Patents by Inventor Takafumi OHTAKE

Takafumi OHTAKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux, solder paste and method for producing soldered product
    Patent number: 11738415
    Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: August 29, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takafumi Ohtake, Hiroaki Kawamata, Shinji Kikuchi, Keisuke Shinozaki, Yuki Fujino, Kazuya Kitazawa
  • FLUX, SOLDER PASTE AND METHOD FOR PRODUCING SOLDERED PRODUCT
    Publication number: 20230107101
    Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 6, 2023
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takafumi OHTAKE, Hiroaki KAWAMATA, Shinji KIKUCHI, Keisuke SHINOZAKI, Yuki FUJINO, Kazuya KITAZAWA