Patents by Inventor Takabumi Omori

Takabumi Omori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
    Patent number: 7892651
    Abstract: A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: February 22, 2011
    Assignees: Mitsubishi Gas Chemical Company, Inc., PI R&D Co., Ltd.
    Inventors: Takabumi Omori, Mitsuru Nozaki, Eiji Nagata, Masashi Yano
  • Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
    Publication number: 20060054589
    Abstract: A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.
    Type: Application
    Filed: September 13, 2005
    Publication date: March 16, 2006
    Inventors: Takabumi Omori, Mitsuru Nozaki, Eiji Nagata, Masashi Yano
  • Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer board
    Publication number: 20040091688
    Abstract: A heat-resistant film base-material-inserted B-staged resin composition sheet obtainable by adhering a layer of a B-staged resin composition to a heat-resistant film base material, wherein the heat-resistant film base material is plasma-treated before adhering the B-staged resin composition layer, a multilayer board using the above heat-resistant film base-material-inserted B-staged resin composition sheet in a buildup layer and/or a bonding layer, and a manufacturing process of the multilayer board.
    Type: Application
    Filed: November 10, 2003
    Publication date: May 13, 2004
    Inventors: Morio Gaku, Nobuyuki Ikeguchi, Takabumi Omori
  • Photosensitive resin composition
    Patent number: 6680152
    Abstract: A photosensitive resin composition (C) containing a photosensitive resin (B) which is a reaction product produced by modifying an epoxy acrylate (a) with a cyanate ester compound (b) to obtain a modification product (A) and reacting the modification product (A) with a polybasic acid anhydride (c), and a compound (d) of the formula, in which each of n and m is an integer of at least 1, and a cured product of the photosensitive resin composition (C).
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: January 20, 2004
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Nobuyuki Ikeguchi, Takabumi Omori, Daisuke Ohno
  • Resist composition excellent in flame resistance
    Patent number: 6528552
    Abstract: A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: March 4, 2003
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Nobuyuki Ikeguchi, Takabumi Omori, Kenji Ishii, Toru Harada
  • Photosensitive resin composition
    Publication number: 20030017414
    Abstract: A photosensitive resin composition (C) containing a photosensitive resin (B) which is a reaction product produced by modifying an epoxy acrylate (a) with a cyanate ester compound (b) to obtain a modification product (A) and reacting the modification product (A) with a polybasic acid anhydride (c), and a compound (d) of the formula, 1
    Type: Application
    Filed: May 31, 2002
    Publication date: January 23, 2003
    Inventors: Kenji Ishii, Nobuyuki Ikeguchi, Takabumi Omori, Daisuke Ohno