Patents by Inventor Takafumi Hirano
Takafumi Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240141490Abstract: There is provided a technique that includes (a) a process chamber configured to accommodate a plurality of substrates arranged vertically, provided with a product region and a dummy region and including a main exhauster on a lateral side thereof, (b) a first injector extending vertically within the process chamber on an opposite side from the main exhauster, and configured to supply a first precursor toward the substrates accommodated in the product region and the dummy region, (c) at least one selected from the group of a second injector and a third injector, wherein the second injector supplies an assist gas for diluting the first precursor toward substrates and the third injector supplies an inert gas toward the substrates accommodated in the product region and the substrates accommodated in the dummy region; and (d) a fourth injector configured to supply an inert gas only to the dummy region.Type: ApplicationFiled: September 20, 2023Publication date: May 2, 2024Applicant: Kokusai Electric CorporationInventors: Mika Urushihara, Atsushi Hirano, Takafumi Sasaki
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Publication number: 20240137128Abstract: An optical transmission system including an optical transmission device and an optical reception device that receives, via an optical transmission line, a signal transmitted from the optical transmission device, the optical transmission system including a transmission-mode selection unit that selects transmission mode information in descending order of priority out of transmission mode information, which is combinations of a plurality of parameters concerning transmission performance, the transmission mode information being a plurality of kinds of the transmission mode information common to the transmission performance of the optical transmission device and the optical reception device, a signal transmission unit that transmits, to the optical reception device, a signal modulated based on the selected transmission mode information, and a signal reception unit that receives the signal and modulates the received signal based on the transmission mode information selected by the transmission-mode selection unit.Type: ApplicationFiled: December 21, 2022Publication date: April 25, 2024Inventors: Tetsuro Inui, Hideki Nishizawa, Seiji Okamoto, Akira Hirano, Shokei Kobayashi, Fumikazu Inuzuka, Seiki Kuwabara, Takafumi Tanaka, Kei Kitamura, Takuya Oda
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Publication number: 20240084339Abstract: An object of the present invention is to provide a culture device capable of accurately detecting the gas-liquid interface of a culture solution in a fermenter. The above problem is solved by provided a culture device that includes: a liquid surface sensor for detecting a foam layer height from the bottom of the fermenter to the top of a foam layer; and a pressure sensor for detecting a liquid surface height from the bottom of the fermenter to a gas-liquid interface, the culture device having installed at least two pressure sensors below the gas-liquid interface, the at least two pressure sensors each being the pressure sensor.Type: ApplicationFiled: January 20, 2022Publication date: March 14, 2024Applicant: KANEKA CORPORATIONInventors: Takafumi IGARI, Takahisa KATO, Masaru HIRANO
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Publication number: 20240079103Abstract: An information processing device (40) according to one embodiment of the present disclosure includes: an analysis unit (41) being a first data generation unit that generates objective score data, which indicates objective scores in time series, based on a plurality of pieces of objective data regarding a patient; a processing unit (42) being a second data generation unit that generates subjective score data, which indicates subjective scores in time series, based on a plurality of pieces of subjective data obtained from the patient; and a generation unit (44) being an image generation unit that generates a score image indicating the objective score data and the subjective score data.Type: ApplicationFiled: December 23, 2021Publication date: March 7, 2024Inventors: RITSUKO KANO, EIJIRO MORI, SHINSUKE NOGUCHI, KAZUMI HIRANO, TAKAFUMI YANAGIMOTO, KOJI SATO, HIROSHI HARA
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Publication number: 20220108978Abstract: The present invention comprises a plurality of repair devices (3) that are arranged on a support film (2), each of which has a repair element in an opening (7) that is surrounded by a light shielding wall (6) for repairing a defective pixel (21) on a full-color LED display panel.Type: ApplicationFiled: July 29, 2019Publication date: April 7, 2022Applicant: V Technology Co., Ltd.Inventors: Koichi Kajiyama, Takafumi Hirano, Yoshikatsu Yanagawa
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Publication number: 20210151354Abstract: A semiconductor device can be transferred onto a circuit board with high accuracy, and a man-hour and a facility load in a process of peeling off the semiconductor device from a sapphire substrate are reduced. A semiconductor-device-formed sapphire substrate in which gallium-nitride-based semiconductor devices are arrayed and formed on a sapphire substrate includes a nitrogen-gallium re-fusion layer A at an interface between the sapphire substrate and the semiconductor devices. An adhesive strength of the nitrogen-gallium re-fusion layer is smaller than an adhesive strength of an adhesive layer for bonding the semiconductor devices to a circuit board.Type: ApplicationFiled: April 16, 2019Publication date: May 20, 2021Applicant: V TECHNOLOGY CO., LTD.Inventors: Yoshikatsu YANAGAWA, Takafumi HIRANO, Koichiro FUKAYA
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Publication number: 20210119098Abstract: A substrate mounting method of an electronic component on a wiring substrate includes steps of patterning to form a conductive elastic protrusion on an electrode pad provided on the wiring substrate to correspond to a contact point of the electronic component, forming an adhesive layer made of a photosensitive thermosetting resin on the wiring substrate, lowering viscosity of the adhesive layer by heating the adhesive layer to a first temperature zone, electrically connecting the contact point of the electronic component to the electrode pad on the wiring substrate through the conductive elastic protrusion, under a state where the viscosity of the adhesive layer is lowered, by pressing the electronic component after the electronic component is positioned on the wiring substrate, and fixing the electronic component onto the wiring substrate by heating the adhesive layer to a second temperature zone higher than the first temperature zone to cure the adhesive layer.Type: ApplicationFiled: May 29, 2019Publication date: April 22, 2021Applicant: V TECHNOLOGY CO., LTD.Inventors: Koichi KAJIYAMA, Koichiro FUKAYA, Takafumi HIRANO, Yoshikatsu YANAGAWA
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Publication number: 20200411588Abstract: The present invention is a full-color LED display panel including: an LED array substrate 1 in which multiple LEDs 4 are arranged in a matrix form on a wiring board 5, each LED 4 emitting light in an ultraviolet or blue wavelength band; multiple fluorescent layers 2 configured to perform wavelength conversion by being excited by excitation light emitted from a corresponding LED 4 and by emitting fluorescence of a corresponding color, each fluorescent layer 2 being formed in an island pattern, on at least one corresponding LED 4 for red, green, or blue color, and being made of a fluorescent resist containing a fluorescent colorant uniformly dispersed in a photosensitive resin; and a light shielding member 3 that reflects or absorbs excitation light and fluorescence, and is deposited on a peripheral face 2b of each fluorescent layer 2, which is other than a light emitting surface 2a.Type: ApplicationFiled: July 16, 2020Publication date: December 31, 2020Applicant: V Technology Co., Ltd.Inventors: Koichi Kajiyama, Takafumi Hirano
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Publication number: 20200373350Abstract: A full-color LED display panel includes an LED array substrate 1 in which multiple LEDs 4 are arranged in a matrix form on a wiring board 5, each LED 4 emitting light in an ultraviolet or blue wavelength band; multiple fluorescent layers 2 configured to perform wavelength conversion by being excited by excitation light EL emitted from a corresponding LED 4 and by emitting fluorescence FL of a corresponding color, each fluorescent layer 2 being provided on at least one corresponding LED 4 for red, green, or blue color, and containing, in a dispersed manner, a fluorescent colorant 14 and an adjustment colorant 15 that selectively transmits light in a predetermined wavelength band; and a light shielding member 3 that reflects or absorbs excitation light EL and fluorescence FL, and is provided between the fluorescent layers 2.Type: ApplicationFiled: August 14, 2020Publication date: November 26, 2020Applicant: V Technology Co., Ltd.Inventors: Koichi Kajiyama, Yoshikazu Suzuki, Takafumi Hirano
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Publication number: 20200295224Abstract: The present invention relates to a manufacturing method for an LED display panel including an LED array substrate 1 on which multiple LEDs 4 are arranged in a matrix form, and light shielding walls 3 formed on the LED array substrate 1 and surrounding the LEDs 4. The light shielding walls 3 are formed by exposing and developing a transparent photosensitive resin 16 by photolithography, to form partition walls 7, each serving as a base material of a light shielding wall 3, and then, by forming, on a surface of each partition wall 7, a thin film 8 that reflects or absorbs light emitted from an LED 4.Type: ApplicationFiled: June 2, 2020Publication date: September 17, 2020Inventors: Yoshikatsu YANAGAWA, Takafumi HIRANO
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Publication number: 20200098952Abstract: The present invention includes: an LED array substrate 1 in which multiple LEDs 3 are arranged in a matrix pattern on a substrate, each of the multiple LEDs emitting light in an ultraviolet to blue wavelength band; multiple fluorescent layers 5 arranged side by side above the multiple LEDs 3 in a manner corresponding to three primary colors of light, each fluorescent layer 5 being configured to perform wavelength conversion by being excited by excitation light emitted from a corresponding LED 3 and by emitting fluorescence having a corresponding color; and an excitation light blocking layer 8 disposed to cover the fluorescent layers 5, the excitation light blocking layer 8 being configured to block the excitation light.Type: ApplicationFiled: November 29, 2019Publication date: March 26, 2020Inventors: Koichi KAJIYAMA, Takafumi HIRANO
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Patent number: 5968694Abstract: The present invention provides photoconductive paints which have excellent dispersability and dispersion stability and which allow formation of coatings with high coating strength and excellent smoothness.The invention relates to photoconductive paint composed primarily of an inorganic photoconductive material and a binding resin formed on a conductive substrate, wherein the binding resin contains compound fine particles (A) and a resin (B) as defined below, in a solid weight ratio of compound fine particles (A)/resin (B) in the range of 0.5/9.5-4.0/6.0.The compound fine particles (A) have an organic polymer bound to surfaces of inorganic fine particles, and the resin (B) is a resin composition obtained by polymerizing an acrylic monomer mixture, the resin having an acid value of 2.0-12.0.Type: GrantFiled: April 28, 1998Date of Patent: October 19, 1999Assignees: Iwatsu Electro Co., Ltd., Nippon ShokubaiInventors: Hideki Sakai, Takafumi Hirano, Daijou Tomihisa, Shigefumi Kuramoto
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Patent number: 5289257Abstract: A signal processing apparatus for a phase modulation optical gyro includes: a circuit for taking components of frequencies fm, 2fm and 4fm from a photoelectric output signal proportional to an input rotation angular velocity and converting the components to analog signals of a frequency .DELTA.fm; a converter for converting the analog signals to a digital signal; a unit for forming a pair of digital signals shifted in phase by 90.degree.Type: GrantFiled: January 8, 1992Date of Patent: February 22, 1994Assignee: Mitsubishi Precision Co., Ltd.Inventors: Akihiro Kurokawa, Hiroshi Narise, Takafumi Hirano, Yoshiaki Hayakawa