Patents by Inventor Takaaki Miyamoto

Takaaki Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962184
    Abstract: In the production of a non-oriented electrical steel sheet by subjecting a steel slab having a certain component composition to a hot rolling, a hot-band annealing, a cold rolling and a finish annealing, the conditions of the finish annealing are controlled such that a yield stress of the steel sheet after the finish annealing is not less than 480 MPa. Also, when a motor core is produced by using the above steel sheet, there can be provided a non-oriented electrical steel sheet capable of producing a rotor core and a stator core as the same raw material where the stator core is subjected to a stress relief annealing at a soaking temperature of 780 to 950° C. in an atmosphere having a nitrogen content of not more than 30 vol % and a dew point of not higher than ?20° C., while a motor core is produced with such a steel sheet.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: April 16, 2024
    Assignee: JFE Steel Corporation
    Inventors: Yoshiaki Zaizen, Yoshihiko Oda, Tomoyuki Okubo, Takaaki Tanaka, Yukino Miyamoto
  • Publication number: 20230014575
    Abstract: A layout creation device is configured to include processing circuitry to acquire position data indicating an installation position of an electrical appliance installed in a space, and to create layout data indicating a layout of the electrical appliance for the space by giving the position data and usage condition data indicating a usage condition of the electrical appliance to a learning model.
    Type: Application
    Filed: September 21, 2022
    Publication date: January 19, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akiko TAKAHASHI, Fumie OTSUBO, Takaaki MIYAMOTO
  • Patent number: 11505577
    Abstract: The present application provides: a polypeptide characterized by having an ability of penetrating into a cell and the structure represented by Formula (I) wherein n is a number of 2 to 20; R1 and R2 may independently represent a C1-C4 alkyl group or may bind to each other to form a ring; R3 represents a C1-C10 primary aminoalkyl group; R4 represents a hydrogen atom or a C1-C10 hydrocarbon group; the “n” number of R1, R2, R3, and R4 may independently be the same with or different from each other; and the N-terminus and the C-terminus may or may not be modified independently; and a cell-invasive composition comprising the polypeptide and a substance of interest.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 22, 2022
    Assignee: RIKEN
    Inventors: Keiji Numata, Kosuke Tsuchiya, Yu Miyagi, Takaaki Miyamoto
  • Publication number: 20200347098
    Abstract: The present application provides: a polypeptide characterized by having an ability of penetrating into a cell and the structure represented by Formula (I) wherein n is a number of 2 to 20; R1 and R2 may independently represent a C1-C4 alkyl group or may bind to each other to form a ring; R3 represents a C1-C10 primary aminoalkyl group; R4 represents a hydrogen atom or a C1-C10 hydrocarbon group; the “n” number of R1, R2, R3, and R4 may independently be the same with or different from each other; and the N-terminus and the C-terminus may or may not be modified independently; and a cell-invasive composition comprising the polypeptide and a substance of interest.
    Type: Application
    Filed: March 27, 2020
    Publication date: November 5, 2020
    Applicant: RIKEN
    Inventors: Keiji NUMATA, Kosuke TSUCHIYA, Yu MIYAGI, Takaaki MIYAMOTO
  • Patent number: 7836598
    Abstract: To ensure satisfactory reliability even if the wiring pattern is formed of a wiring material having an enhanced electromigration resistance, by providing a protective layer for protecting heating elements from dry etching for forming a wiring pattern, on the ink chamber side or other liquid chamber side of each heating element.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: November 23, 2010
    Assignee: Sony Corporation
    Inventors: Takaaki Miyamoto, Minoru Kohno
  • Patent number: 7690768
    Abstract: A liquid ejecting head includes a plurality of liquid ejecting portions arrayed in a flat region on a substrate. The liquid ejecting portions each include a liquid chamber that accommodates liquid to be ejected, a heater element arranged in the liquid chamber, the heater element generating bubbles in liquid in the liquid chamber when heated, and a nozzle for ejecting liquid in the liquid chamber in accordance with generation of bubbles by the heater element.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: April 6, 2010
    Assignee: Sony Corporation
    Inventors: Takeo Eguchi, Shogo Ono, Takaaki Miyamoto, Kazuyasu Takenaka
  • Patent number: 7537311
    Abstract: In a method and an apparatus for ejecting liquid, the processing accuracy of an ejection unit for ejecting ink can be easily increased and the variations in the volume of ink drops, the ejection angle thereof, etc., can be reduced even when dust is mixed in ink. In addition, a reduction in an ink-supply speed at which ink is supplied to an ink ejection unit can be prevented. An ink ejection apparatus includes a plurality of heating units (13) provided on a base member (11), ink cells for pressurizing ink with energy generated by the heating units (13), and nozzles (17) having ejection holes for ejecting the ink which is pressurized in the ink cells. Each of the nozzles (17) is disposed above each of the heating units (13).
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: May 26, 2009
    Assignee: Sony Corporation
    Inventors: Takeo Eguchi, Masato Nakamura, Toru Tanikawa, Minoru Kohno, Koichi Igarashi, Manabu Tomita, Shogo Ono, Takaaki Miyamoto, Iwao Ushinohama
  • Publication number: 20090096841
    Abstract: A flow path structure includes a heating element, a barrier layer, a liquid chamber formed by a part of the barrier layer and a pair of walls confronting each other to hold the heating element therebetween and a first individual flow path and a second individual flow path disposed on both the sides of the liquid chamber to communicate with the liquid chamber, a liquid is supplied to the liquid chamber from at least one of first and second individual flow paths, and the distance U between the walls in the liquid chamber and the flow path width W of the first individual flow path are set to satisfy U>W. With this arrangement, a flow path structure can be provided in which a failure in flow paths due to dusts is unlike to occur and which minimizes the influence of bubbles and has almost no uneven ejection.
    Type: Application
    Filed: August 20, 2008
    Publication date: April 16, 2009
    Inventors: Takeo Eguchi, Takaaki Miyamoto, Manabu Tomita, Shogo Ono, Kazuyasu Takenaka, Iwao Ushinohama, Minoru Kohno
  • Publication number: 20090040280
    Abstract: A liquid ejecting head having at least one heat-energy evolving element constructed in a pattern with at least one bend and that evolves heat energy to eject liquid, conductors connected to the heat evolving element and to the bend and a nozzle through which liquid is ejected associated with each heat-energy evolving element.
    Type: Application
    Filed: May 27, 2008
    Publication date: February 12, 2009
    Applicant: Sony Corporation
    Inventors: Takeo Eguchi, Manabu Tomita, Minoru Kohno, Takaaki Miyamoto
  • Patent number: 7470004
    Abstract: A flow path structure includes a heating element, a barrier layer, a liquid chamber formed by a part of the barrier layer and a pair of walls confronting each other to hold the heating element therebetween and a first individual flow path and a second individual flow path disposed on both the sides of the liquid chamber to communicate with the liquid chamber, a liquid is supplied to the liquid chamber from at least one of first and second individual flow paths, and the distance U between the walls in the liquid chamber and the flow path width W of the first individual flow path are set to satisfy U>W. With this arrangement, a flow path structure can be provided in which a failure in flow paths due to dusts is unlike to occur and which minimizes the influence of bubbles and has almost no uneven ejection.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: December 30, 2008
    Assignee: Sony Corporation
    Inventors: Takeo Eguchi, Takaaki Miyamoto, Manabu Tomita, Shogo Ono, Kazuyasu Takenaka, Iwao Ushinohama, Minoru Kohno
  • Patent number: 7431430
    Abstract: A liquid ejecting head having a plurality of heat evolving elements formed on an integral substrate without being divided into more than one part, so that it is capable of controlling the direction of liquid ejection. The liquid ejecting head has heat-energy evolving elements (22) that evolve heat energy to eject liquid. The heat-energy evolving elements (22) are constructed of an integral substrate, assume a zigzag pattern (in plan view), and have conductors or electrodes (36) connected thereto at the turnaround part of the zigzag pattern, so that they are divided into main parts (22a, 22b) to evolve heat energy to eject liquid. Each of the heat-evolving elements has thereon a nozzle through which liquid is ejected.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: October 7, 2008
    Assignee: Sony Corporation
    Inventors: Takeo Eguchi, Manabu Tomita, Minoru Kohno, Takaaki Miyamoto
  • Patent number: 7410247
    Abstract: A liquid ejection head including at least one head chip including a plurality of heating elements on a surface of a substrate, a nozzle sheet having nozzles disposed on the respective heating elements, a barrier layer disposed between the head chip and the nozzle sheet, reservoirs disposed between the heating elements and the nozzle sheet, the reservoirs being defined by part of the barrier layer, a common flow path communicating with the reservoirs, and a liquid storage chamber disposed on at least one region of the surface of the substrate excluding a region on which the reservoirs are disposed, the liquid storage chamber being defined by part of the barrier layer and communicating with the common flow path and the reservoirs, the liquid storage chamber storing liquid such that part of the nozzle sheet is in contact with the liquid.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: August 12, 2008
    Assignee: Sony Corporation
    Inventors: Takeo Eguchi, Manabu Tomita, Kazuyasu Takenaka, Takaaki Miyamoto, Shogo Ono
  • Patent number: 7334878
    Abstract: A liquid ejection head includes a plurality of liquid ejection elements arrayed in a flat area on a substrate. Each liquid ejection element includes a liquid chamber, a heating element disposed in the liquid chamber, and a nozzle. The heating elements are disposed alternately on a first and second lines spaced by ? in a zigzag fashion. Each liquid chamber is formed to have a U-like shape in horizontal cross section such that a wall thereof surrounds three sides of a heating element disposed in each liquid chamber. A gap Wx is formed between each two adjacent liquid chambers located on the second line, and a gap Wy is formed between the liquid chambers located on the first line and the liquid chambers located on the second line. The gaps Wx serve as first common flow channels, and the gap Wy serves as a second common flow channel.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: February 26, 2008
    Assignee: Sony Corporation
    Inventors: Takeo Eguchi, Shogo Ono, Takaaki Miyamoto, Kazuyasu Takenaka
  • Patent number: 7261393
    Abstract: The present invention relates to a liquid jetting head, a liquid jetting apparatus, and a method of manufacturing the liquid jetting head. The invention can be particularly adopted to an ink jet printer of a thermal system. A treatment for building up a coating type insulating material film and a treatment for substantially removing the insulating material film in the forming regions of heating elements by etching are repeated at least a plurality of times, whereby deterioration of the heating elements can be prevented even in the case where generation of steps is prevented by an SOG film.
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: August 28, 2007
    Assignee: Sony Corporation
    Inventors: Takaaki Miyamoto, Minoru Kohno, Osamu Tateishi
  • Publication number: 20070188561
    Abstract: A liquid ejecting head includes a plurality of liquid ejecting portions arrayed in a flat region on a substrate. The liquid ejecting portions each include a liquid chamber that accommodates liquid to be ejected, a heater element arranged in the liquid chamber, the heater element generating bubbles in liquid in the liquid chamber when heated, and a nozzle for ejecting liquid in the liquid chamber in accordance with generation of bubbles by the heater element.
    Type: Application
    Filed: January 30, 2007
    Publication date: August 16, 2007
    Inventors: Takeo Eguchi, Shogo Ono, Takaaki Miyamoto, Kazuyasu Takenaka
  • Publication number: 20070153064
    Abstract: The present invention relates to a liquid jet head, a liquid jet apparatus, and a method of manufacturing a liquid jet head, and when applied, for example, to an ink jet printer based on the thermal system, the invention makes it possible to sufficiently secure the film thickness of a metal wiring layer concerning a wiring pattern and to reduce the parasitic resistance due to the metal wiring layer. According to the present invention, a wiring pattern 44 is formed by patterning conducted by use of dry etching, and the wiring pattern 44 is connected to heater elements 39 through contact portions 41 formed by use of openings provided in an insulating protective layer 40.
    Type: Application
    Filed: August 19, 2004
    Publication date: July 5, 2007
    Inventors: Takaaki Miyamoto, Minoru Kohno, Osamu Tateishi
  • Publication number: 20070153063
    Abstract: In a method and an apparatus for ejecting liquid, the processing accuracy of an ejection unit for ejecting ink can be easily increased and the variations in the volume of ink drops, the ejection angle thereof, etc., can be reduced even when dust is mixed in ink. In addition, a reduction in an ink-supply speed at which ink is supplied to an ink ejection unit can be prevented. An ink ejection apparatus includes a plurality of heating units (13) provided on a base member (11), ink cells for pressurizing ink with energy generated by the heating units (13), and nozzles (17) having ejection holes for ejecting the ink which is pressurized in the ink cells. Each of the nozzles (17) is disposed above each of the heating units (13).
    Type: Application
    Filed: December 18, 2006
    Publication date: July 5, 2007
    Inventors: Takeo Eguchi, Masato Nakamura, Toru Tanikawa, Minoru Kohno, Koichi Igarashi, Manabu Tomita, Shogo Ono, Takaaki Miyamoto, Iwao Ushinohama
  • Publication number: 20070058002
    Abstract: The present invention relates to a liquid jetting head, a liquid jetting apparatus, and a method of manufacturing the liquid jetting head. The invention can be particularly adopted to an ink jet printer of a thermal system. A treatment for building up a coating type insulating material film and a treatment for substantially removing the insulating material film in the forming regions of heating elements by etching are repeated at least a plurality of times, whereby deterioration of the heating elements can be prevented even in the case where generation of steps is prevented by an SOG film.
    Type: Application
    Filed: October 24, 2006
    Publication date: March 15, 2007
    Inventors: Takaaki Miyamoto, Minoru Kohno, Osamu Tateishi
  • Patent number: 7182440
    Abstract: To ensure satisfactory reliability even if the wiring pattern is formed of a wiring material having an enhanced electromigration resistance, by providing a protective layer for protecting heating elements from dry etching for forming a wiring pattern, on the ink chamber side or other liquid chamber side of each heating element.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: February 27, 2007
    Assignee: Sony Corporation
    Inventors: Takaaki Miyamoto, Minoru Kohno
  • Publication number: 20060243701
    Abstract: A liquid discharge head includes: a plurality of energy generating elements arranged in one direction on a substrate; a coating layer formed on the substrate and having formed therein a plurality of discharge ports opposed to the energy generating elements; and an individual passage formed on the substrate and extending in a direction orthogonal to a direction in which the energy generating elements are arranged. The coating layer on the individual passage has an opening formed therein.
    Type: Application
    Filed: April 18, 2006
    Publication date: November 2, 2006
    Inventors: Shogo Ono, Manabu Tomita, Koichi Igarashi, Takaaki Miyamoto