Abstract: A steering control device includes an electronic control unit. The electronic control unit is configured to perform end contact relaxation control for correcting a current command value such that a decrease of an end separation angle indicating a distance of an absolute steering angle from an end-position-corresponding angle is limited when the end separation angle is equal to or less than a predetermined angle and to perform partial release control for decreasing a correction value of the current command value due to execution of the end contact relaxation control based on a steering torque which is input to a steering system when a vehicle is intended to travel while turning at the time of execution of the end contact relaxation control.

Abstract: There is provided a technique including: forming a first film containing first element and second element; and forming a second film adjacent to the first film and containing the first element and the second element being different in characteristics from the first film, wherein one of the first and second films is formed by performing a first cycle a predetermined number of times, the first cycle including performing: (a1) supplying a first precursor gas containing the first element; and (b1) supplying a first reaction gas containing the second element, and wherein the other of the first and second films is formed by performing a second cycle a predetermined number of times, the second cycle including performing: (a2) supplying a second precursor gas containing the first element and being higher in a thermal decomposition temperature than the first precursor gas; and (b2) supplying a second reaction gas containing the second element.

Abstract: A method of manufacturing a semiconductor device includes: (a) forming a nitride film containing a predetermined element on a substrate by performing a cycle a predetermined number of times, the cycle including sequentially performing: (a-1) supplying a first precursor gas containing the predetermined element to the substrate; (a-2) supplying a second precursor gas containing the predetermined element and having a thermal decomposition temperature lower than a thermal decomposition temperature of the first precursor gas to the substrate; and (a-3) supplying a nitriding gas to the substrate; and (b) oxidizing the nitride film formed in (a) and modifying the nitride film into an oxide film containing the predetermined element by supplying an oxidizing gas to the substrate.

Abstract: A method of manufacturing a semiconductor device includes: providing a substrate that includes a surface exposing a first film containing silicon, oxygen, carbon and nitrogen and having an oxygen atom concentration higher than a silicon atom concentration, which is higher than a carbon atom concentration, which is equal to or higher than a nitrogen atom concentration; and changing a composition of a surface of the first film so that the nitrogen atom concentration becomes higher than the carbon atom concentration on the surface of the first film, by supplying a plasma-excited nitrogen-containing gas to the surface of the first film.

Abstract: There is provided a technique that includes forming a first film including a ring-shaped structure composed of silicon and carbon and containing nitrogen so as to fill a recess formed in a surface of a substrate by performing a cycle a predetermined number of times, and performing post-treatment by supplying an oxidizing agent to the substrate under a condition that the ring-shaped structure included in the first film is preserved. The cycle includes non-simultaneously performing supplying a precursor including the ring-shaped structure and containing halogen to the substrate with the recess formed in the surface, and supplying a nitriding agent to the substrate, wherein the cycle is performed under a condition that the ring-shaped structure included in the precursor is preserved.

Abstract: Provided is a technique which includes forming on a substrate an oxide film containing silicon or a metal element and doped with a dopant by performing a cycle a predetermined number of times, wherein the cycle includes sequentially and non-simultaneously performing: (a) supplying a first gas to the substrate wherein the first gas is free of chlorine and contains boron or phosphorus as the dopant; (b) supplying a second gas to the substrate wherein the second gas contains silicon or the metal element; and (c) supplying a third gas to the substrate wherein the third gas contains oxygen.

Abstract: There is provided a technique that includes forming a first film including a ring-shaped structure composed of silicon and carbon and containing nitrogen so as to fill a recess formed in a surface of a substrate by performing a cycle a predetermined number of times, and performing post-treatment by supplying an oxidizing agent to the substrate under a condition that the ring-shaped structure included in the first film is preserved. The cycle includes non-simultaneously performing supplying a precursor including the ring-shaped structure and containing halogen to the substrate with the recess formed in the surface, and supplying a nitriding agent to the substrate, wherein the cycle is performed under a condition that the ring-shaped structure included in the precursor is preserved.

Abstract: A method of manufacturing a semiconductor device includes: providing a substrate that includes a surface exposing a first film containing silicon, oxygen, carbon and nitrogen and having an oxygen atom concentration higher than a silicon atom concentration, which is higher than a carbon atom concentration, which is equal to or higher than a nitrogen atom concentration; and changing a composition of a surface of the first film so that the nitrogen atom concentration becomes higher than the carbon atom concentration on the surface of the first film, by supplying a plasma-excited nitrogen-containing gas to the surface of the first film.

Abstract: A technique includes forming a laminated film on a substrate by performing a cycle a predetermined number of times. The cycle includes forming a first film which contains at least a predetermined element and oxygen, and forming a second film which contains at least the predetermined element, oxygen and carbon. The first film and the second film are laminated to form the laminated film.

Abstract: Provided is a technique which includes forming on a substrate an oxide film containing silicon or a metal element and doped with a dopant by performing a cycle a predetermined number of times, wherein the cycle includes sequentially and non-simultaneously performing: (a) supplying a first gas to the substrate wherein the first gas is free of chlorine and contains boron or phosphorus as the dopant; (b) supplying a second gas to the substrate wherein the second gas contains silicon or the metal element; and (c) supplying a third gas to the substrate wherein the third gas contains oxygen.

Abstract: A method of manufacturing a semiconductor device includes: providing a substrate; and forming a film on the substrate by supplying a silicon hydride and a halogen element-free catalyst containing one of a group III element or a group V element to the substrate, under a condition that the silicon hydride is not thermally decomposed when the silicon hydride is present alone.

Abstract: There is provided a method of manufacturing a semiconductor device, comprising forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing forming a first layer by supplying a precursor containing hydrogen and an halogen element to the substrate in a process chamber, under a condition in which the precursor is pyrolyzed if the precursor exists alone and under a condition in which a flow rate of the precursor supplied into the process chamber is larger than a flow rate of the precursor exhausted from an interior of the process chamber and forming a second layer by supplying a reactant to the substrate in the process chamber thereby modifying the first layer.

Abstract: A method of manufacturing a semiconductor device includes: providing a substrate; and forming a film on the substrate by supplying a silicon hydride and a halogen element-free catalyst containing one of a group III element or a group V element to the substrate, under a condition that the silicon hydride is not thermally decomposed when the silicon hydride is present alone.

Abstract: There is provided a method of manufacturing a semiconductor device, comprising forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including non- simultaneously performing forming a first layer by supplying a precursor containing hydrogen and an halogen element to the substrate in a process chamber, under a condition in which the precursor is pyrolyzed if the precursor exists alone and under a condition in which a flow rate of the precursor supplied into the process chamber is larger than a flow rate of the precursor exhausted from an interior of the process chamber and forming a second layer by supplying a reactant to the substrate in the process chamber thereby modifying the first layer.

Abstract: A technique includes forming a laminated film on a substrate by performing a cycle a predetermined number of times. The cycle includes forming a first film which contains at least a predetermined element and oxygen, and forming a second film which contains at least the predetermined element, oxygen and carbon. The first film and the second film are laminated to form the laminated film.

Abstract: A mixer device, a player and a reproduction system and the like are provided which enable a user to acknowledge at the player side whether reproduction signals being reproduced with the player are in an on-air state (whether it is output from the mixer device side) and can prevent mistaken operations by the user. The mixer device 20 is connected to one or more players 10 and outputs reproduction signals being reproduced with the player 10 to an output device 30, and further outputs an on-air signal indicating that the reproduction signals are output to the output device 30 (being in an on-air state) to the player 10 as input source of the reproduction signals.

Abstract: Quality of an image inputted from a video input terminal is adjusted at an image processing unit using a parameter set fitted for the image selected from a plurality of parameter sets received in a parameter set receiving unit. The using parameter set is stored in a parameter memory. A scene judging unit generates a hue histogram of each frame. When a change of the parameter set is necessary, a parameter mixing unit gradually replaces values of the parameter set stored in the parameter memory with a new parameter set selected by a selector. The replaced parameter set is stored in the parameter memory and is used in the image processing unit for adjusting the image quality.