Patents by Inventor Takaaki Ohsaki

Takaaki Ohsaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat pipe cooling arrangement for integrated circuit chips
    Patent number: 4327399
    Abstract: A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Integrated circuit elements, integrated circuits or integrated circuit devices are securely inserted in holes which are formed on the surface or the back of the substrate and which communicate with the cavity so that the wick on their backs is aligned with the wick on the inner surface of the cavity for directly cooling the integrated circuit elements, the integrated circuits or the integrated circuit devices.
    Type: Grant
    Filed: December 27, 1979
    Date of Patent: April 27, 1982
    Assignee: Nippon Telegraph & Telephone Public Corp.
    Inventors: Etsuro Sasaki, Takaaki Ohsaki