Abstract: In various embodiments, a light-emitting apparatus is disclosed. In one example, the light-emitting apparatus comprises a substrate, an LED string mounted on the substrate, in which LED string a plurality of LEDs are connected in series, a power supply path connected in series to the LED string, and a plurality of protection elements, each protection element having a first node commonly connected to the power supply path and a second node connected between a pair of the LEDs in the series, wherein the protection elements include capacitors or zener diodes, and an AC impedance of each protection element is smaller than an impedance between the pair of LEDs and a case ground.

Abstract: In various embodiments, a light-emitting apparatus is disclosed. In one example, the light-emitting apparatus comprises a substrate, an LED string mounted on the substrate, in which LED string a plurality of LEDs are connected in series, a power supply path connected in series to the LED string, and a plurality of protection elements, each protection element having a first node commonly connected to the power supply path and a second node connected between a pair of the LEDs in the series, wherein the protection elements include capacitors or zener diodes, and an AC impedance of each protection element is smaller than an impedance between the pair of LEDs and a case ground.

Abstract: A light-emitting apparatus including a substrate, an LED string mounted on the substrate, the LED string in which a plurality of light-emitting diodes D1-D6 are connected in series, a power supply line 13 (13a, 13b) connected in series to the LED string, and a plurality of protection capacitors C (C1-C5), each being arranged between a connection N (N1-N5) between at least one set of light-emitting diodes in the LED string and the power supply line 13 and having an impedance smaller than an impedance between the connection N and an case ground.

Abstract: A light-emitting apparatus including a substrate, an LED string mounted on the substrate, the LED string in which a plurality of light-emitting diodes D1-D6 are connected in series, a power supply line 13 (13a, 13b) connected in series to the LED string, and a plurality of protection capacitors C (C1-C5), each being arranged between a connection N (N1-N5) between at least one set of light-emitting diodes in the LED string and the power supply line 13 and having an impedance smaller than an impedance between the connection N and an earth.

Abstract: A backlight for a display includes a plurality of illumination modules, each illumination module including a light source and a reflective member. A portion of the reflective member is disposed over the light source. A liquid crystal display panel is disposed over the plurality of illumination modules. The reflective member is configured such that a majority of light from the light source is directed parallel to the liquid crystal display panel, to provide uniform illumination of the liquid crystal display panel. In some embodiments, the light source is at least one semiconductor light emitting diode.

Abstract: A backlight for a display includes a plurality of illumination modules, each illumination module including a light source and a reflective member. A portion of the reflective member is disposed over the light source. A liquid crystal display panel is disposed over the plurality of illumination modules. The reflective member is configured such that a majority of light from the light source is directed parallel to the liquid crystal display panel, to provide uniform illumination of the liquid crystal display panel. In some embodiments, the light source is at least one semiconductor light emitting diode.

Abstract: A light-emitting device comprises a substrate, electrical terminals disposed on a top side of the substrate, and a light-emitting semiconductor device disposed above the substrate. The light-emitting semiconductor device has a bottom side oriented to face toward the top side of the substrate. Electrodes are disposed on the bottom side of the light-emitting semiconductor device and electrically connected to the terminals on the substrate. A glass layer is arranged in a path of output light emitted by the light-emitting semiconductor device. The glass layer contains fluorescent material that converts at least a portion of the output light to converted light having a wavelength different from a wavelength of the output light. The fluorescent material may include SrS:Eu2+ that emits red light and (Sr, Ba, Ca)Ga2S4:Eu2+ that emits green light.

Abstract: A PWB (printed wiring board) 101 termed a “chip LED” is used instead of a lead frame. On the substrate is etched a lead 203 buried in the dielectric layer portion. Solder bumps 204 are formed on the PWB. SnPb, In, Au, Ag, or other materials may be used as solder. The gallium nitride semiconductor light-emitting element 102 is arranged this substrate—which includes the electrical wiring—and is connected with the leads thereof. Semiconductor light-emitting element 102 is arranged over bumps 204 and lead connections are made using the bumps, which are masses of metal situated in the electrode portions. Since the fluorescent material is sensitive to temperature, the production process is carried out at low temperature. The temperature is about 80° C. to 150° C. The fluorescent material is admixed into this glass sol-gel solution, which is then applied and heated to produce a glass body.

Abstract: A micro-probe that has little deformation and wear while maintaining a desired conductivity is composed of a cylindrical wear resistant material and a conductive material. The wear resistant material provides mechanical contact with a contact target, while the conductive material provides an electrical contact with the contact target. The invention thus provides an ultra-small micro-probe having a long useful life, and that experiences little deformation or wear while maintaining the desired conductivity.

Abstract: A small position detection and positioning device detects relative displacement between two members with high precision. A moving medium-type memory device using such positioning device is also provided. The position detection device includes a linear array of first electrodes at equal pitches on one of the two members that have relative displacement in at least one dimension, and a linear array of at least one second electrode on the other member. The first electrodes are positioned opposite the second electrodes and separated from them by a minute gap. The first electrodes are divided into a first electrode set composed of alternate ones of the first electrodes, and a second electrode set composed of alternate ones of the first electrodes not in the first electrode set. A signal source which applies a first alternating signal to the first electrode set and a second alternating signal that differs in phase by 180.degree.

Abstract: A position detection device that comprises a first substrate, a second substrate, an alternating current (AC) bridge comprised of four variable capacitors, and a detection circuit. The first and second substrates have a flat first electrode surface and a flat second electrode surface, respectively. The second substrate is mounted opposite the first substrate with the first electrode surface opposite the second electrode surface and separated from the second electrode surface by a minute gap. The second substrate and the first substrate are movable relative to one another in the plane of the electrode surfaces. Each of the variable capacitors is composed of a first capacitor electrode located on the first electrode surface and a second capacitor electrode located opposite the first capacitor electrode on the second electrode surface.