Patents by Inventor Takahide Masuda

Takahide Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin film device having lead conductor film
    Patent number: 7974042
    Abstract: The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: July 5, 2011
    Assignee: TDK Corporation
    Inventors: Takahide Masuda, Masashi Sano, Hiroki Aritomo
  • MANUFACTURING METHOD OF THIN-FILM MAGNETIC HEAD WITH DISHING SUPPRESSED DURING POLISHING
    Publication number: 20090086381
    Abstract: A manufacturing method of a thin-film magnetic head with a dishing suppressed in the case of planarizing a magnetic shield which a read head portion has or a magnetic pole which a write head portion has is provided.
    Type: Application
    Filed: October 1, 2007
    Publication date: April 2, 2009
    Applicant: TDK CORPORATION
    Inventors: Tetsuya HIRAKI, Seiji YARI, Yasufumi UNO, Hideaki SATO, Takahide MASUDA, Kazuhiro KOBAYASHI
  • THIN FILM DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20080261079
    Abstract: The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.
    Type: Application
    Filed: April 18, 2007
    Publication date: October 23, 2008
    Applicant: TDK CORPORATION
    Inventors: Takahide MASUDA, Masashi Sano, Hiroki Aritomo