Abstract: The method of forming a capacitor of a semiconductor device comprises the steps of forming a semiconductor film connected to a semiconductor substrate, forming a capacitor lower electrode made of a tungsten film selectively on a surface of the semiconductor film by causing a tungsten compound gas to react with the semiconductor film, forming a tungsten nitride film by nitriding a surface of the tungsten film by using a nitrogen gas or a nitrogen containing gas, forming a capacitor dielectric film made of oxygen compound on the tungsten nitride film, annealing the capacitor dielectric film in an oxygen containing gas, and forming a capacitor upper electrode made of a conductive film on the capacitor dielectric film.

Abstract: When a silicon-germanium mixed crystal layer is grown on a substrate by introducing a silicon source gas, a germanium source gas, a boron source gas, and a carbon source gas into a reaction chamber, the flow rate of the carbon source gas is set at 5 sccm or higher and the supply concentration of the carbon source gas is set as low as approximately 1.0% under the condition that the silicon-germanium mixed crystal layer is doped with carbon with a concentration of approximately 0.5%. As a result, carbon with a concentration required to inhibit the diffusion of boron is doped into the layer and the concentration of carbon becomes equal to or higher than the concentration of boron in a region at any given depth, so that the occurrence of a difference in doping depth between the dopings of carbon and boron into the silicon-germanium mixed crystal layer is prevented.

Abstract: A manufacturing method of a semiconductor device of the present invention comprises the steps of forming an amorphous layer on an upper layer of the impurity diffusion layer made of silicon by virtue of ion-implantation, forming a cobalt film on the impurity diffusion layer, forming a cobalt silicide layer made of Co.sub.2 Si or CoSi on an upper layer of the amorphous layer at a low temperature by reacting the cobalt film to silicon in the impurity diffusion layer in virtue of first annealing, then removing the cobalt film which has not reacted, and changing Co.sub.2 Si or CoSi constituting the cobalt silicide layer into CoSi.sub.2 to have low resistance and also rendering the cobalt silicide layer to enter into a depth identical to or deeper than an initial depth of the amorphous layer in virtue of second annealing.