Patents by Inventor Takafumi OKUMURA

Takafumi OKUMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing printed wiring board and printed wiring board
    Patent number: 9986642
    Abstract: A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 29, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Masatoshi Kunieda, Takafumi Okumura
  • METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
    Publication number: 20170027057
    Abstract: A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 26, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Masatoshi KUNIEDA, Takafumi OKUMURA