Abstract: A fan-out wafer level package includes: (1) a flexible substrate; (2) a semiconductor component embedded in the flexible substrate, the semiconductor component including an active surface that is exposed from the flexible substrate, the semiconductor component including a bonding pad adjacent to the active surface; (3) a stress buffer layer disposed over the flexible substrate and the semiconductor component, the stress buffer layer defining an opening exposing the bonding pad of the semiconductor component; and (4) an interconnect disposed over the stress buffer layer and including a portion extending into the opening of the stress buffer layer to electrically connect to the bonding pad of the semiconductor component.

Abstract: A settlement terminal includes a card reader, a settlement processing unit including a processor programmed to carry out a settlement process using information acquired through the card reader and a tampering detection process, a storage device in which a first set of programs is stored after encryption by a first key and a second set of programs is stored after encryption by a second key, each set of programs including a first program for operating the card reader, and a second program for carrying out the settlement process. Upon detection of tampering, the processor of the settlement processing unit notifies an external terminal of the tampering and upon receiving an update instruction from the external terminal, updates a current set of programs used for operating the card reader and carrying out the settlement process from the first set to the second set.

Abstract: A liquid is supplied to a substrate and a chip component is arranged on the liquid. The substrate includes a first surface in which a rectangular mounting region is formed. The chip component includes a second surface having a rectangular shape which substantially coincides with the shape of the mounting region, and has an area substantially equal to that of the mounting region. The mounting region includes first and second regions. Wettability of the first region with respect to the liquid is higher than that of the second region with respect to the liquid. The first region is provided symmetrically with respect to a first central line passing through the middle of a pair of long sides and a second central line passing through the middle of a pair of short sides in the mounting region, and includes rectangular partial regions. The liquid is supplied to the first region.

Abstract: A passenger seat airbag includes a passenger side wall for catching a passenger, and a circumferential wall that extends forward from the passenger side wall in a converging fashion. The circumferential wall includes an upper wall, a lower wall, a left wall and a right wall, and is adapted to be mounted on a housing by the front end. An inlet port for introducing inflation gas is disposed at a front end region of the lower side wall, at a position displaced to the right from the center in a left and right direction of the passenger side wall. In the front end region of the circumferential wall, with respect to a substantial circumferential length which permits free expansion, a left circumferential wall region disposed on the left of the inlet port and a right circumferential wall region disposed on the right of the inlet port have equal substantial circumferential lengths.

Abstract: According to one embodiment, an electric power conversion system includes a convertor, a detector, a delay controller, and a deteminator. The detector is configured to detect information related to a voltage of electric power converted by the converter. The delay controller is configured to delay a conversion operation start of the converter by a first predetermined time with respect to a supply start time at which supply of the electric power is started. The determinator is configured to perform a first determination on the basis of a detection result detected by the detector before elapse of the first predetermined time from the supply start tune, and to perform a second determination on the basis of a detection result detected by the detector after the elapse of the first predetermined time from the supply start time.

Abstract: A control apparatus includes a first interface for communicating with a first device over a local area network and a second interface for communicating with a second device over a wide area network. A processor is configured to perform an authentication operation on first device after connection to the first interface. The processor receives a first data transmission addressed to the second device from the first device, and then controls the second interface to permit the first data transmission to be transmitted to the second device over the wide area network when the first device has been authenticated. The second interface is controlled to prevent the first data transmission from being transmitted to the second device when the first device has not been authenticated.

Abstract: To miniaturize metal columns. A semiconductor device includes a metal column (14) that extends in a stretching direction; a polymer layer (16) that surrounds the metal column from a direction crossing the stretching direction; and a guide (12) that surrounds the polymer layer in the crossing direction so as to be spaced from the metal column with the polymer layer interposed therebetween. A method for manufacturing semiconductor devices includes a step of filling a mixture (20) containing metal particles (22) and polymers (24) in a guide (12); and a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer (16) that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column (14) that stretches in a stretching direction of the guide from the metal particles.

Abstract: A voltage estimating device for a power supply line according to one aspect of the present disclosure includes a voltage detector, a current detector, a voltage calculator. The voltage calculator calculates a magnitude of alternating primary voltage that a primary winding in a transformer receives from a power supply line based on a magnitude of tertiary voltage in the transformer detected by the voltage detector, a magnitude of output current in the transformer detected by the current detector, and correlation information. The correlation information indicates a correlation between a voltage ratio and the magnitude of the output current, and the voltage ratio represents a ratio of the magnitude -of the primary voltage to the magnitude of the tertiary voltage.

Abstract: A semiconductor device includes a metal column that extends in a stretching direction; a polymer layer that surrounds the metal column from a direction crossing the stretching direction; and a guide that surrounds the polymer layer in the crossing direction so as to be spaced from the metal column with the polymer layer interposed therebetween. A method for manufacturing semiconductor devices includes a step of filling a mixture containing metal particles and polymers in a guide; and a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column that stretches in a stretching direction of the guide from the metal particles.

Abstract: A settlement terminal includes a card reader, a settlement processing unit including a processor programmed to carry out a settlement process using information acquired through the card reader and a tampering detection process, a storage device in which a first set of programs is stored after encryption by a first key and a second set of programs is stored after encryption by a second key, each set of programs including a first program for operating the card reader, and a second program for carrying out the settlement process. Upon detection of tampering, the processor of the settlement processing unit notifies an external terminal of the tampering and upon receiving an update instruction from the external terminal, updates a current set of programs used for operating the card reader and carrying out the settlement process from the first set to the second set.

Abstract: A power conversion system includes a transformer, a power conversion device for travel, a power conversion device for auxiliary power sources, an electrical storage device, and an auxiliary device. The power conversion device for travel converts AC power into power for travel and supplies it to a travel motor. The power conversion device for auxiliary power sources includes an AC to DC conversion unit which converts AC power into DC power, a power conversion unit for AC loads which converts the DC power into AC power and supplies it to an AC load, and a power conversion unit for DC loads which converts DC power to DC power and supplies it to a DC load. The electrical storage device is connected to power lines connecting DC power output terminals of the AC to DC conversion unit and DC power input terminals of both the power conversion units for AC and DC loads.

Abstract: A power conversion system includes a transformer, a power conversion device for travel, a power conversion device for auxiliary power sources, and an electrical storage device. The power conversion device for auxiliary power sources includes a first AC to DC conversion unit, a power conversion unit for AC loads, and a power conversion unit for DC loads. The power conversion unit for AC loads converts DC power into AC power and supplies it to an AC load. The power conversion unit for DC loads converts DC power produced through conversion by the first AC to DC conversion unit into DC power and supplies it to a DC load. The electrical storage device is connected to power lines connecting DC power output terminals of the first AC to DC conversion unit and DC power input terminals of both the power conversion units for AC and DC loads.

Abstract: A power conversion system includes an AC to DC conversion circuit, a voltage detector, a step-down chopper circuit, a power conversion device for auxiliary power sources, and a control unit. The AC to DC conversion circuit converts AC power supplied from overhead wires via a transformer into DC power. The voltage detector detects a voltage of AC power supplied from the transformer. The step-down chopper circuit steps down the voltage of DC power produced through conversion by the AC to DC conversion circuit. The power conversion device for auxiliary power sources converts the DC power stepped down by the step-down chopper circuit into power for driving loads mounted in an electric vehicle and supplies it to the loads. The control unit controls the AC to DC conversion circuit and the step-down chopper circuit such that the voltage of AC power detected by the voltage detector approaches a reference voltage.

Abstract: There is provided an information input and output apparatus including a screen control unit that generates a screen which includes at least one region to input or output information, as a window, a display attribute storage unit that stores a display and a non-display of each of the windows on the screen, and a position and a size of each of the windows when the windows are displayed on the screen, as a display attribute for each window, a display unit that displays the screen generated by the screen control unit, and a contact position detecting unit that is disposed along a display surface of the display unit, and outputs a coordinate for each contact position to the screen control unit when contacts are simultaneously detected at a plurality of positions.

Abstract: To miniaturize metal columns. A semiconductor device includes a metal column (14) that extends in a stretching direction; a polymer layer (16) that surrounds the metal column from a direction crossing the stretching direction; and a guide (12) that surrounds the polymer layer in the crossing direction so as to be spaced from the metal column with the polymer layer interposed therebetween. A method for manufacturing semiconductor devices includes a step of filling a mixture (20) containing metal particles (22) and polymers (24) in a guide (12); and a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer (16) that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column (14) that stretches in a stretching direction of the guide from the metal particles.

Abstract: The present invention relates to a chip support substrate including a lyophilic region 4 that is formed on the substrate and that absorbs a chip 3A, and an electrode 6 that is formed on the substrate and in the lyophilic region and that generates electrostatic force in the chip, and to a chip support method including the steps of arranging the chip onto the lyophilic region of the chip support substrate with a liquid 15, the chip support substrate comprising the lyophilic region that is formed on the substrate, and the electrode that is formed on the substrate and in the lyophilic region, and generating the electrostatic force in the chip corresponding to the electrode by applying a voltage to the electrode.

Abstract: The present invention relates to a chip support substrate including a lyophilic region 4 that is formed on the substrate and that absorbs a chip 3A, and an electrode 6 that is formed on the substrate and in the lyophilic region and that generates electrostatic force in the chip, and to a chip support method including the steps of arranging the chip onto the lyophilic region of the chip support substrate with a liquid 15, the chip support substrate comprising the lyophilic region that is formed on the substrate, and the electrode that is formed on the substrate and in the lyophilic region, and generating the electrostatic force in the chip corresponding to the electrode by applying a voltage to the electrode.

Abstract: There is provided an information input and output apparatus including a screen control unit that generates a screen which includes at least one region to input or output information, as a window, a display attribute storage unit that stores a display and a non-display of each of the windows on the screen, and a position and a size of each of the windows when the windows are displayed on the screen, as a display attribute for each window, a display unit that displays the screen generated by the screen control unit, and a contact position detecting unit that is disposed along a display surface of the display unit, and outputs a coordinate for each contact position to the screen control unit when contacts are simultaneously detected at a plurality of positions.

Abstract: A device is provided with a reader/writer that wirelessly communicates with an RFID module in a con-contact manner that resides within a wireless communications area of the device, and an optical transmitter transmitting a signal receivable by the RFID module in an area in the vicinity of the device within the wireless communication area of the device, the signal receivable area being narrower than the wireless communication area. The device determines whether an ID of an RFID currently performing wireless-communication is stored in its storage as an authorized ID, or not. The optical transmitter initiates signal transmission on the condition of the determination that the corresponding ID is stored. Upon receipt of the signal from the optical transmitter by a photoreceptor, the RFID module wirelessly transmits an authentication request signal to the device.

Abstract: There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.