Patents by Inventor Takaaki Noudou

Takaaki Noudou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
    Patent number: 9676969
    Abstract: The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 13, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Takaaki Noudou, Maki Inada, Kyoko Kuroda
  • Etching material
    Patent number: 9550940
    Abstract: An etching material including at least one boron compound selected from a Lewis acid that includes, in its structure, boron and a halogen that is bonded to the boron, a salt of the Lewis acid and a compound that generates the Lewis acid.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: January 24, 2017
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hideo Nakako, Yasushi Kumashiro, Takaaki Noudou, Maki Inada, Kyoko Kuroda
  • ETCHING MATERIAL
    Publication number: 20150299568
    Abstract: An etching material including at least one boron compound selected from a Lewis acid that includes, in its structure, boron and a halogen that is bonded to the boron, a salt of the Lewis acid and a compound that generates the Lewis acid.
    Type: Application
    Filed: October 11, 2013
    Publication date: October 22, 2015
    Inventors: Hideo Nakako, Yasushi Kumashiro, Takaaki Noudou, Maki Inada, Kyoko Kuroda
  • COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE SAME, AND CONDUCTIVE ADHESIVE COMPOSITION
    Publication number: 20140242362
    Abstract: The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.
    Type: Application
    Filed: July 30, 2012
    Publication date: August 28, 2014
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Takaaki Noudou, Maki Inada, Kyoko Kuroda