Abstract: To enable improvement in uniformity of film thickness between a plurality of substrates as compared with that of the related art in a case where the plurality of substrates is loaded in a boat and subjected to batch processing, a substrate processing apparatus is configured to include a process container capable of accommodating a substrate holder that holds substrates, a gas supplier that supplies a gas to the process container, an exhauster that exhausts an atmosphere in the process container, a transporter that transports the substrates, and a controller configured to be capable of controlling the transporter to dispersedly load the substrates from a central portion of a first region in a case where a number X of the substrates is smaller than a maximum loading number Y of the substrate holder, and the substrate holder includes, at the central portion, the first region where the dispersion loading is performed.

Abstract: A transmission apparatus includes a first communication unit, a second communication unit, a detection unit, a control unit, and a selection unit. The first communication unit uses a first path for communication, when electric power is supplied. The second communication unit uses a second path for communication, when electric power is supplied. The detection unit detects a fault predictive sign. The control unit supplies no electric power to the second communication unit when the detection unit does not detect the fault predictive sign. The control unit starts supplying electric power to the second communication unit and performs normality confirmation of the second path when the detection unit detects the fault predictive sign, before switching from the first path to the second path.

Abstract: An optical transmission system including an optical transmission device and an optical reception device that receives, via an optical transmission line, a signal transmitted from the optical transmission device, the optical transmission system including a transmission-mode selection unit that selects transmission mode information in descending order of priority out of transmission mode information, which is combinations of a plurality of parameters concerning transmission performance, the transmission mode information being a plurality of kinds of the transmission mode information common to the transmission performance of the optical transmission device and the optical reception device, a signal transmission unit that transmits, to the optical reception device, a signal modulated based on the selected transmission mode information, and a signal reception unit that receives the signal and modulates the received signal based on the transmission mode information selected by the transmission-mode selection unit.

Abstract: A method of evaluating the presence or absence and/or degree of metal contamination of a semiconductor substrate including etching the surface of the semiconductor substrate by SC-1 cleaning and/or a HF cleaning, detecting bright points on the surface of the etched substrate with a foreign matter inspection device, and evaluating the presence or absence and/or degree of metal contamination of the semiconductor substrate based on the distribution pattern of bright points detected on the surface of the substrate. Also disclosed is a method of manufacturing a semiconductor substrate comprising mirror polishing a silicon wafer surface, wherein the mirror polishing is conducted using a slurry having a Cu content of approximately equal to or less than 10 ppb, a Ni content of approximately equal to or less than 10 ppb, and an Fe content of approximately equal to or less than 1,000 ppb, and evaluating the semiconductor substrate as above.

Abstract: The method of manufacturing a semiconductor substrate including mirror polishing a silicon wafer surface, wherein the mirror polishing is conducted using a slurry having a Cu content of approximately equal to or less than 10 ppb, a Ni content of approximately equal to or less than 10 ppb, and an Fe content of approximately equal to or less than 1,000 ppb. The method of evaluating a quality of a semiconductor substrate including etching the surface of the semiconductor substrate by SC-1 cleaning and/or a HF cleaning, detecting bright points on the surface of the etched substrate with a foreign matter inspection device, and evaluating the quality of the semiconductor substrate based on the bright points detected on the surface of the substrate.