Abstract: This dummy substrate is for use in an inline reactive sputtering apparatus. The main unit thereof is made of a rectangular-plate-like frame structure in which an opening portion in a rectangular shape is formed in a metal plate in a similar shape. It is configured such that a contact portion of a carrier with the main unit is covered with the main unit. As a result, even while the sputtering apparatus is in operation, there is no possibility of the occurrence of undesirable situations such as glass cracking, making it possible to significantly increase the number of times the dummy substrate is used. Furthermore, the dummy substrate continues to cover the contact portion with the carrier. Thereby, it is possible to prevent deposition of a substance left in a sputter deposition chamber, especially a compound thin film, on the contact portion of the carrier with the substrate.

Abstract: A conveyor and a deposition apparatus, and a maintenance method thereof are disclosed. The conveyor includes a frame; a lower support mechanism for supporting a carrier on which is longitudinally mounted a substrate and for transferring the carrier; and an upper support mechanism for supporting the carrier, in which the frame comprises a lower frame and an upper frame, and in which the lower support mechanism is provided on the lower frame and the upper support mechanism is provided on the upper frame, the upper frame and the lower frame being configured to be separately movable. Therefore, with the rotational movement of the upper frame, it is possible to arrange a cathode member in a space formed above the lower frame. This can make the spacing between the deposition treatment passage and the carrier transfer passage small. As a result, it is possible to make an inner court of the deposition apparatus narrow.

Abstract: A supporting member, carrier and method of supporting are provided with a supporting member main body mounted to freely rotate. The supporting member main body is provided with a plurality of projections extending radially from a central rotation axis. Since the substrate is supported by abutment of the projections with an end of the substrate, the occurrence of cracking in the substrate can be prevented or the durability of the supporting member main body can be increased.

Abstract: To provide a vertical substrate transfer apparatus and a film-forming apparatus capable of, regardless of a carrying position of a substrate, subjecting either surface thereof to film-formation, and capable of supporting and carrying the substrate without interfering with a non-film-forming surface. A film-forming apparatus (1) according to the present invention includes a carrier (15) giving support so that either surface of a substrate (W) is processable, a first position changing section (3) changing a carrying position of the carrier (15), and a carrying chamber (9) housing the carrier, whose position is changed therein and which carries the carrier to a film-forming chamber (10). With the above construction, it becomes possible to subject either surface to film-forming processing regardless of the carrying position of the substrate (W). Further, it becomes possible to change a film-forming surface (Wa) in the course of carrying the substrate (W).

Abstract: In a sputtering film forming method of the invention, a magnetron cathode with a magnet arranged on a back surface side of a target is used, a substrate is transported in a first direction on a front surface side of the target, and the magnet is moved in reciprocating motion in the first direction and a second direction which is opposite to the first direction, thereby performing sputtering film formation on the substrate. Sputtering film formation is performed where a speed of the movement of the magnet in the first direction and a speed of the movement of the magnet in the second direction are different from each other.

Abstract: This dummy substrate is for use in an inline reactive sputtering apparatus. The main unit thereof is made of a rectangular-plate-like frame structure in which an opening portion in a rectangular shape is formed in a metal plate in a similar shape. It is configured such that a contact portion of a carrier with the main unit is covered with the main unit. As a result, even while the sputtering apparatus is in operation, there is no possibility of the occurrence of undesirable situations such as glass cracking, making it possible to significantly increase the number of times the dummy substrate is used. Furthermore, the dummy substrate continues to cover the contact portion with the carrier. Thereby, it is possible to prevent deposition of a substance left in a sputter deposition chamber, especially a compound thin film, on the contact portion of the carrier with the substrate.

Abstract: A conveyor and a deposition apparatus, and a maintenance method thereof are disclosed. The conveyor includes a frame; a lower support mechanism for supporting a carrier on which is longitudinally mounted a substrate and for transferring the carrier; and an upper support mechanism for supporting the carrier, in which the frame comprises a lower frame and an upper frame, and in which the lower support mechanism is provided on the lower frame and the upper support mechanism is provided on the upper frame, the upper frame and the lower frame being configured to be separately movable. Therefore, with the rotational movement of the upper frame, it is possible to arrange a cathode member in a space formed above the lower frame. This can make the spacing between the deposition treatment passage and the carrier transfer passage small. As a result, it is possible to make an inner court of the deposition apparatus narrow.

Abstract: A supporting member, carrier and method of supporting are provided with a supporting member main body mounted to freely rotate. The supporting member main body is provided with a plurality of projections extending radially from a central rotation axis. Since the substrate is supported by abutment of the projections with an end of the substrate, the occurrence of cracking in the substrate can be prevented or the durability of the supporting member main body can be increased.

Abstract: To provide a vertical substrate transfer apparatus and a film-forming apparatus capable of, regardless of a carrying position of a substrate, subjecting either surface thereof to film-formation, and capable of supporting and carrying the substrate without interfering with a non-film-forming surface. A film-forming apparatus (1) according to the present invention includes a carrier (15) giving support so that either surface of a substrate (W) is processable, a first position changing section (3) changing a carrying position of the carrier (15), and a carrying chamber (9) housing the carrier, whose position is changed therein and which carries the carrier to a film-forming chamber (10). With the above construction, it becomes possible to subject either surface to film-forming processing regardless of the carrying position of the substrate (W). Further, it becomes possible to change a film-forming surface (Wa) in the course of carrying the substrate (W).