Patents by Inventor Takafumi FURUKAWA

Takafumi FURUKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250100060
    Abstract: A compressor-mounted engine generator/welder includes: an engine; a generator driven by the engine; a compressor configured to obtain compressed air; a first housing configured to accommodate the engine and the generator; and a second housing configured to accommodate the compressor. The first housing includes a coupling space to removably couple the second housing.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Inventors: Akinobu KIMURA, Toru FURUKAWA, Takafumi FUROKAWA
  • Publication number: 20160013163
    Abstract: An improvement is achieved in the performance of an electronic device. A first semiconductor device and a second semiconductor device are mounted over the upper surface of a wiring board such that, e.g., in plan view, the orientation of the second semiconductor device intersects the orientation of the first semiconductor device. That is, the first semiconductor device is mounted over the upper surface of the wiring board such that a first emitter terminal and a first signal terminal are arranged along an x-direction in which the pair of shorter sides of the wiring board extend. On the other hand, the second semiconductor device is mounted over the upper surface of the wiring board such that a second emitter terminal and a second signal terminal are arranged along a y-direction in which the pair of longer sides of the wiring board extend.
    Type: Application
    Filed: September 22, 2015
    Publication date: January 14, 2016
    Inventors: Akira Muto, Takafumi Furukawa
  • Patent number: 9153563
    Abstract: An improvement is achieved in the performance of an electronic device. A first semiconductor device and a second semiconductor device are mounted over the upper surface of a wiring board such that, e.g., in plan view, the orientation of the second semiconductor device intersects the orientation of the first semiconductor device. That is, the first semiconductor device is mounted over the upper surface of the wiring board such that a first emitter terminal and a first signal terminal are arranged along an x-direction in which the pair of shorter sides of the wiring board extend. On the other hand, the second semiconductor device is mounted over the upper surface of the wiring board such that a second emitter terminal and a second signal terminal are arranged along a y-direction in which the pair of longer sides of the wiring board extend.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: October 6, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Akira Muto, Takafumi Furukawa
  • Publication number: 20150060940
    Abstract: An improvement is achieved in the performance of an electronic device. A first semiconductor device and a second semiconductor device are mounted over the upper surface of a wiring board such that, e.g., in plan view, the orientation of the second semiconductor device intersects the orientation of the first semiconductor device. That is, the first semiconductor device is mounted over the upper surface of the wiring board such that a first emitter terminal and a first signal terminal are arranged along an x-direction in which the pair of shorter sides of the wiring board extend. On the other hand, the second semiconductor device is mounted over the upper surface of the wiring board such that a second emitter terminal and a second signal terminal are arranged along a y-direction in which the pair of longer sides of the wiring board extend.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 5, 2015
    Inventors: Akira MUTO, Takafumi FURUKAWA