Patents by Inventor Takaaki SOMEYA

Takaaki SOMEYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11434342
    Abstract: According to the present invention, provided is a foam molding resin containing low-density polyethylene, wherein a strain hardening degree of the low-density polyethylene is equal to or more than 0.40.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: September 6, 2022
    Inventors: Takaaki Someya, Takeru Sano
  • Publication number: 20210130563
    Abstract: According to the present invention, provided is a foam molding resin containing low-density polyethylene, wherein a strain hardening degree of the low-density polyethylene is equal to or more than 0.40.
    Type: Application
    Filed: August 23, 2018
    Publication date: May 6, 2021
    Applicant: KYORAKU CO., LTD.
    Inventors: Takaaki SOMEYA, Takeru SANO
  • Patent number: 10988592
    Abstract: It is an object of the present invention to provide a foam molding resin containing LDPE capable of enhancing foaming magnification. According to the present invention, there is provided a foam molding resin containing low-density polyethylene, wherein the low-density polyethylene has a melt tension of 100 to 250 mN and a shear viscosity of 350 to 450 Pa·s.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: April 27, 2021
    Assignee: KYORAKU CO., LTD.
    Inventors: Takaaki Someya, Takeru Sano
  • Patent number: 10988584
    Abstract: Provided is a resin for foam molding excellent in foam molding property and low-temperature impact resistance. According to the present invention, provided is a resin for foam molding including a component A, a component B and a component C. The component A is a long-chain branched homopolypropylene, the component B is a long-chain branched block polypropylene, the component C is a polyethylene-based elastomer, and when a total of the components A to C is 100 parts by mass, content of the component A is 20 to 70 parts by mass, content of the component B is 20 to 70 parts by mass, and content of the component C is 1 to 20 parts by mass.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 27, 2021
    Assignee: KYORAKU CO., LTD.
    Inventors: Takaaki Someya, Takeru Sano, Yoshinori Ono, Tadatoshi Tanji
  • Publication number: 20190276615
    Abstract: Provided is a resin for foam molding excellent in foam molding property and low-temperature impact resistance. According to the present invention, provided is a resin for foam molding including a component A, a component B and a component C. The component A is a long-chain branched homopolypropylene, the component B is a long-chain branched block polypropylene, the component C is a polyethylene-based elastomer, and when a total of the components A to C is 100 parts by mass, content of the component A is 20 to 70 parts by mass, content of the component B is 20 to 70 parts by mass, and content of the component C is 1 to 20 parts by mass.
    Type: Application
    Filed: October 27, 2017
    Publication date: September 12, 2019
    Applicant: KYORAKU CO., LTD.
    Inventors: Takaaki SOMEYA, Takeru SANO, Yoshinori ONO, Tadatoshi TANJI
  • Publication number: 20180215885
    Abstract: It is an object of the present invention to provide a foam molding resin containing LDPE capable of enhancing foaming magnification. According to the present invention, there is provided a foam molding resin containing low-density polyethylene, wherein the low-density polyethylene has a melt tension of 100 to 250 mN and a shear viscosity of 350 to 450 Pa·s.
    Type: Application
    Filed: August 16, 2016
    Publication date: August 2, 2018
    Applicant: KYORAKU CO., LTD.
    Inventors: Takaaki SOMEYA, Takeru SANO