Abstract: The present invention provides a film forming apparatus that can reduce the adherence of thin film material particles to a holding mechanism included in a substrate tray at the time of film formation. In an embodiment of the present invention, a sputtering chamber includes the substrate tray that has bottom clamps and side clamps, a movement mechanism that changes the position of the side clamps between when the film is formed on the substrate and when the substrate is transferred and a mask that has an opening of a predetermined shape through which sputter particles from a cathode pass. At the time of transfer, the movement mechanism moves the side clamps such that the side clamps hold the substrate; at the time of film formation, the movement mechanism moves the side clamps toward the outside of the substrate tray.

Abstract: Four masks respectively corresponding to the four sides of a rectangular glass substrate are prepared. The four masks are set in a deposition chamber in a divisional state. When the masks are moved linearly on a plane flush with the glass substrate in directions perpendicular to the respective sides of the glass substrate, the divisional masks are connected to each other and form a mask as one assembly. At this time, the masks cover the periphery of the glass substrate entirely.