuously and further satisfying the relationship 2.

Abstract: It is an object of the present invention to provide a stable process for continuously producing a synthetic resin film oriented in the machine direction across the full width. The present invention provides a process for producing a synthetic resin film including step (A) of casting and applying a composition containing a polymer and an organic solvent onto a support to form a gel film; step (B) of stripping the gel film and heating the gel film with both ends being fixed; and step (C) of heating the film with both ends being released after step (B), wherein the thickness b of the film produced in step (B) and the thickness c of the film produced in step (C) satisfy the relationship: b>c.

Abstract: A novel organic insulating film, which is continuously manufactured and has specific properties over the entire width an adhesive film, a flexible metal plated stacked board, a multiplayer flexible metal-plated stacked board, a coverlay film, a tape for TAB, a base tape for COF are provided. The continuously manufactured organic insulating film satisfies the following requirements (1)-(3) over the entire width; (1) a film MOR-c value is 1.05 or more but not more than 5.0, (2) a molecular chain main axis orientation angle is ?30 to 30 degree against MD direction, and (3) a difference between the maximum and the minimum values of the film MOR-c is 1.0 or below.

Abstract: It is an object of the present invention to provide a stable process for continuously producing a synthetic resin film oriented in the machine direction across the full width. The present invention provides a process for producing a synthetic resin film including step (A) of casting and applying a composition containing a polymer and an organic solvent onto a support to form a gel film; step (B) of stripping the gel film and heating the gel film with both ends being fixed; and step (C) of heating the film with both ends being released after step (B), wherein the thickness b of the film produced in step (B) and the thickness c of the film produced in step (C) satisfy the relationship: b>c.

Abstract: A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.