Abstract: A method for manufacturing a light-emitting element includes: a preparation process including preparing a semiconductor stacked body that includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer, the first semiconductor layer including a semiconductor of a first conductivity type, the second semiconductor layer including a semiconductor of a second conductivity type; a first layer formation process including forming a first layer on the first semiconductor layer, the first layer being made of an insulating material; a removal process including removing a portion of the first semiconductor layer and a portion of the first layer; a processing process including introducing oxygen into a portion of the first semiconductor layer that includes a first surface formed in the removal process, the introducing being performed by, after the removal process, processing the semiconductor stacked body in an atmosphere including oxygen.

Abstract: A method for manufacturing a light-emitting element includes: a preparation process including preparing a semiconductor stacked body that includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer, the first semiconductor layer including a semiconductor of a first conductivity type, the second semiconductor layer including a semiconductor of a second conductivity type; a first layer formation process including forming a first layer on the first semiconductor layer, the first layer being made of an insulating material; a removal process including removing a portion of the first semiconductor layer and a portion of the first layer; a processing process including introducing oxygen into a portion of the first semiconductor layer that includes a first surface formed in the removal process, the introducing being performed by, after the removal process, processing the semiconductor stacked body in an atmosphere including oxygen.