Abstract: A component mounting apparatus is configured to mount a component on a substrate. The substrate includes a lower side substrate member, an upper side substrate member provided on an upper surface of the lower side substrate member, a lower side mark provided on the lower side substrate member, and an upper side mark provided on an upper surface of the upper side substrate member. The apparatus includes an upward facing camera configured to image the lower side mark from below the lower side substrate member, a data storage configured to store relative positional relationship data indicating a predetermined relative positional relationship between the lower side mark and the upper side mark, and a component mounting unit configured to mount the component on the upper surface of the upper side substrate member based on the data and information obtained through imaging the lower side mark imaged by the upward facing camera.

Abstract: A component mounting apparatus is configured to mount a component on a substrate. The substrate includes a lower side substrate member, an upper side substrate member provided on an upper surface of the lower side substrate member, a lower side mark provided on the lower side substrate member, and an upper side mark provided on an upper surface of the upper side substrate member. The apparatus includes an upward facing camera configured to image the lower side mark from below the lower side substrate member, a data storage configured to store relative positional relationship data indicating a predetermined relative positional relationship between the lower side mark and the upper side mark, and a component mounting unit configured to mount the component on the upper surface of the upper side substrate member based on the data and information obtained through imaging the lower side mark imaged by the upward facing camera.

Abstract: A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48.

Abstract: In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.

Abstract: A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48.

Abstract: In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined, with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.