Patents by Inventor Takaharu Nishimura

Takaharu Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7803683
    Abstract: A semiconductor device includes an insulating film formed above an upper surface of a semiconductor substrate and including a contact hole, the contact hole including an upper portion and a lower portion located on the upper portion via a boundary as a first lower end of the upper portion and a first upper end of the lower portion, the boundary including a second inner width same as the first inner width, the lower portion including a second lower end having a third inner width narrower than the second inner width, a first conductive plug made from polycrystalline silicon and formed in the lower portion of the contact hole so that the exposed upper surface of the substrate is in contact with the first conductive plug, and a second conductive plug formed on the first conductive plug and made from a conductive material different from the polycrystalline silicon.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: September 28, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takaharu Nishimura
  • Patent number: 7790614
    Abstract: A method of manufacturing a semiconductor device includes forming on a lower insulating layer first to third electrically conducting layers sequentially, forming a mask pattern on the third conducting layer, dry-etching the first to third conducting layers with the mask pattern as a mask, thereby dividing the conducting layers, and forming an insulating layer between the adjacent second conducting layers by an HDP-CVD process so that a void is defined so as to be located lower than an interface between the first and second conducting layers and higher than an interface between the second and third conducting layers so as to have a sectional area larger than the second conducting layer. The forming of the insulating layer by the HDP-CVD process includes burying the insulating layer and sputtering to spread a frontage of a buried region buried by the burying process, both burying and sputtering being repeated alternately.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: September 7, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takaharu Nishimura
  • Patent number: 7730647
    Abstract: An object of the present invention is to provide a construction machine which precipitates the removal of earth that is churned up onto a vehicle body from the vehicle body, which reduces transfer loads on a blade bracket, which improves the attachability of the blade bracket, and which achieves standardization of the blade bracket. The construction machine according to the present invention is constituted such that a frame of a crawler belt-type traveling body comprises a center frame, a pair of truck frames disposed on the outside of two side portions of the center frame, a connecting member which connects the center frame to the truck frames, and a blade bracket which is joined to the center frame and the connecting member.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: June 8, 2010
    Assignee: Komatsu Utility Co., Ltd.
    Inventors: Yoshiteru Kubo, Sachio Shimizu, Shinichi Senba, Hiroyuki Takayama, Kouhei Urase, Takaharu Nishimura
  • Publication number: 20100022087
    Abstract: A semiconductor device includes an insulating film formed above an upper surface of a semiconductor substrate and including a contact hole, the contact hole including an upper portion and a lower portion located on the upper portion via a boundary as a first lower end of the upper portion and a first upper end of the lower portion, the boundary including a second inner width same as the first inner width, the lower portion including a second lower end having a third inner width narrower than the second inner width, a first conductive plug made from polycrystalline silicon and formed in the lower portion of the contact hole so that the exposed upper surface of the substrate is in contact with the first conductive plug, and a second conductive plug formed on the first conductive plug and made from a conductive material different from the polycrystalline silicon.
    Type: Application
    Filed: October 1, 2009
    Publication date: January 28, 2010
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Takaharu NISHIMURA
  • Patent number: 7615819
    Abstract: A semiconductor device includes a semiconductor substrate, an insulating film formed above an upper surface of the substrate and including a contact hole penetrating the insulating film, a wiring portion formed on the insulating film, and a contact plug formed in the contact hole and including a first conductive plug formed in a lower portion of the contact hole so that the exposed upper surface of the semiconductor substrate is in contact with the first conductive plug and a second conductive plug formed on the first conductive plug, so that the wiring portion is in contact with the second conductive plug. The first and second conductive plugs have an interface with a height that is lower than a height of the boundary portion relative to an upper surface of the semiconductor substrate.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: November 10, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takaharu Nishimura
  • Publication number: 20080138977
    Abstract: A semiconductor device includes a plurality of wirings disposed in parallel to each other and an insulating layer covering the wirings so that a void is defined between the wirings. Each wiring includes a metal wiring layer having a first side and a second side opposed to the first side, a first barrier metal layer having a third side in contact with the first layer and a fourth layer opposed to the third layer, and a second barrier metal layer having a fifth side in contact with the second side and a sixth side opposed to the fifth side. At least a part of the void is formed so as to be located nearer to the fourth side than an interface between the first and third sides and so as to be located nearer to the sixth side than an interface between the second and fifth sides. The void has a larger sectional area than the metal wiring layer.
    Type: Application
    Filed: February 14, 2008
    Publication date: June 12, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Takaharu NISHIMURA
  • Patent number: 7358613
    Abstract: A semiconductor device includes a plurality of wirings each wiring including a metal wiring layer, a first barrier metal layer disposed on the metal wiring layer, a second barrier metal layer disposed below the metal wiring layer, a first insulating layer disposed below the second barrier metal layer, and a second insulating layer covering the wirings so that a void is defined between the wirings. The void has a larger sectional area than the metal wiring layer and includes an upper portion located between the upper surface and the bottom surface of the first barrier metal layer. The void includes a bottom portion located between the upper surface and the bottom surface of the second barrier metal layer.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: April 15, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takaharu Nishimura
  • Publication number: 20080012146
    Abstract: A semiconductor device includes an insulating film formed above an upper surface of a semiconductor substrate and including a contact hole, the contact hole including an upper portion and a lower portion located on the upper portion via a boundary as a first lower end of the upper portion and a first upper end of the lower portion, the boundary including a second inner width same as the first inner width, the lower portion including a second lower end having a third inner width narrower than the second inner width, a first conductive plug made from polycrystalline silicon and formed in the lower portion of the contact hole so that the exposed upper surface of the substrate is in contact with the first conductive plug, and a second conductive plug formed on the first conductive plug and made from a conductive material different from the polycrystalline silicon.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 17, 2008
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Takaharu Nishimura
  • Patent number: 7293375
    Abstract: In a crawler frame in which legs in a center frame are formed from cast steel, a simple structure is achieved by reducing the number of components. To this end, the crawler frame, which has a center frame composed of a central frame section for supporting a swing bearing and legs located on the right and left sides of the central frame section; and track frames disposed on the sides of the distal ends of the legs, respectively, of the center frame, is designed such that each of the legs is bifurcated into front and rear leg sections and the front and rear leg sections are respectively formed from cast steel.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: November 13, 2007
    Assignees: Komatsu Ltd., Hitachi Construction Machinery Co., Ltd.
    Inventors: Akira Fukushima, Akio Ohta, Kohei Urase, Takaharu Nishimura
  • Patent number: 7204518
    Abstract: A construction machine where a load acting on a vehicle body during an operation is transferred to ensure the strength of the vehicle body, thereby improving reliability including welding reliability. In the construction machine, at least one of the height differences between an upper face or a lower face of the center frame at a joining portion between the center frame and the connecting member and an upper face or a lower face of a center joining portion of the connecting member is set respectively at a dimension that is approximately equal to or less than the thickness of an upper face plate or a lower face plate of the center frame.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: April 17, 2007
    Assignees: Komatsu Ltd., Komatsu Zenoah Co., Hitachi Construction Machinery Co., Ltd.
    Inventors: Yoshiteru Kubo, Shinichi Senba, Jun Noguchi, Kouhei Urase, Takaharu Nishimura
  • Patent number: 7204519
    Abstract: A construction machine where an operating load is transferred to a location having good rigidity, thereby ensuring the strength of a vehicle body and increasing the load-withstanding strength in relation to running loads. The frame of the lower traveling body of the construction machine comprising a hollow center frame having an upper plate with an attachment ring, a lower plate, and side plates that surrounding sides of the frame and that jut out from the attachment ring, and reinforcing ribs which connect the upper plate to the lower plate in the interior of the center frame beneath the attachment ring.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: April 17, 2007
    Assignees: Komatsu Ltd., Komatsu Zenoah Co., Hitachi Construction Machinery Co., Ltd.
    Inventors: Yoshiteru Kubo, Kenichi Shimizu, Shinichi Senba, Kouhei Urase, Takaharu Nishimura
  • Publication number: 20060214191
    Abstract: A semiconductor device includes a plurality of wirings disposed in parallel to each other and an insulating layer covering the wirings so that a void is defined between the wirings. Each wiring includes a metal wiring layer having a first side and a second side opposed to the first side, a first barrier metal layer having a third side in contact with the first layer and a fourth layer opposed to the third layer, and a second barrier metal layer having a fifth side in contact with the second side and a sixth side opposed to the fifth side. At least a part of the void is formed so as to be located nearer to the fourth side than an interface between the first and third sides and so as to be located nearer to the sixth side than an interface between the second and fifth sides. The void has a larger sectional area than the metal wiring layer.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 28, 2006
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Takaharu Nishimura
  • Patent number: 6922925
    Abstract: A construction machine of the present invention is provided, in a compartment formed by a cover, with an engine, a centrifugal fan, and a heat exchanger for exchanging heat between cooling air blown by the centrifugal fan and a specified medium, wherein the centrifugal fan and the heat exchanger are arranged further upstream than the engine with respect to flow of cooling air, so that cooling air sucked in by the centrifugal fan is led to the engine after passing through the heat exchanger.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: August 2, 2005
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Osamu Watanabe, Seiichiro Takeshita, Takaharu Nishimura, Kazuyoshi Yamada, Makoto Sugaya, Makoto Motozu, Naohiro Ishikawa, Shougo Kimura
  • Publication number: 20040244230
    Abstract: An object of the present invention is to provide a construction machine which precipitates the removal of earth that is churned up onto a vehicle body from the vehicle body, which reduces transfer loads on a blade bracket, which improves the attachability of the blade bracket, and which achieves standardization of the blade bracket. The construction machine according to the present invention is constituted such that a frame of a crawler belt-type traveling body comprises a center frame, a pair of truck frames disposed on the outside of two side portions of the center frame, a connecting member which connects the center frame to the truck frames, and a blade bracket which is joined to the center frame and the connecting member.
    Type: Application
    Filed: May 19, 2004
    Publication date: December 9, 2004
    Inventors: Yoshiteru Kubo, Sachio Shimizu, Shinichi Senba, Hiroyuki Takayama, Kouhei Urase, Takaharu Nishimura
  • Publication number: 20040244231
    Abstract: An object of the present invention is to provide a construction machine in which an operating load is transferred to a location having good rigidity, thereby securing the strength of a vehicle body, and which is also capable of realizing an increase in the load-withstanding strength in relation to running loads, thereby improving reliability.
    Type: Application
    Filed: May 19, 2004
    Publication date: December 9, 2004
    Inventors: Yoshiteru Kubo, Kenichi Shimizu, Shinichi Senba, Kouhei Urase, Takaharu Nishimura
  • Publication number: 20040232687
    Abstract: An object of the present invention is to provide a construction machine in which a load acting on a vehicle body during an operation is transferred appropriately, thereby ensuring the strength of the vehicle body and improving reliability, and in which welding reliability can also be improved.
    Type: Application
    Filed: May 19, 2004
    Publication date: November 25, 2004
    Inventors: Yoshiteru Kubo, Shinichi Senba, Jun Noguchi, Kouhei Urase, Takaharu Nishimura
  • Publication number: 20040177533
    Abstract: In a crawler frame in which legs in a center frame are formed from cast steel, a simple structure is achieved by reducing the number of components. To this end, the crawler frame, which has a center frame composed of a central frame section for supporting a swing bearing and legs located on the right and left sides of the central frame section; and track frames disposed on the sides of the distal ends of the legs, respectively, of the center frame, is designed such that each of the legs is bifurcated into front and rear leg sections and the front and rear leg sections are respectively formed from cast steel.
    Type: Application
    Filed: February 27, 2004
    Publication date: September 16, 2004
    Applicants: KOMATSU LTD., HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Akira Fukushima, Akio Ohta, Kohei Urase, Takaharu Nishimura
  • Publication number: 20030110669
    Abstract: A construction machine of the present invention is provided, in a compartment formed by a cover, with an engine, a centrifugal fan, and a heat exchanger for exchanging heat between cooling air blown by the centrifugal fan and a specified medium, wherein the centrifugal fan and the heat exchanger are arranged further upstream than the engine with respect to flow of cooling air, so that cooling air sucked in by the centrifugal fan is led to the engine after passing through the heat exchanger.
    Type: Application
    Filed: October 15, 2002
    Publication date: June 19, 2003
    Inventors: Osamu Watanabe, Seiichiro Takeshita, Takaharu Nishimura, Kazuyoshi Yamada, Makoto Sugaya, Makoto Motozu, Naohiro Ishikawa, Shougo Kimura
  • Patent number: 6170588
    Abstract: A revolving construction machine includes a lower track structure, an upper revolving structure mounted on the lower track structure and a working device mounted to the front of the upper revolving structure. A floor panel portion is provided on the upper revolving structure. A walk-through passageway is defined by a left-hand floor panel portion, a left side portion of a cabin cover and a left-hand cover of an engine cover for allowing a person to walk through the construction machine in the front and rear directions by passing the left side of an operator's seat, the cabin cover and the engine cover.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: January 9, 2001
    Assignees: Hitachi Construction Machinery Co., Ltd., Hokuetsu Industries Co., Ltd.
    Inventors: Teruo Irino, Takaharu Nishimura, Shinichiro Endo
  • Patent number: 5975833
    Abstract: An upper cover has a curved portion formed in its end portion on the side near a work front for avoiding interference with the work front. The curved portion comprises a recessed surface having a center axis aligned with the axis of a vertical pin of a swing post, a first stepped portion provided at a lower end of the recessed surface and defining a substantially constant gap with respect to a locus drawn by a rear projecting portion of the swing post when the work front is swung, and a second stepped portion provided in an intermediate portion of the recessed surface in the direction of height thereof and having a substantially horizontal surface for assuring a foothold. The recessed surface is configured to extend along a locus drawn by a back surface of the boom when the work front is swung in its minimum-turn posture, while defining a gap with respect to the locus.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: November 2, 1999
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Kazuyoshi Yamada, Masashi Kobori, Takaharu Nishimura