Patents by Inventor TAKABATAKE HIROSHI

TAKABATAKE HIROSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Co-extruded one-time-formed solar cell module backboard in three-layer structure
    Patent number: 10622501
    Abstract: The present invention discloses a co-extruded one-time-formed solar cell module backboard in a three-layer structure. The backboard is formed by co-extruding three layers: a middle layer located in the middle as well as an outer layer and an inner layer located at two sides of the middle layer, and has high water resisting capability, high reflective rate, good long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance and good recoverability and environmental protection performance. Compared with the prior art, the backboard has better water resisting ability, higher reflectivity, better long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance, better recoverability and environmental protection performance and lower cost. Compared with a backboard in a co-extruded structure in the prior art, the backboard of the present invention has better heat resistance, better dimensional stability and higher mechanical breaking strength.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: April 14, 2020
    Assignee: Cybrid Technologies Inc.
    Inventors: Hongye Chen, Lei Wang, Xiaoping Wu, Uno Keiichi, Takabatake Hiroshi
  • CO-EXTRUDED ONE-TIME-FORMED SOLAR CELL MODULE BACKBOARD IN THREE-LAYER STRUCTURE
    Publication number: 20190181284
    Abstract: The present invention discloses a co-extruded one-time-formed solar cell module backboard in a three-layer structure. The backboard is formed by co-extruding three layers: a middle layer located in the middle as well as an outer layer and an inner layer located at two sides of the middle layer, and has high water resisting capability, high reflective rate, good long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance and good recoverability and environmental protection performance. Compared with the prior art, the backboard has better water resisting ability, higher reflectivity, better long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance, better recoverability and environmental protection performance and lower cost. Compared with a backboard in a co-extruded structure in the prior art, the backboard of the present invention has better heat resistance, better dimensional stability and higher mechanical breaking strength.
    Type: Application
    Filed: November 9, 2016
    Publication date: June 13, 2019
    Inventors: Hongye CHEN, Lei WANG, Xiaoping WU, Uno KEIICHI, TAKABATAKE HIROSHI