Abstract: An information processing device includes: a first acquisition unit configured to acquire position information of a mobile terminal; a second acquisition unit configured to acquire position information of a vehicle; a third acquisition unit configured to acquire movement means information of a holder of the mobile terminal; a determination unit configured to determine a likelihood of collision between the holder of the mobile terminal and the vehicle at a crossing based on a position of at least one crossing included in road information stored in a storage unit; and a notification unit configured to give a warning to at least one of the mobile terminal and a person in the vehicle based on a result of determination from the determination unit.

Abstract: An electric vehicle includes a wheel, an electric motor to drive the wheel, a battery to supply electric power to the electric motor, the battery including battery cells and a battery casing to house the battery cells, an onboard charger to charge the battery, the onboard charger being opposed to and spaced apart from an outer surface of the battery casing so that an air flow path exists between the onboard charger and the outer surface of the battery casing, and a cooling fan to generate a flow of air passing through the air flow path between the onboard charger and the battery casing.

Abstract: A semiconductor device is provided, the semiconductor device having: a semiconductor chip; a wiring substrate which supports the semiconductor chip and is electrically connected to the semiconductor chip; a first metal plate which supports the wiring substrate; a second metal plate which is arranged between the wiring substrate and the first metal plate; a first bonding part which bonds the wiring substrate and the second metal plate; and a second bonding part which bonds the first metal plate and the second metal plate, and having a thickness of an outer circumferential part of the second metal plate being larger than a thickness of a center part of the second metal plate.

Abstract: A semiconductor device is provided, the semiconductor device having: a semiconductor chip; a wiring substrate which supports the semiconductor chip and is electrically connected to the semiconductor chip; a first metal plate which supports the wiring substrate; a second metal plate which is arranged between the wiring substrate and the first metal plate; a first bonding part which bonds the wiring substrate and the second metal plate; and a second bonding part which bonds the first metal plate and the second metal plate, and having a thickness of an outer circumferential part of the second metal plate being larger than a thickness of a center part of the second metal plate.

Abstract: A power module includes: a ceramic substrate that includes a principal surface and a back surface, and is provided with a plurality of metal wirings on the principal surface; a semiconductor chip mounted on any metal wiring of the plurality of metal wirings; and a resin part disposed around each of the plurality of metal wirings. Further, side faces of the metal wirings each have: a first region in which a plating film is formed; a second region that is positioned above the first region and that is a non-plating region; and a third region that is positioned between the first region and the second region and in which metal particles are formed. The resin part is bonded to the metal particles, the plating film, and the principal surface of the ceramic substrate.

Abstract: A power module includes: a ceramic substrate that includes a principal surface and a back surface, and is provided with a plurality of metal wirings on the principal surface; a semiconductor chip mounted on any metal wiring of the plurality of metal wirings; and a resin part disposed around each of the plurality of metal wirings. Further, side faces of the metal wirings each have: a first region in which a plating film is formed; a second region that is positioned above the first region and that is a non-plating region; and a third region that is positioned between the first region and the second region and in which metal particles are formed. The resin part is bonded to the metal particles, the plating film, and the principal surface of the ceramic substrate.

Abstract: A semiconductor device 20 has: a semiconductor chip 1; a connected member 5 connected to the semiconductor chip 1 via a solder alloy (lead-free solder alloy) 2; and an external terminal electrically connected to the semiconductor chip 1. The above-described solder alloy 2 of the semiconductor device 20 is composed of: Cu of 5 to 10 weight %; any one, two, or more of Bi of 1 weight % or more and 4 weight % or less, Sb of 1 weight % or more and less than 10 weight %, and In of 1 weight % or more and 4 weight % or less; and Sn as a residual.

Abstract: A motorcycle prevents an increase in air resistance and prevents wind and mud from hitting a rider during travelling of the motorcycle. A side cover of the motorcycle includes a first side cover and a second side cover. The first side cover is disposed laterally outwards of a head pipe and a front fork. The second side cover is disposed laterally outwards of a portion of the first side cover. A lateral end of the second side cover is positioned laterally outwards of the first side cover. A rear edge of the first side cover is at least partially positioned rearwards of a rear edge of the second side cover.

Abstract: A motorcycle prevents an increase in air resistance and prevents wind and mud from hitting a rider during travelling of the motorcycle. A side cover of the motorcycle includes a first side cover and a second side cover. The first side cover is disposed laterally outwards of a head pipe and a front fork. The second side cover is disposed laterally outwards of a portion of the first side cover. A lateral end of the second side cover is positioned laterally outwards of the first side cover. A rear edge of the first side cover is at least partially positioned rearwards of a rear edge of the second side cover.

Abstract: Systems and techniques are described to provide a bulb insertion structure of a vehicular lamp which allows bulb replacement and accurate positioning of a bulb with respect to a reflector. In general, in one implementation, a bulb insertion structure of a vehicular lamp includes a plurality of fixing protrusions formed on an outer periphery of a rear end portion of a cylindrical socket fixture fixed in a bulb insertion hole of a reflector; a plurality of engaging protrusions formed on an outer periphery of a focus ring provided on a bulb and corresponding to the fixing protrusions; and a cup-shaped socket covering the outer periphery of the socket fixture from the rear, the socket incorporating a spring for pressing forward the rear end portion of the accommodated bulb, and having an outer peripheral wall provided with, at multiple locations corresponding to the fixing protrusions, an engaging notch (J-slot) for holding the engaging protrusion and the fixing protrusion overlapped together.

Abstract: In a vehicular lamp, a plurality of LED lines to which a plurality of LEDs are connected in series, are connected in parallel. The LEDs are arranged in a flat plane on a circuit board, the plurality of LEDs are arranged symmetrically with respect to a first centerline of the flat plane. Therefore, even when any one of the LEDs in the plurality of the LED lines becomes incapable of emitting light leading to all of the LEDs connected in series in the LED line to turn off, because the LEDs in the LED line are arranged symmetrically, the symmetrical balance of the LEDs shut down is maintained as an entire lamp, and the overall appearance of the lamp can be preserved.

Abstract: In a vehicular lamp, a plurality of LED lines to which a plurality of LEDs are connected in series, are connected in parallel. The LEDs are arranged in a flat plane on a circuit board, the plurality of LEDs are arranged symmetrically with respect to a first centerline of the flat plane. Therefore, even when any one of the LEDs in the plurality of the LED lines becomes incapable of emitting light leading to all of the LEDs connected in series in the LED line to turn off, because the LEDs in the LED line are arranged symmetrically, the symmetrical balance of the LEDs shut down is maintained as an entire lamp, and the overall appearance of the lamp can be preserved.

Abstract: Systems and techniques are described to provide a bulb insertion structure of a vehicular lamp which allows bulb replacement and accurate positioning of a bulb with respect to a reflector. In general, in one implementation, a bulb insertion structure of a vehicular lamp includes a plurality of fixing protrusions formed on an outer periphery of a rear end portion of a cylindrical socket fixture fixed in a bulb insertion hole of a reflector; a plurality of engaging protrusions formed on an outer periphery of a focus ring provided on a bulb and corresponding to the fixing protrusions; and a cup-shaped socket covering the outer periphery of the socket fixture from the rear, the socket incorporating a spring for pressing forward the rear end portion of the accommodated bulb, and having an outer peripheral wall provided with, at multiple locations corresponding to the fixing protrusions, an engaging notch (J-slot) for holding the engaging protrusion and the fixing protrusion overlapped together.

Abstract: An electrochromic display device comprising a transparent substrate and a counter substrate sealingly joined together to define a cell for accommodating an electrolyte, a transparent electroconductive layer on an inner surface of the transparent substrate, a display electrode layer overlaying the transparent electroconductive layer and a counter electrode layer deposited on an inner surface of the counter substrate is featured by the provision of a transparent insulating layer between the transparent substrate and the transparent electroconductive layer.

Abstract: An electrochromic display device comprises terminals formed on one of two substrates for connecting the electrochromic display device to a driver circuit, and one or more cut-off and lead-in electrodes each for connecting display segments to corresponding terminals. The cut-off and lead-in electrodes are adapted to have resistance values such that the results of a multiplication of each of the resistance values and the area of a corresponding one of the display segments are approximately constant as compared to remaining couples of the remaining display segments and corresponding lead-in electrodes. Each of the cut-off and lead-in electrodes has a cut-off portion not available for electrical interconnection. In another form of the present invention, the lead-in electrodes, regardless of whether or not the cut-off portion is present, are formed on a substantially entire surface of one of the two substrates so that gaps therebetween are not noticed by a visual scale.

Abstract: Liquid crystal material suitable for use in small display devices and consisting of one or more biphenyl or terphenyl compounds and one or more ester compounds, whereby low threshold voltage characteristics of one type of compound are complemented by the low viscosity and good response characteristics of the other type of compound, and liquid crystal material having good overall characteristics is achieved.

Abstract: A process for preparing a photosensitive material for electrostatic photography having an improved memory resistance, which comprises a photoconductive layer on an electrically conductive substrate, the photoconductive layer comprising (1) a finely divided inorganic photoconductor, (2) 5 to 50 parts by weight, per 100 parts by weight of the photoconductor of an electrically insulating organic synthetic resin binder having a specific resistance of at least 10.sup.14 ohm-cm, and (3) 0.001 to 1 % by weight, based on the photoconductor, of at least one photo-memory erasing compound selected from alkali metal dichromates, which process comprises forming the photoconductive layer by applying a coating composition to the electrically conductive substrate at a coating weight of 5 to 50 g/m.sup.