Abstract: A semiconductor module includes a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, and a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material. The first bonding portion has a plurality of first protrusions at the bonding surface. Each first protrusion protrudes toward the semiconductor device, and is provided in a position away from the gate runner by a first distance in a plan view of the semiconductor module.

Abstract: The signal transmission paths are transmission path pairs 22, 24 located spaced apart in the arrangement direction of the signal transmission paths 22, 24, the transmission path pairs 22, 24 have two types of pairs, straight pairs 22 and cross pairs 24, the straight pairs 22 and the cross pairs 24 are alternately disposed in the arrangement direction, the signal transmission paths arranged in the arrangement direction form signal transmission path rows, a plurality of the signal transmission path rows are provided, and of two adjacent signal transmission path rows, at least a part of the transmission path pairs 22, 24 of one signal transmission path row in the height direction is offset in the arrangement direction with respect to the transmission path pairs 22, 24 of the other signal transmission path row.

Abstract: A semiconductor apparatus includes first and second semiconductor chips, and a circuit board. The circuit board is a laminated board sequentially including an insulating plate, a circuit layer, and a metal layer. The circuit layer includes a first mounting portion on which the first semiconductor chip is installed, a second mounting portion on which the second semiconductor chip is installed, and a first and second upper surface slit provided between the first and second mounting portion and extending in a first direction. The metal layer includes a first lower surface slit extending in the first direction. In a plan view, the first mounting portion, the first upper surface slit, the second upper surface slit, and the second mounting portion are provided side by side in the second direction. The first lower surface slit is located within a range defined by the first and second upper surface slit.

Abstract: A fan motor according to an embodiment includes a bearing holder, a stator, a circuit board, and a synthetic resin. The stator is mounted at an outer circumference of the bearing holder. The circuit board is electrically connected to a coil of the stator, is mounted at a surface of the base part at an opposite side to the bearing holder, and extends from a base part to a connector housing. The synthetic resin seals the bearing holder, the stator, and the circuit board, except for both end faces of the bearing holder. The connector housing has a gate opening that is injected with the synthetic resin at the time of sealing and ribs that are at an opposite side to the gate opening with the circuit board between the ribs, and tops of the ribs making contact with the circuit board.

Abstract: A semiconductor device includes a semiconductor chip including an upper electrode, a lead frame having a bonding part and a rising part, and a bonding member joining the upper electrode to the bonding part. The upper electrode has electrode lateral surfaces including a first lateral surface. The bonding part has a bonding front surface and terminal lateral surfaces that include a second lateral surface. The bonding part is joined to the upper electrode such that the second lateral surface faces the first lateral surface. The rising part extends upward from the first lateral surface. In a direction parallel to the electrode front surface, a first shortest distance between a center of the electrode front surface in a plan view and the second lateral surface is equal to or greater than 40% of a second shortest distance between the first lateral surface and the second lateral surface.

Abstract: A data processing method is a data processing method in which variable measurement data transmitted from a sensor at a first cycle is computationally processed at a second cycle that is longer than the first cycle. The measurement data is acquired in a third cycle that is longer than the first cycle and shorter than the second cycle, an average value of the acquired measurement data is calculated at the second cycle, and computation processing thereof is performed.

Abstract: Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.

Abstract: A semiconductor device, including a cooling body, a semiconductor unit including a wiring portion electrically connected to a semiconductor chip, and a sealing member sealing the entire semiconductor unit over a cooling surface of the cooling body. The sealing member includes a first portion and a second portion which surrounds the first portion in a plan view. The first portion seals a central portion of a main electrode of the semiconductor chip, and has a first sealing surface opposite the cooling surface of the cooling body. The second portion seals a wiring portion to thereby surround the first portion in the plan view, and has a second sealing surface opposite the cooling surface. A distance in a thickness direction of the semiconductor device from the cooling surface to the first sealing surface, is smaller than a distance in the thickness direction from the cooling surface to the second sealing surface.

Abstract: To improve the stability of spray application of a monolithic refractory in which a water injector is disposed in a material carrier pipe extending from a material supply device to a distal spray nozzle, and application water is injected from the water injector into a spray material that is being carried through the material carrier pipe, a ratio of a flow volume of an application water carrier gas for carrying the application water to be introduced into the water injector to a flow volume of a spray material carrier gas for carrying the spray material is set to 0.07 to 2, and a compressibility index of the spray material is set to 32% or less. Alternatively, a ratio of a flow volume of an application water carrier gas for carrying the application water to be introduced into the water injector to an application water volume is set to 100 to 1,000.

Abstract: A cooling device including a rectangular top plate in a plan view having a front surface on which a semiconductor module is disposed and a rear surface having a sidewall connection region, a flow pass region, and an outer edge region. The flow pass region includes a cooling region and first and second communicating regions that sandwich the cooling region therebetween from a short-side direction of the top plate. The sidewall connection region surrounds an outer periphery of the flow pass region. The outer edge region is outside of the sidewall connection region and closer to an edge of the top plate than is the flow pass region. The cooling region has a first thickness, and the outer edge region has a second thickness that is greater than the first thickness.

Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit board on which the semiconductor chip is disposed, a cooling plate having a second front surface to which the insulated circuit board is disposed, a bonding member which bonding the insulated circuit board to the cooling plate, a case which surrounds the semiconductor chip and the insulated circuit board and is bonded to the second front surface of the cooling plate with an adhesive therebetween and a sealing member which seals the semiconductor chip and the insulated circuit board over the cooling plate in the case. The cooling plate has a coupling portion which is a projection or a recess at the second front surface of the cooling plate, and the coupling portion has an engaging surface that is inclined to form an acute angle with the second front surface of the cooling plate.

Abstract: A data processing method of variable measurement data in an electronic control unit (ECU) is provided. The ECU that processes the data processing method calculates a filtering frequency based on a delay time frequency based on a transmission timing cycle of the measurement data and a processing timing cycle of the measurement data in the ECU, and also based on a pulsation frequency of the measurement data, and removes, from the measurement data, a component of the filtering frequency calculated in the calculation of the filtering frequency.

Abstract: A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.

Abstract: A semiconductor module includes at least two semiconductor elements connected in parallel; a control circuit board placed between the at least two semiconductor elements; a control terminal for external connection; a first wiring member that connects the control terminal and the control circuit board; and a second wiring member that connects a control electrode of one of the at least two semiconductor elements and the control circuit board, wherein the second wiring member is wire-bonded from the control electrode towards the control circuit board, and has a first end on the control electrode and a second end on the control circuit board, the first end having a cut end face facing upward normal to a surface of the control electrode and the second end having a cut end face facing sideways parallel to a surface of the control circuit board.

Abstract: A data processing method of variable measurement data in an electronic control unit (ECU) is provided. The ECU that processes the data processing method calculates a filtering frequency based on a delay time frequency based on a transmission timing cycle of the measurement data and a processing timing cycle of the measurement data in the ECU, and also based on a pulsation frequency of the measurement data, and removes, from the measurement data, a component of the filtering frequency calculated in the calculation of the filtering frequency.

Abstract: A data processing method is a data processing method in which variable measurement data transmitted from a sensor at a first cycle is computationally processed at a second cycle that is longer than the first cycle. The measurement data is acquired in a third cycle that is longer than the first cycle and shorter than the second cycle, an average value of the acquired measurement data is calculated at the second cycle, and computation processing thereof is performed.

Abstract: A semiconductor module is provided, including: a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to the upper surface electrode; a metal wiring plate electrically connected to the upper surface electrode of the semiconductor chip; and a sheet-like low elastic sheet provided on the metal wiring plate, the low elastic sheet having elastic modulus lower than that of the metal wiring plate. A manufacturing method for a semiconductor module is provided, including: providing a semiconductor chip; solder-bonding a metal wiring plate above said semiconductor chip; and applying a sheet-like low elastic sheet having the elastic modulus lower than that of said metal wiring plate to said metal wiring plate.

Abstract: A semiconductor apparatus includes first and second semiconductor chips, and a circuit board. The circuit board is a laminated board sequentially including an insulating plate, a circuit layer, and a metal layer. The circuit layer includes a first mounting portion on which the first semiconductor chip is installed, a second mounting portion on which the second semiconductor chip is installed, and a first and second upper surface slit provided between the first and second mounting portion and extending in a first direction. The metal layer includes a first lower surface slit extending in the first direction. In a plan view, the first mounting portion, the first upper surface slit, the second upper surface slit, and the second mounting portion are provided side by side in the second direction. The first lower surface slit is located within a range defined by the first and second upper surface slit.

Abstract: A semiconductor module includes a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, and a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material. The first bonding portion has a plurality of first protrusions at the bonding surface. Each first protrusion protrudes toward the semiconductor device, and is provided in a position away from the gate runner by a first distance in a plan view of the semiconductor module.

Abstract: An engine controller, an engine control method, and memory medium are provided. A second calculation process calculates an intake air amount without using a detection result of an air flow meter. The determination process determines that intake air pulsation is great if it is confirmed that a difference between an average flow rate and a minimum flow rate is great. The average flow rate is an average value of an intake air flow rate within a period of the intake air pulsation. The minimum flow rate is a minimum value of the intake air flow rate within the period. When it is determined that the intake air pulsation is great, a calculation method switching process selects a calculated value of the intake air amount that is obtained by the second calculation process.