Patents by Inventor Takafumi KUNITANI

Takafumi KUNITANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical receptacle, optical module, and method for manufacturing optical module
    Patent number: 10627586
    Abstract: An optical receptacle, having an optical receptacle body and a support member. The optical receptacle body is in contact with the support member through a first contact surface, a second contact surface, and a third contact surface. The support member has a second fitting part fitting with a first fitting part disposed on the first contact surface of the optical receptacle body. The optical receptacle body is adhered to the support member by an adhesive disposed inside an adhesion recess on the support member and an adhesion through-hole in the optical receptacle body, with the optical receptacle body being set away from a virtual plane including an installation surface for the support member. The adhesion through-hole opens onto the third contact surface of the optical receptacle body and the surface of the optical receptacle body on the opposite side from the third contact surface.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: April 21, 2020
    Assignee: Enplas Corporation
    Inventors: Shimpei Morioka, Takafumi Kunitani
  • OPTICAL RECEPTACLE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING OPTICAL MODULE
    Publication number: 20200003972
    Abstract: An optical receptacle, having an optical receptacle body and a support member. The optical receptacle body is in contact with the support member through a first contact surface, a second contact surface, and a third contact surface. The support member has a second fitting part fitting with a first fitting part disposed on the first contact surface of the optical receptacle body. The optical receptacle body is adhered to the support member by an adhesive disposed inside an adhesion recess on the support member and an adhesion through-hole in the optical receptacle body, with the optical receptacle body being set away from a virtual plane including an installation surface for the support member. The adhesion through-hole opens onto the third contact surface of the optical receptacle body and the surface of the optical receptacle body on the opposite side from the third contact surface.
    Type: Application
    Filed: November 22, 2017
    Publication date: January 2, 2020
    Inventors: Shimpei MORIOKA, Takafumi KUNITANI