Abstract: The present invention provides a spherical bearing with good endurance and high resistance to scratching on the convex spherical body of the inner retaining piece even when in long-term sliding contact with a polytetrafluoroethylene-based liner. A spherical bearing comprising an outer retaining piece forming a sliding surface in the form of a concave spherical surface having a polytetrafluoroethylene-based liner on the race inner peripheral surface is disclosed. An inner retaining piece of the spherical bearing is held by the outer retaining piece and has an outer peripheral surface in the form of a convex spherical surface that is in sliding contact with the sliding surface of the outer retaining piece. The convex spherical surface of the inner retaining piece has a uniform thin-film layer of a TiAlN compound.

Abstract: A bearing and a method for fabricating a bearing. The bearing is intended to be used in office automation equipment and the like is improved in impact resistance and load capacity. Its rotational accuracy will not deteriorate in long-term use and its quietness can be maintained over a long period of time. The bearing is an anti-friction bearing located between portions supporting a load and in relative motion to each other. The anti-friction bearing has an outer ring of 30 mm or less in diameter, in which high carbon chromium bearing steel constituting the anti-friction bearing includes the following compositions: C of 0.90-1.30 wt %, Si of 0.40-1.20 wt %, Mn of 0.90-1.0 wt %, and Cr of 0.90-1.70 wt %. After quenching, the tempering temperature used for this bearing is maintained in the range of 170° C. and 250° C. so that the amount of retained austenite in the surface layer after heat treatment is stabilized at 6 by volume or less.

Abstract: A spring-actuated electromagnetic brake includes an adjustment plate attached a rotating shaft and having an annular recess in one end face thereof facing a boss of a brake plate slidably mounted on the rotating plate. An annular elastic member is disposed in the annular recess in such a manner that when the brake is in the released state, the elastic member partially projects from the recess and is in contact with an end face of the boss. A slide-distance adjustment bolt having an enlarged head and a thread-free shank of a length larger than the thickness of the adjustment plate extends through an opening of the adjustment plate and is threaded on the end face of the boss. The brake plate is slidable in one direction by the force of the brake spring and in the opposite direction by the recovery force of the elastic member. The range of sliding movement of the brake plate is determined by the difference between the length of the shank of the bolt and the thickness of the adjustment plate.

Abstract: In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

Abstract: A board for installation in a liquid crystal panel with at least one slit at a portion thereof to be bent has a resin coating applied to a bridge portion of a conductive pattern formed over the slit. The resin coating resists external load applied during bending of the board. This board may be made by a method having the steps of punching a slit in the board corresponding to a position where the board is to be bent; forming a metal laminate on the board; forming a conductive pattern by etching the metal laminate; applying a resin coating capable of resisting an external load, which is applied during subsequent bending of the board, onto the conductive pattern across the slit; and curing the resin coating. The board is thereafter bent and installed in a liquid crystal panel.

Abstract: A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

Abstract: A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

Abstract: A method of spraying release agent on a semiconductor chip molding die. The die has a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, respectively, and a runner disposed between the pot and the cavities, for conducting the resin from the pot to the cavities. This method includes the steps of spraying at least the pot and the runner mentioned above with non-silicone release agent and selectively spraying only the cavities with silicone-based release agent.

Abstract: A tape carrier for semiconductor chips including an insulating tape; a plurality of first conductor patterns longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second lead connected with the other electrodes of the chip; a second conductor shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.