Patents by Inventor Takaaki Yoshioka

Takaaki Yoshioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10763797
    Abstract: A high-frequency power amplifier is configured to include plural island patterns (28) in which ends thereof are arranged in the vicinity of a transmission line (23) and other ends thereof are arranged in the vicinity of an end line (24a) in a transmission line (24), a wire (30) for connecting an end of an island pattern (28) and the transmission line (23), and a wire (31) for connecting another end of the island pattern (28) and the end line (24a) of the second transmission line (24), so that a mismatch of the impedance component having a resistance component and a reactance component can be compensated for by changing the number of first connecting members and the number of second connecting members, the first and second connecting members configured to connect an island pattern (28) to the transmission lines (23) and (24).
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: September 1, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki Yoshioka, Masatake Hangai, Koji Yamanaka
  • Patent number: 10615786
    Abstract: A comparator circuit according to the present disclosure includes a first switch section that selectively takes in a signal voltage, a second switch section that selectively takes in a control waveform, a differential amplifier including a non-inverted input end connected to each of output ends of the first switch section and the second switch section, a capacity section including one end connected to an inverted input end of the differential amplifier and the other end supplied with a reference voltage, and a third switch section that selectively short-circuits the inverted input end and an output end of the differential amplifier.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: April 7, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takaaki Sugiyama, Masaki Yoshioka, Ken Kikuchi, Masaru Chibashi, Ken Kitamura
  • Patent number: 10574197
    Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: February 25, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki Yoshioka, Shintaro Shinjo, Koji Yamanaka
  • Publication number: 20190296701
    Abstract: A wire (14) having a first end connected to a line (2) and a second end connected to a second end of a resistor (9) and having an inductive component La resonating with a parasitic capacitance Ca of the resistor (9), or a wire (16) having a first end connected to a line (3) and a second end connected to a second end of a resistor (12) and having an inductive component Lb resonating with a parasitic capacitance Cb of the resistor (12) are provided. Consequently, gain flatness in an operating frequency band can be improved.
    Type: Application
    Filed: December 19, 2016
    Publication date: September 26, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki YOSHIOKA, Masatake HANGAI, Koji YAMANAKA
  • Patent number: 10340855
    Abstract: A Wilkinson power divider includes: ?-type LPFs connected to an input terminal; a T-type HPF having one end connected to one of the ?-type LPFs and having another end connected to a carrier amplifier; another T-type HPF having one end connected to another one of the ?-type LPFs and having another end connected to a ?/4 line; and an isolation resistor connected to connection points.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: July 2, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuji Komatsuzaki, Shintaro Shinjo, Keigo Nakatani, Takaaki Yoshioka
  • Publication number: 20190131937
    Abstract: A high-frequency power amplifier is configured to include plural island patterns (28) in which ends thereof are arranged in the vicinity of a transmission line (23) and other ends thereof are arranged in the vicinity of an end line (24a) in a transmission line (24), a wire (30) for connecting an end of an island pattern (28) and the transmission line (23), and a wire (31) for connecting another end of the island pattern (28) and the end line (24a) of the second transmission line (24), so that a mismatch of the impedance component having a resistance component and a reactance component can be compensated for by changing the number of first connecting members and the number of second connecting members, the first and second connecting members configured to connect an island pattern (28) to the transmission lines (23) and (24).
    Type: Application
    Filed: May 19, 2016
    Publication date: May 2, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takaaki YOSHIOKA, Masatake HANGAI, Koji YAMANAKA
  • Publication number: 20180331664
    Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.
    Type: Application
    Filed: December 8, 2015
    Publication date: November 15, 2018
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki YOSHIOKA, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20180287566
    Abstract: A Wilkinson power divider includes: ?-type LPFs connected to an input terminal; a T-type HPF having one end connected to one of the ?-type LPFs and having another end connected to a carrier amplifier; another T-type HPF having one end connected to another one of the ?-type LPFs and having another end connected to a ?/4 line; and an isolation resistor connected to connection points.
    Type: Application
    Filed: January 5, 2016
    Publication date: October 4, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuji KOMATSUZAKI, Shintaro SHINJO, Keigo NAKATANI, Takaaki YOSHIOKA
  • Patent number: 9508787
    Abstract: Two rows of resistive bodies, first resistive body and second resistive body, having slits are provided on an input matching circuit substrate. Since a high-frequency signal flows through not only the resistive bodies but also a transmission line pattern formed in the slits, the burnout of the resistive bodies can be prevented.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: November 29, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventor: Takaaki Yoshioka
  • Patent number: 9484321
    Abstract: A high frequency device includes a base plate having a main surface, a dielectric on the main surface, along a first side of the base plate, a signal line on the dielectric and extending from the first side toward a central portion of the main surface, an island pattern of a metal on the dielectric, a metal frame having a contact portion contacting the main surface and a bridge portion on the signal line and the island pattern, together enclosing the central portion, a lead frame connected to an outside signal line of the signal line and which is located outside the metal frame, a semiconductor chip secured to the central portion, and a wire connecting the semiconductor chip to an inside signal line of the signal line and which is enclosed within the metal frame.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: November 1, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shinichi Miwa, Shohei Imai, Masaharu Hattori, Takaaki Yoshioka
  • Publication number: 20160218170
    Abstract: Two rows of resistive bodies, first resistive body and second resistive body, having slits are provided on an input matching circuit substrate. Since a high-frequency signal flows through not only the resistive bodies but also a transmission line pattern formed in the slits, the burnout of the resistive bodies can be prevented.
    Type: Application
    Filed: November 4, 2015
    Publication date: July 28, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Takaaki YOSHIOKA
  • Patent number: 9343380
    Abstract: A high-frequency power amplifier includes: a semiconductor substrate; transistor cells separated from each other and located on the semiconductor substrate; and testing electrodes respectively connected to individual transistor cells, wherein an electrical signal and power to individually operate each corresponding transistor cell are supplied to each transistor cell, independently, from outside, using the testing electrodes.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: May 17, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kunihiro Sato, Shin Chaki, Takashi Yamasaki, Takaaki Yoshioka
  • Publication number: 20150236649
    Abstract: A high-frequency power amplifier includes: a semiconductor substrate; transistor cells separated from each other and located on the semiconductor substrate; and testing electrodes respectively connected to individual transistor cells, wherein an electrical signal and power to individually operate each corresponding transistor cell are supplied to each transistor cell, independently, from outside, using the testing electrodes.
    Type: Application
    Filed: November 7, 2014
    Publication date: August 20, 2015
    Inventors: Kunihiro Sato, Shin Chaki, Takashi Yamasaki, Takaaki Yoshioka
  • Publication number: 20140146506
    Abstract: A high frequency device includes a base plate having a main surface, a dielectric on the main surface, along a first side of the base plate, a signal line on the dielectric and extending from the first side toward a central portion of the main surface, an island pattern of a metal on the dielectric, a metal frame having a contact portion contacting the main surface and a bridge portion on the signal line and the island pattern, together enclosing the central portion, a lead frame connected to an outside signal line of the signal line and which is located outside the metal frame, a semiconductor chip secured to the central portion, and a wire connecting the semiconductor chip to an inside signal line of the signal line and which is enclosed within the metal frame.
    Type: Application
    Filed: August 8, 2013
    Publication date: May 29, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shinichi Miwa, Shohei Imai, Masaharu Hattori, Takaaki Yoshioka