Abstract: Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3, and a processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.

Abstract: A molding device for molding a resin composition into a sheet shape by pressurizing the resin composition has a pair of rollers arranged parallel to one another. Each of the rollers has a columnar or cylindrical core portion and an outer layer provided on an outer periphery of the core portion. The outer layer is constituted of the ceramic material. A thickness of the outer layer is in the range of 0.2 to 100 nm. Further, an arithmetic mean deviation of a profile Ra of an outer peripheral surface of each of the rollers defined by JIS B 0601 is in the range of 0 to 2 ?m.

Abstract: An agitating and mixing device 1 of the present invention includes a container 2 for storing the composition, an agitating member 3 for agitating the composition, which is inserted in the container 2, and a driving device 4 for vibrating the container 2. The agitating member 3 has a rod-like portion 32 having one end portion and another end portion, a plate-like portion 31 provided on the one end portion of the rod-like portion 32 and the grip portion 33 provided on the other end portion of the rod-like portion 33. The plate-like portion 31 is perpendicular to the rod-like portion 32. The agitating member 3 is configured to agitate the composition by spacing the plate-like portion 31 apart from the bottom surface of the container 2.

Abstract: A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.

Abstract: A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3, and a processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

Abstract: A molding device for molding a resin composition into a sheet shape by pressurizing the resin composition has a pair of rollers arranged parallel to one another. Each of the rollers has a columnar or cylindrical core portion and an outer layer provided on an outer periphery of the core portion. The outer layer is constituted of the ceramic material. A thickness of the outer layer is in the range of 0.2 to 100 nm. Further, an arithmetic mean deviation of a profile Ra of an outer peripheral surface of each of the rollers defined by JIS B 0601 is in the range of 0 to 2 ?m.

Abstract: An agitating and mixing device 1 of the present invention includes a container 2 for storing the composition, an agitating member 3 for agitating the composition, which is inserted in the container 2, and a driving device 4 for vibrating the container 2. The agitating member 3 has a rod-like portion 32 having one end portion and another end portion, a plate-like portion 31 provided on the one end portion of the rod-like portion 32 and the grip portion 33 provided on the other end portion of the rod-like portion 33. The plate-like portion 31 is perpendicular to the rod-like portion 32. The agitating member 3 is configured to agitate the composition by spacing the plate-like portion 31 apart from the bottom surface of the container 2.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: The present invention provides an epoxy resin composition for encapsulation of semiconductors which contains substantially neither halogen-based flame retarding agents nor antimony compounds and is excellent in moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. That is, the present invention is an epoxy resin composition for encapsulating semiconductors which contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.