Patents by Inventor Takafumi TSUDA

Takafumi TSUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230268216
    Abstract: A substrate support is arranged in a processing container. The substrate support includes an electrostatic chuck provided with a first support surface for supporting a substrate, provided with a first electrode and a second electrode which are arranged in the electrostatic chuck sequentially from the first support surface, and made of a dielectric material, and a base configured to support the electrostatic chuck. The second electrode is arranged at a position having a distance to the first support surface that is equal to or less than a distance to the base. A voltage for attracting the substrate is applied to the first electrode and bias power is supplied to the second electrode.
    Type: Application
    Filed: January 31, 2023
    Publication date: August 24, 2023
    Inventors: Shinya ISHIKAWA, Daiki HARIU, Takahiko SATO, Tsutomu NAGAI, Takafumi TSUDA, Keigo TOYODA