Patents by Inventor Takafumi Sakurada
Takafumi Sakurada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9944827Abstract: The CMP polishing solution of the invention comprises (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a positive zeta potential in the CMP polishing solution, (C) a metal oxide solubilizer and (D) an oxidizing agent. The polishing method of the invention comprises a first polishing step in which the conductive substance layer of a substrate comprising an interlayer insulating filth having an elevated section and a trench at the surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, is polished to expose the barrier layer located on the elevated section of the interlayer insulating film, and a second polishing step in which the barrier layer exposed in the first polishing step is polished using the CMP polishing solution to expose the elevated section of the interlayer insulating film.Type: GrantFiled: June 29, 2011Date of Patent: April 17, 2018Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Kouji Mishima, Takafumi Sakurada, Tomokazu Shimada
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Publication number: 20170267895Abstract: The invention provides polishing slurry for CMP for suppressing corrosion of wiring lines of a conductive substance, or for suppressing bimetallic corrosion of a barrier conductor and conductive substance, by suppressing electrons from being transferred at near the boundaries between a barrier conductor and a conductive substance such as copper. The invention provides polishing slurry for CMP for polishing at least a conductor layer and a conductive substance layer in contact with the conductor layer, wherein the absolute value of the potential difference between the conductive substance and the conductor at 50±5° C. is 0.25 V or less in the polishing slurry when a positive electrode and a negative electrode of a potentiometer are connected to the conductive substance and the conductor, respectively.Type: ApplicationFiled: July 15, 2015Publication date: September 21, 2017Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Takashi Shinoda, Shigeru Nobe, Takafumi Sakurada, Yoshikazu Oomori, Tadahiro Kimura
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Publication number: 20150315419Abstract: The invention provides polishing slurry for CMP for suppressing corrosion of wiring lines of a conductive substance, or for suppressing bimetallic corrosion of a barrier conductor and conductive substance, by suppressing electrons from being transferred at near the boundaries between a barrier conductor and a conductive substance such as copper. The invention provides polishing slurry for CMP for polishing at least a conductor layer and a conductive substance layer in contact with the conductor layer, wherein the absolute value of the potential difference between the conductive substance and the conductor at 50±5° C. is 0.25 V or less in the polishing slurry when a positive electrode and a negative electrode of a potentiometer are connected to the conductive substance and the conductor, respectively.Type: ApplicationFiled: July 15, 2015Publication date: November 5, 2015Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Takashi Shinoda, Shigeru Nobe, Takafumi Sakurada, Yoshikazu Oomori, Tadahiro Kimura
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Patent number: 8901002Abstract: Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.Type: GrantFiled: November 13, 2013Date of Patent: December 2, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Takaaki Tanaka, Masato Fukasawa, Shigeru Nobe, Takafumi Sakurada, Takashi Shinoda
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Patent number: 8821750Abstract: The present invention relates to a metal polishing slurry containing abrasive grains, a metal-oxide-dissolving agent, and water, wherein the abrasive grains contain two or more abrasive grain species different from each other in average secondary particle diameter. Using the metal polishing slurry of the present invention, a metal polishing slurry can be obtained which gives a large polishing rate of an interlayer dielectric layer, and is high in the flatness of the polished surface. This metal polishing slurry can provide suitable method for a semiconductor device which is excellent in being made finer and thinner and in dimension precision and in electric characteristics, is high in reliability, and can attain a decrease in costs.Type: GrantFiled: February 22, 2008Date of Patent: September 2, 2014Assignee: Hitachi Chemical Co., Ltd.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Takashi Shinoda, Shigeru Nobe
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Patent number: 8791019Abstract: The present invention provides a metal polishing liquid capable of CMP at a high Cu polishing rate and solving the problems: (a) generation of scratches attributable to solid particles, (b) generation of deteriorations in flatness such as dishing and erosion, (c) complexity in a washing process for removing abrasive particles remaining on the surface of a substrate after polishing, and (d) higher costs attributable to the cost of a solid abrasive itself and to waste liquid treatment, as well as a method of polishing a film to be polished by using the same.Type: GrantFiled: December 27, 2006Date of Patent: July 29, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Yutaka Nomura, Hiroshi Nakagawa, Sou Anzai, Ayako Tobita, Takafumi Sakurada, Katsumi Mabuchi
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Publication number: 20140065825Abstract: A method including preparing a polishing slurry for CMP for polishing at least a conductor layer and a conductive substance layer in contact with the conductor layer, wherein the absolute value of the potential difference between the conductive substance and the conductor at 50±5° C. is 0.25 V or less in the polishing slurry when a positive electrode and a negative electrode of a potentiometer are connected to the conductive substance and the conductor, respectively. The polishing slurry for CMP preferably comprises at least one compound selected from heterocyclic compounds containing any one of hydroxyl group, carbonyl group, carboxyl group, amino group, amide group and sulfinyl group, and containing at least one of nitrogen and sulfur atoms.Type: ApplicationFiled: November 8, 2013Publication date: March 6, 2014Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Takashi Shinoda, Shigeru Nobe, Takafumi Sakurada, Yoshikazu Oomori, Tadahiro Kimura
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Publication number: 20140065826Abstract: Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.Type: ApplicationFiled: November 13, 2013Publication date: March 6, 2014Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Takaaki Tanaka, Masato Fukasawa, Shigeru Nobe, Takafumi Sakurada, Takashi Shinoda
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Patent number: 8609541Abstract: Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.Type: GrantFiled: July 4, 2008Date of Patent: December 17, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Takaaki Tanaka, Masato Fukasawa, Shigeru Nobe, Takafumi Sakurada, Takashi Shinoda
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Patent number: 8481428Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.Type: GrantFiled: November 18, 2011Date of Patent: July 9, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
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Patent number: 8328893Abstract: The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. Particularly, the present invention provides a polishing slurry containing cerium oxide particles obtained by using cerium carbonate as the metal carbonate material and oxalic acid as the acid. The present invention provides a method of producing oxide particles, wherein coarse particle- and abrasion powder-free fine particles can be rapidly obtained. The present invention also provides a polishing slurry using the oxide particles, which can maintain a suitable polishing rate, can reduce generation of scratches, and can accurately polish the surface of a semiconductor.Type: GrantFiled: April 20, 2007Date of Patent: December 11, 2012Assignee: Hitachi Chemical Co., Ltd.Inventors: Takafumi Sakurada, Daisuke Hosaka, Kanshi Chinone
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Publication number: 20120064721Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.Type: ApplicationFiled: November 18, 2011Publication date: March 15, 2012Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
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Publication number: 20110318929Abstract: The CMP polishing solution of the invention comprises (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a positive zeta potential in the CMP polishing solution, (C) a metal oxide solubilizer and (D) an oxidizing agent. The polishing method of the invention comprises a first polishing step in which the conductive substance layer of a substrate comprising an interlayer insulating filth having an elevated section and a trench at the surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, is polished to expose the barrier layer located on the elevated section of the interlayer insulating film, and a second polishing step in which the barrier layer exposed in the first polishing step is polished using the CMP polishing solution to expose the elevated section of the interlayer insulating film.Type: ApplicationFiled: June 29, 2011Publication date: December 29, 2011Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Kouji Mishima, Takafumi Sakurada, Tomokazu Shimada
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Patent number: 8084363Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.Type: GrantFiled: February 4, 2009Date of Patent: December 27, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
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Patent number: 8084362Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive, wherein the surface of the abrasive is modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.Type: GrantFiled: May 25, 2007Date of Patent: December 27, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
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Patent number: 7994058Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive, wherein the surface of the abrasive is modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.Type: GrantFiled: May 25, 2007Date of Patent: August 9, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
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Publication number: 20110009033Abstract: Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.Type: ApplicationFiled: July 4, 2008Publication date: January 13, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Takaaki Tanaka, Masato Fukasawa, Shigeru Nobe, Takafumi Sakurada, Takashi Shinoda
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Publication number: 20100178765Abstract: The present invention provides a metal polishing liquid capable of CMP at a high Cu polishing rate and solving the problems: (a) generation of scratches attributable to solid particles, (b) generation of deteriorations in flatness such as dishing and erosion, (c) complexity in a washing process for removing abrasive particles remaining on the surface of a substrate after polishing, and (d) higher costs attributable to the cost of a solid abrasive itself and to waste liquid treatment, as well as a method of polishing a film to be polished by using the same.Type: ApplicationFiled: December 27, 2006Publication date: July 15, 2010Inventors: Yutaka Nomura, Hiroshi Nakagawa, Sou Anzai, Ayako Tobita, Takafumi Sakurada, Katsumi Mabuchi
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Publication number: 20100120250Abstract: The present invention relates to a metal polishing slurry containing abrasive grains, a metal-oxide-dissolving agent, and water, wherein the abrasive grains contain two or more abrasive grain species different from each other in average secondary particle diameter. Using the metal polishing slurry of the present invention, a metal polishing slurry can be obtained which gives a large polishing rate of an interlayer dielectric layer, and is high in the flatness of the polished surface. This metal polishing slurry can provide suitable method for a semiconductor device which is excellent in being made finer and thinner and in dimension precision and in electric characteristics, is high in reliability, and can attain a decrease in costs.Type: ApplicationFiled: February 22, 2008Publication date: May 13, 2010Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Takashi Shinoda, Shigeru Nobe
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Publication number: 20090283715Abstract: The invention relates to a polishing slurry for CMP containing abrasive and a fang and seam restrainer, wherein the fang and seam restrainer is at least one selected from polycarboxylic acids, polycarboxylic acid derivatives, or carboxylic-acid-containing copolymers. According to this, provided is a polishing slurry for CMP which restrains a fang phenomenon or a seam phenomenon that an insulated film near wiring regions is excessively polished, thereby giving a high flatness to a polished face.Type: ApplicationFiled: July 3, 2007Publication date: November 19, 2009Inventors: Shigeru Nobe, Takashi Shinoda, Takafumi Sakurada, Takaaki Tanaka, Yoshikazu Oomori, Tadahiro Kimura, Masato Fukasawa