Patents by Inventor Takafumi Kudou

Takafumi Kudou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminate film and processes for preparing printed wiring board
    Patent number: 6333135
    Abstract: Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: December 25, 2001
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Noriyo Kimura, Youji Tanaka, Kazutaka Masaoka, Takafumi Kudou, Yukihiko Minamihira, Tetsuo Yoshida
  • Laminate film and processes for preparing printed wiring board
    Publication number: 20010009750
    Abstract: Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.
    Type: Application
    Filed: March 14, 2001
    Publication date: July 26, 2001
    Inventors: Noriyo Kimura, Youji Tanaka, Kazutaka Masaoka, Takafumi Kudou, Yukihiko Minamihira, Tetsuo Yoshida
  • Laminate film and processes for preparing printed wiring board
    Patent number: 6207345
    Abstract: Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: March 27, 2001
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Noriyo Kimura, Youji Tanaka, Kazutaka Masaoka, Takafumi Kudou, Yukihiko Minamihira, Tetsuo Yoshida