Abstract: A setting unit sets a communication mode for different one or more counterpart communication apparatuses to a non-spatial multiplexing mode or a spatial multiplexing mode. Setting unit switches the setting of the communication mode for the different one or more counterpart communication apparatuses from the non-spatial multiplexing mode to the spatial multiplexing mode, on the basis of a capability of a communication system having an own apparatus and the different one or more counterpart communication apparatuses. A transmitting unit processes a transmitting signal to the different one or more counterpart communication apparatuses to output the processed signal to a plurality of antennas, on the basis of the set communication mode.

Abstract: A setting unit sets a communication mode for different one or more counterpart communication apparatuses to a non-spatial multiplexing mode or a spatial multiplexing mode. Setting unit switches the setting of the communication mode for the different one or more counterpart communication apparatuses from the non-spatial multiplexing mode to the spatial multiplexing mode, on the basis of a capability of a communication system having an own apparatus and the different one or more counterpart communication apparatuses. A transmitting unit processes a transmitting signal to the different one or more counterpart communication apparatuses to output the processed signal to a plurality of antennas, on the basis of the set communication mode.

Abstract: A QoS management unit receives notification of QoS parameters for a plurality of uplink service flows from a wireless base station. A burst region management unit receives notification of an uplink user data burst region from the wireless base station. A service flow assignment unit assigns a region of uplink service flows at the uplink user data burst region assigned to its own terminal. The service flow assignment unit assigns a region of uplink service flows, prioritizing the region of at least one service flow satisfying conditions for the transmission rate, delay time, and delay time variation of the notified QoS parameters for each service flow over a region of another service flow.

Abstract: A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.

Abstract: An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.

Abstract: A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically scaled with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

Abstract: A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

Abstract: An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.