Abstract: An electrode composition includes an electrode active material, a solid electrolyte, a solvent, and a dispersant. The dispersant includes a first dispersant and a second dispersant. The first dispersant includes at least one selected from the group consisting of phenols and an amino hydroxy compound. The second dispersant includes at least one selected from the group consisting of a nitrogen-containing compound and an alcohol.

Abstract: A solid electrolyte composition of the present disclosure includes a solvent and an ion conductor including a solid electrolyte, a binder, and a nitrogen-containing organic substance and being dispersed in the solvent. The solid electrolyte includes a sulfide solid electrolyte, the binder includes a styrenic elastomer, and the nitrogen-containing organic substance is represented by the following compositional formula (1). Where, R1 is a chain alkyl group having 7 or more and 21 or less carbon atoms or a chain alkenyl group having 7 or more and 21 or less carbon atoms, R2 is —CH2—, —CO—, or —NH(CH2)3—, and R3 and R4 are each independently a chain alkyl group having 1 or more and 22 or less carbon atoms, a chain alkenyl group having 2 or more and 22 or less carbon atoms, or hydrogen.

Abstract: A solid electrolyte composition of the present disclosure includes a solvent and an ion conductor including a solid electrolyte, a binder, and a nitrogen-containing organic substance and being dispersed in the solvent. The solid electrolyte includes a sulfide solid electrolyte, the binder includes a styrenic elastomer, and the nitrogen-containing organic substance includes at least one selected from the group consisting of primary amines, secondary amines, aminohydroxy compounds, and diamines. The primary amines, the secondary amines, the aminohydroxy compounds, and the diamines each have at least one selected from the group consisting of chain alkyl groups having 8 or more carbon atoms and chain alkenyl groups having 8 or more carbon atoms. The mass proportion of the nitrogen-containing organic substance to the solid electrolyte is 0.30 mass % or more.

Abstract: A solid electrolyte composition of an aspect according to the present disclosure includes a solvent and an ion conductor dispersed in the solvent. The ion conductor includes a solid electrolyte and a hydroxy group-containing organic compound. The hydroxy group-containing organic compound is an alcohol or a phenol and has a hydrocarbon portion having 15 or more and 30 or less carbon atoms.

Abstract: A method of producing an all-solid-state battery comprises preparing a second slurry which is a solid electrolyte slurry, and applying the second slurry to a foundation layer using a die head to form a solid electrolyte layer. A pressure P of the second slurry and a viscosity ? of the second slurry inside the die head at a predetermined shear rate satisfy a relationship of P/4?<4. The foundation layer has a porosity within a range of 30% to 50%.

Abstract: The electrode material in an aspect of the present disclosure includes an active material, a conductive fiber including a carbon material, and a binder including an elastomer. The elastomer is a hydrogenated product and includes a repeating unit having an aromatic ring. The content rate of the repeating unit in the elastomer is 15 mass % or more.

Abstract: A method of producing a slurry composition includes the following (a) to (c): (a) forming a binder solution by mixing a binder with a solvent; (b) filtering the binder solution to form a filtrate; and (c) producing a slurry composition by mixing the filtrate with a solid electrolyte.

Abstract: There is provided a negative electrode layer that is used in an all-solid state battery, containing lithium titanate and a sulfide solid electrolyte, in which a moisture amount contained in the lithium titanate is 25 ppm or more and 547 ppm or less.

Abstract: There is provided an electrode layer for an all-solid state battery, which contains an electrode active material and a sulfide solid electrolyte, where the sulfide solid electrolyte has an average particle diameter of less than 1 µm and the electrode layer contains an imidazoline-based dispersion material.

Abstract: A negative electrode layer that is used for an all-solid-state battery includes: lithium titanate; a sulfide solid electrolyte; and a rubber binder. The ratio of the amount A of the rubber binder adsorbed on the lithium titanate to the total content B of the rubber binder in the negative electrode layer is 1.35% or less.

Abstract: A battery includes a power-generating element having at least one unit cell including an electrode layer, a counter-electrode layer, and an electrolyte layer located between the electrode layer and the counter-electrode layer and an insulating member covering the power-generating element. The insulating member includes a first member that includes a first principal surface covering portion covering a first principal surface of the power-generating element and a second member, joined to the first member, that includes a second principal surface covering portion covering a second principal surface of the power-generating element opposite to the first principal surface. A junction between the first member and the second member overlaps a side surface of the power-generating element when seen from a direction perpendicular to the side surface. An elastic modulus of the first member is higher than an elastic modulus of the second member.

Abstract: A battery includes an electrode layer, a counter-electrode layer placed opposite to the electrode layer, and a solid electrolyte layer located between the electrode layer and the counter-electrode layer. The electrode layer includes a collector, an electrode active material layer located between the collector and the solid electrolyte layer, and an insulating layer located between the collector and the solid electrolyte layer and bonded to the collector at ends of the electrode layer. The electrode active material layer has a region that does not overlap the insulating layer in plan view. The battery has an air gap, the air gap being located between the collector and the solid electrolyte layer and being contact with the insulating layer.

Abstract: A reinforcement structure includes compound trusses placed horizontally symmetrically, and each compound truss is constituted by a first truss and a second truss. Each first truss has: a vertical side; a first inclined side extending obliquely downward from an upper end of the vertical side; and a second inclined side connecting between the vertical side and a lower end of the first inclined side. Each second truss shares the first inclined side with the first truss and has: a horizontal side extending horizontally from the upper end of the vertical side; and a second inclined side connecting between a tip end of the horizontal side and the lower end of the first inclined side. Each compound truss is coupled to the construction in a state where the vertical side is along an inner side surface of the construction and the horizontal side is along a ceiling surface of the construction.

Abstract: A reinforcement structure includes compound trusses placed horizontally symmetrically, and each compound truss is constituted by a first truss and a second truss. Each first truss has: a vertical side; a first inclined side extending obliquely downward from an upper end of the vertical side; and a second inclined side connecting between the vertical side and a lower end of the first inclined side. Each second truss shares the first inclined side with the first truss and has: a horizontal side extending horizontally from the upper end of the vertical side; and a second inclined side connecting between a tip end of the horizontal side and the lower end of the first inclined side. Each compound truss is coupled to the construction in a state where the vertical side is along an inner side surface of the construction and the horizontal side is along a ceiling surface of the construction.

Abstract: An object of the present disclosure is to provide a chip resistor capable of suppressing degradation of long-term reliability, and a method for producing the chip resistor. The chip resistor of the present disclosure includes resistance member formed of metal, and a pair of electrodes respectively formed on both ends of first main surface of resistance member. The chip resistor further includes first protective film formed on second main surface located on a rear side of first main surface of resistance member, second protective film formed on first main surface of resistance member and between the pair of electrodes, and a third protective film formed on a side surface parallel to a direction of a current flowing between the pair of electrodes of resistance member. The side surface of resistance member is provided with a protrusion that protrudes outward when viewed along the current flowing direction.

Abstract: A reinforcement structure includes compound trusses placed horizontally symmetrically, and each compound truss is constituted by a first truss and a second truss. Each first truss has: a vertical side; a first inclined side extending obliquely downward from an upper end of the vertical side; and a second inclined side connecting between the vertical side and a lower end of the first inclined side. Each second truss shares the first inclined side with the first truss and has: a horizontal side extending horizontally from the upper end of the vertical side; and a second inclined side connecting between a tip end of the horizontal side and the lower end of the first inclined side. Each compound truss is coupled to the construction in a state where the vertical side is along an inner side surface of the construction and the horizontal side is along a ceiling surface of the construction.

Abstract: An object of the present disclosure is to provide a chip resistor capable of suppressing degradation of long-term reliability, and a method for producing the chip resistor. The chip resistor of the present disclosure includes resistance member (11) formed of metal, and a pair of electrodes (12) respectively formed on both ends of first main surface (11a) of resistance member (11). The chip resistor further includes first protective film (13) formed on second main surface (11b) located on a rear side of first main surface (11a) of resistance member (11), second protective film (14) formed on first main surface (11a) of resistance member (11) and between the pair of electrodes (12), and a third protective film formed on a side surface parallel to a direction of a current flowing between the pair of electrodes (12) of resistance member (11). The side surface of resistance member (11) is provided with a protrusion that protrudes outward when viewed along the current flowing direction.

Abstract: A tin/copper alloy electroplating solution capable of forming a bright plating film in a wide electric current density range is provided. The electroplating solution is a cyanide-free aqueous solution containing an organosulfonic acid, divalent tin and copper salts, as metal salts, of the organosulfonic acid, a dispersant, and a brightener.

Abstract: A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin salt of metastannic acid and a trivalent indium salt of an organosulfonic acid, further adding a chelating agent, and adjusting the pH of the aqueous solution to a value of 7 to 11 with a caustic alkali.

Abstract: A hot-dip galvanized steel sheet having both high strength and good formability. A process for producing said hot-dip galvanized steel sheet without requiring additional steps of surface grinding and pre-plating. The hot-dip galvanized steel sheet is produced by forming a hot-dip galvanizing layer on a base cold-rolled steel sheet composed of C (0.02-0.20 mass %), Mn (1.50-2.40 mass %), Cr (0.03-1.50 mass %), Mo (0.03-1.50 mass %), 3Mn+6Cr+Mo (no more than 8.1 mass %), Mn+6Cr+10 Mo (no less than 3.5 mass %), Al (0.010-0.150 mass %), and Fe as the principal component, with Ti limited to 0.01 mass % or less, Si limited to 0.04 mass % or less, P limited to 0.060 mass % or less, and S limited to 0.030 mass % or less, and said base steel sheet having the composite microstructure composed mainly of ferrite and martensite.