Patents by Inventor Takafumi Hatakeda

Takafumi Hatakeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11878363
    Abstract: It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1): 0<(?L1/?L2)/T?38??(1) wherein ?L1 (mm) represents an elongation amount of the first metal layer with respect to the first metal plate; ?L2 (mm) represents an elongation amount of the second metal layer with respect to the second metal plate; and T (mm) represents the total thickness of the roll-bonded laminate.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: January 23, 2024
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Takafumi Hatakeda, Yusuke Hashimoto, Teppei Kurokawa
  • Patent number: 11840045
    Abstract: This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200?0.0057PSUS+0.4.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: December 12, 2023
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Yusuke Hashimoto, Kota Sadaki, Teppei Kurokawa, Takashi Koshiro, Takafumi Hatakeda
  • Patent number: 11691386
    Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: July 4, 2023
    Assignee: TOYO KOHAN CO., LTD.
    Inventors: Kota Sadaki, Takashi Koshiro, Takafumi Hatakeda
  • Patent number: 11453203
    Abstract: This invention provides a metal laminate that maintains functionality such as radiation performance and is excellent in dimensional accuracy after press work. Such metal laminate is a roll-bonded laminate composed of 2 or more metal layers, which exhibits a ratio ?/T of the standard deviation ? of thickness T1 of the outermost layer to thickness T of the roll-bonded laminate of 0% of 4.0%, the thickness T of 2 mm or less, and the deviation of the thickness T of 4.0% or less.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: September 27, 2022
    Inventors: Kota Sadaki, Teppei Kurokawa, Yusuke Hashimoto, Takafumi Hatakeda
  • Publication number: 20220184923
    Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 16, 2022
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kota Sadaki, Takashi Koshiro, Takafumi Hatakeda
  • Patent number: 11305512
    Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 19, 2022
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Kota Sadaki, Takashi Koshiro, Takafumi Hatakeda
  • Publication number: 20210114347
    Abstract: This invention provides a roll-bonded laminate for an electronic device that exhibits high rigidity and a high elastic modulus and is suitable for housing applications. More specifically, this invention concerns a roll-bonded laminate for an electronic device composed of a stainless steel layer and an aluminum alloy layer, wherein thickness TAl (mm) and surface hardness HAl (HV) of the aluminum alloy layer and thickness TSUS (mm) and surface hardness HSUS (HV) of the stainless steel layer satisfy the correlation represented by Formula (1): HSUSTSUS2?(34.96+0.03×(HAlTAl2)2?3.57×HAlTAl2)/(?0.008×(HAlTAl2)2+0.061×HAlTAl2+1.354). This invention also concerns an electronic device housing.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 22, 2021
    Applicant: TOYO KOHAN CO., LTD.
    Inventors: Kota SADAKI, Teppei KUROKAWA, Yusuke HASHIMOTO, Takafumi HATAKEDA, Takashi KOSHIRO
  • Publication number: 20210107254
    Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 15, 2021
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kota Sadaki, Takashi Koshiro, Takafumi Hatakeda
  • Publication number: 20210101364
    Abstract: This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200?0.0057PSUS+0.4.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 8, 2021
    Applicant: TOYO KOHAN CO., LTD
    Inventors: Yusuke HASHIMOTO, Kota SADAKI, Teppei KUROKAWA, Takashi KOSHIRO, Takafumi HATAKEDA
  • Publication number: 20210023648
    Abstract: It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1): 0<(?L1/?L2)/T?38??(1) wherein ?L1 (mm) represents an elongation amount of the first metal layer with respect to the first metal plate; ?L2 (mm) represents an elongation amount of the second metal layer with respect to the second metal plate; and T (mm) represents the total thickness of the roll-bonded laminate.
    Type: Application
    Filed: April 1, 2019
    Publication date: January 28, 2021
    Applicant: TOYO KOHAN CO., LTD
    Inventors: Takafumi HATAKEDA, Yusuke HASHIMOTO, Teppei KUROKAWA
  • Publication number: 20200031096
    Abstract: This invention provides a metal laminate that maintains functionality such as radiation performance and is excellent in dimensional accuracy after press work. Such metal laminate is a roll-bonded laminate composed of 2 or more metal layers, which exhibits a ratio ?/T of the standard deviation ? of thickness T1 of the outermost layer to thickness T of the roll-bonded laminate of 0% of 4.0%, the thickness T of 2 mm or less, and the deviation of the thickness T of 4.0% or less.
    Type: Application
    Filed: February 7, 2018
    Publication date: January 30, 2020
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kota Sadaki, Teppei Kurokawa, Yusuke Hashimoto, Takafumi Hatakeda