Abstract: The supported portions of the substrate are positioned offset from the center of the substrate in the vertical direction; adjacent intermediate bodies are provided in orientations vertically inverted relative to each other and every two supported portions are positioned so as to differ by a predetermined dimension P in the vertical direction; the lower lateral walls of the housing have formed therein, in an alternating manner, first lower supporting portions and second lower supporting portions positioned so as to differ by the predetermined dimension P in the vertical direction; the first lower supporting portions protrude upwardly of the second lower supporting portions and support from below the supported portions of the intermediate bodies in which the supported portions are positioned with an upward offset; and the second lower supporting portions support from below the supported portions of the intermediate bodies in which the supported portions are positioned with a downward offset.

Abstract: The intermediate circuit board has a plate-shaped substrate and a plurality of signal transmission line pairs for differential signal transmission extending on a major face of the substrate from one end to the other end of the substrate in the direction of connection to the counterpart connect bodies; the substrate has a fiber cloth formed by braiding a plurality of fibers used to reinforce the substrate in a mesh pattern and a plate-like member made of plastic having the fiber cloth embedded therein; the plurality of signal transmission line pairs have straight pairs and cross pairs disposed in an alternating manner in the width direction of the substrate; and the straight pairs and cross pairs, when viewed in the through-thickness direction of the substrate, are formed extending inclined at an angle relative to the fibers of the fiber cloth.

Abstract: The first board connector 2, at the opposite ends in the connector width direction, has fittings 80 that extend in the connector length direction perpendicular to both the connector width direction and the vertical direction; the fittings 80 have resilient pieces 83 that extend upwardly and are resiliently deformable in the connector width direction; the resilient pieces 83, in the top end portions thereof, have locking portions 83B that protrude outwardly in the connector width direction; the intermediate connector 1 has a housing 20 capable of receiving the first board connector 2 from below; the housing 20 has lateral walls 22 that extend in the connector length direction at the opposite ends in the connector width direction; and the lateral walls 22 have lockable portions 22C-1 lockingly engageable with the locking portions 83B from below at locations corresponding to the resilient pieces 83 in the connector length direction.

Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) below and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.

Abstract: A power storage module includes an electrode laminate including a plurality of bipolar electrodes which are laminated and a sealing body sealing a space between a pair of the bipolar electrodes adjacent to each other in a laminating direction among the plurality of bipolar electrodes in the electrode laminate. Each of the plurality of bipolar electrodes includes an electrode plate. The sealing body includes a group of primary sealing bodies each provided at an edge portion of the electrode plate and a secondary sealing body. The secondary sealing body includes a first resin portion that is provided along a side surface of the electrode laminate extending in the laminating direction and bonds the group of primary sealing bodies, and a second resin portion covering the first resin portion.

Abstract: A software component update system is connected to a first database and a second database and includes a component tree rebuilding unit that rebuilds a software component tree of the second database on the basis of tag information and software component tree information of the first database; a component extraction unit that specifies the software components of the second database requiring update mirroring, on the basis of the rebuilt software component tree; and a file update unit that updates the software component file of the specified software components.

Abstract: An optical module according to an embodiment includes a first optical component and a second optical component including a multicore fiber (MCF) and a spatial joining part. The first optical component includes a first uncoupled MCF having small optical coupling between cores and a first coupled MCF having a mode field diameter (MFD) larger than a MFD of the first uncoupled MCF. The second optical component includes a second uncoupled MCF having small optical coupling between cores and a second coupled MCF having a MFD larger than a MFD of the second uncoupled MCF. In the first coupled MCF and the second coupled MCF, crosstalk is periodically produced along the length direction of an MCF, and the total of the length of the first coupled MCF and the length of the second coupled MCF is a length L in which crosstalk is suppressed.

Abstract: Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.

Abstract: A semiconductor device, including a cooling body, a semiconductor unit including a wiring portion electrically connected to a semiconductor chip, and a sealing member sealing the entire semiconductor unit over a cooling surface of the cooling body. The sealing member includes a first portion and a second portion which surrounds the first portion in a plan view. The first portion seals a central portion of a main electrode of the semiconductor chip, and has a first sealing surface opposite the cooling surface of the cooling body. The second portion seals a wiring portion to thereby surround the first portion in the plan view, and has a second sealing surface opposite the cooling surface. A distance in a thickness direction of the semiconductor device from the cooling surface to the first sealing surface, is smaller than a distance in the thickness direction from the cooling surface to the second sealing surface.

Abstract: To improve the stability of spray application of a monolithic refractory in which a water injector is disposed in a material carrier pipe extending from a material supply device to a distal spray nozzle, and application water is injected from the water injector into a spray material that is being carried through the material carrier pipe, a ratio of a flow volume of an application water carrier gas for carrying the application water to be introduced into the water injector to a flow volume of a spray material carrier gas for carrying the spray material is set to 0.07 to 2, and a compressibility index of the spray material is set to 32% or less. Alternatively, a ratio of a flow volume of an application water carrier gas for carrying the application water to be introduced into the water injector to an application water volume is set to 100 to 1,000.

Abstract: A cooling device including a rectangular top plate in a plan view having a front surface on which a semiconductor module is disposed and a rear surface having a sidewall connection region, a flow pass region, and an outer edge region. The flow pass region includes a cooling region and first and second communicating regions that sandwich the cooling region therebetween from a short-side direction of the top plate. The sidewall connection region surrounds an outer periphery of the flow pass region. The outer edge region is outside of the sidewall connection region and closer to an edge of the top plate than is the flow pass region. The cooling region has a first thickness, and the outer edge region has a second thickness that is greater than the first thickness.

Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit board on which the semiconductor chip is disposed, a cooling plate having a second front surface to which the insulated circuit board is disposed, a bonding member which bonding the insulated circuit board to the cooling plate, a case which surrounds the semiconductor chip and the insulated circuit board and is bonded to the second front surface of the cooling plate with an adhesive therebetween and a sealing member which seals the semiconductor chip and the insulated circuit board over the cooling plate in the case. The cooling plate has a coupling portion which is a projection or a recess at the second front surface of the cooling plate, and the coupling portion has an engaging surface that is inclined to form an acute angle with the second front surface of the cooling plate.

Abstract: A data processing method of variable measurement data in an electronic control unit (ECU) is provided. The ECU that processes the data processing method calculates a filtering frequency based on a delay time frequency based on a transmission timing cycle of the measurement data and a processing timing cycle of the measurement data in the ECU, and also based on a pulsation frequency of the measurement data, and removes, from the measurement data, a component of the filtering frequency calculated in the calculation of the filtering frequency.

Abstract: A semiconductor module includes at least two semiconductor elements connected in parallel; a control circuit board placed between the at least two semiconductor elements; a control terminal for external connection; a first wiring member that connects the control terminal and the control circuit board; and a second wiring member that connects a control electrode of one of the at least two semiconductor elements and the control circuit board, wherein the second wiring member is wire-bonded from the control electrode towards the control circuit board, and has a first end on the control electrode and a second end on the control circuit board, the first end having a cut end face facing upward normal to a surface of the control electrode and the second end having a cut end face facing sideways parallel to a surface of the control circuit board.

Abstract: A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.

Abstract: A data processing method of variable measurement data in an electronic control unit (ECU) is provided. The ECU that processes the data processing method calculates a filtering frequency based on a delay time frequency based on a transmission timing cycle of the measurement data and a processing timing cycle of the measurement data in the ECU, and also based on a pulsation frequency of the measurement data, and removes, from the measurement data, a component of the filtering frequency calculated in the calculation of the filtering frequency.

Abstract: A data processing method is a data processing method in which variable measurement data transmitted from a sensor at a first cycle is computationally processed at a second cycle that is longer than the first cycle. The measurement data is acquired in a third cycle that is longer than the first cycle and shorter than the second cycle, an average value of the acquired measurement data is calculated at the second cycle, and computation processing thereof is performed.

Abstract: A semiconductor module is provided, including: a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to the upper surface electrode; a metal wiring plate electrically connected to the upper surface electrode of the semiconductor chip; and a sheet-like low elastic sheet provided on the metal wiring plate, the low elastic sheet having elastic modulus lower than that of the metal wiring plate. A manufacturing method for a semiconductor module is provided, including: providing a semiconductor chip; solder-bonding a metal wiring plate above said semiconductor chip; and applying a sheet-like low elastic sheet having the elastic modulus lower than that of said metal wiring plate to said metal wiring plate.

Abstract: A semiconductor apparatus includes first and second semiconductor chips, and a circuit board. The circuit board is a laminated board sequentially including an insulating plate, a circuit layer, and a metal layer. The circuit layer includes a first mounting portion on which the first semiconductor chip is installed, a second mounting portion on which the second semiconductor chip is installed, and a first and second upper surface slit provided between the first and second mounting portion and extending in a first direction. The metal layer includes a first lower surface slit extending in the first direction. In a plan view, the first mounting portion, the first upper surface slit, the second upper surface slit, and the second mounting portion are provided side by side in the second direction. The first lower surface slit is located within a range defined by the first and second upper surface slit.

Abstract: A semiconductor module includes a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, and a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material. The first bonding portion has a plurality of first protrusions at the bonding surface. Each first protrusion protrudes toward the semiconductor device, and is provided in a position away from the gate runner by a first distance in a plan view of the semiconductor module.