Abstract: A transfer device 5 transfers a fine transfer pattern M1 formed on a mold M to a molding target W. The transfer device includes: a base member 47 including a press body 31; a moving member 49 including a molding target placing body 33 that sandwiches and presses the mold M and the molding target W in cooperation with the press body 31, and is provided on the base member 47 so that the molding target placing body 33 can move; and a moving body supporting body 51 that includes a guide portion 71, and is engaged with and provided integrally on the base member 47 only in a region of the base member 47 elastically deformed very slightly by reaction force when the press is performed, the region being a region where a flexure angle becomes substantially “0”.

Abstract: A conveying/positioning device includes: a unused-mold placing device 9 that places a rolled mold MB of a sheet-shaped mold M thereon; a mold rolling-up device 11 that rolls up the flat sheet-shaped mold MA supplied from the unused-mold placing device 9; and a tension maintaining device that constantly maintains a tension of the flat sheet-shaped mold even if a form of the flat sheet-shaped mold is changed when the peeling is performed.

Abstract: A method for manufacturing a device having a concavo-convex structure includes forming an organic resist film on an n-type semiconductor layer in which a fine concavo-convex structure is to be formed; forming a silicon-containing resist film on the organic resist film; patterning the silicon-containing resist film by nanoimprint; oxidizing the silicon-containing resist film with oxygen-containing plasma to form a silicon oxide film; dry-etching the organic resist film by using the silicon oxide film as an etching mask; dry-etching the n-type semiconductor layer by using the silicon oxide film and the organic resist film as an etching masks; and removing the silicon oxide film and the organic resist film.

Abstract: A semiconductor light emitting element including, in a light extraction layer thereof, a photonic crystal periodic structure including two systems (structures) with different refractive indices. An interface between the two systems (structures) satisfies Bragg scattering conditions, and the photonic crystal periodic structure has a photonic band gap.

Abstract: A method for manufacturing a device having a concavo-convex structure includes forming an organic resist film on an n-type semiconductor layer in which a fine concavo-convex structure is to be formed; forming a silicon-containing resist film on the organic resist film; patterning the silicon-containing resist film by nanoimprint; oxidizing the silicon-containing resist film with oxygen-containing plasma to form a silicon oxide film; dry-etching the organic resist film by using the silicon oxide film as an etching mask; dry-etching the n-type semiconductor layer by using the silicon oxide film and the organic resist film as an etching masks; and removing the silicon oxide film and the organic resist film.

Abstract: A demolding device (7) transfers a fine transfer pattern formed on a sheet-shaped mold to a molded product, and then detaches the sheet-shaped mold, which adheres to the molded product, from the molded product. The demolding device (7) includes a molded product holder (19) placed in a location away from a transfer device (5) and configured to hold a molded product (W) out of a mold (MA) and the molded product (W) adhering to each other, and a detaching roller unit (23) on which the mold (MA) adhering to the molded product (W) held by the molded product holder (19) is wound, and which is configured to move relative to the molded product holder (19) and thereby to detach the mold (MA) from the molded product (W).

Abstract: A transfer device 5 transfers a fine transfer pattern M1 formed on a mold M to a molding target W. The transfer device includes: a base member 47 including a press body 31; a moving member 49 including a molding target placing body 33 that sandwiches and presses the mold M and the molding target W in cooperation with the press body 31, and is provided on the base member 47 so that the molding target placing body 33 can move; and a moving body supporting body 51 that includes a guide portion 71, and is engaged with and provided integrally on the base member 47 only in a region of the base member 47 elastically deformed very slightly by reaction force when the press is performed, the region being a region where a flexure angle becomes substantially “0”.

Abstract: A conveying/positioning device includes: a unused-mold placing device 9 that places a rolled mold MB of a sheet-shaped mold M thereon; a mold rolling-up device 11 that rolls up the flat sheet-shaped mold MA supplied from the unused-mold placing device 9; and a tension maintaining device that constantly maintains a tension of the flat sheet-shaped mold even if a form of the flat sheet-shaped mold is changed when the peeling is performed.

Abstract: A sheet-shaped mold position detection device 183 for conveying and positioning a sheet-shaped mold M on which a fine transfer pattern M1 is formed. The sheet-shaped mold position dejection device 183 includes a sheet-shaped mold position detector 191 that detects a predetermined region of the sheet-shaped mold M by detecting transmittance of light in the sheet-shaped mold M.

Abstract: A transfer system 1 comprising: a conveying/positioning device 3 configured to convey and position a flat sheet-shaped mold MA in a predetermined direction, on which a fine transfer pattern M1 is formed; a transfer device 5 configured to transfer the fine transfer pattern M1 to a molding target W, the transfer device 5 being provided on an upstream side in the conveying direction of the sheet-shaped mold MA; and a peeling device 7 configured to peel off the sheet-shaped mold MA and the molding target from those mutually clinging to each other, after the transfer by the transfer device 5 is performed and the conveyance by the conveying/positioning device 3 is performed, the peeling device 7 being provided on a downstream side in the conveying direction of the sheet-shaped mold MA.

Abstract: A glass-shaping mold includes a steel base member, and a crystallized, machined layer, an intermediate layer and a mold-releasing layer which are sequentially formed on the base member. The machined layer is a layer of nickel alloy containing phosphorus. The intermediate layer is a layer formed of chromium, nickel, copper or cobalt. Alternatively, the intermediate layer is a layer of an alloy layer containing at least one of these elements. The mold-releasing layer is a layer of an alloy containing iridium and rhenium.

Abstract: A glass-shaping mold includes a steel base member, and a crystallized, machined layer, an intermediate layer and a mold-releasing layer which are sequentially formed on the base member. The machined layer is a layer of nickel alloy containing phosphorus. The intermediate layer is a layer formed of chromium, nickel, copper or cobalt. Alternatively, the intermediate layer is a layer of an alloy layer containing at least one of these elements. The mold-releasing layer is a layer of an alloy containing iridium and rhenium.

Abstract: A method for manufacturing a glass molding die includes forming a substrate by hardening a steel material containing 0.3 wt % or more and 2.7 wt % or less of carbon and 13 wt % or less of chromium, and further containing at least one additive selected from 0.5 wt % or more and 3 wt % or less of molybdenum, 0.1 wt % or more and 5 wt % or less of vanadium, and 1 wt % or more and 7 wt % or less of tungsten, and then tempering the steel material at a temperature of 400° C. or higher and 650° C. or lower, forming a surface coating layer composed of an amorphous Ni—P alloy on the surface of the substrate, and heating the surface coating layer thereby rendering the surface coating layer an eutectic structure composed of Ni and Ni3P.