Abstract: Provided is a chip mounter, an electronic circuit substrate, and a power module, where the chip mounter prevents foreign substances from a chip-mounter installation environment, dust generated from members, and dust generated from the chip mounter, thereby preventing failures caused by the foreign substances. The chip mounter takes out a chip component accommodated in a packing tape. The packing tape has a pocket. The pocket has a bottom surface provided with a through hole. The chip mounter includes a tape travelling rail, a sucking-and-mounting arm, and a cavity cleaning mechanism. The cavity cleaning mechanism includes an intake hole disposed upstream of a suction point, in a location of the tape travelling rail, on which the carrier tape with a cover tape attached thereto travels so as to overlap the through hole. The cavity cleaning mechanism takes in the inside of the pocket through the intake hole and the through hole.

Abstract: Provided is a chip mounter, an electronic circuit substrate, and a power module, where the chip mounter prevents foreign substances from a chip-mounter installation environment, dust generated from members, and dust generated from the chip mounter, thereby preventing failures caused by the foreign substances. The chip mounter takes out a chip component accommodated in a packing tape. The packing tape has a pocket. The pocket has a bottom surface provided with a through hole. The chip mounter includes a tape travelling rail, a sucking-and-mounting arm, and a cavity cleaning mechanism. The cavity cleaning mechanism includes an intake hole disposed upstream of a suction point, in a location of the tape travelling rail, on which the carrier tape with a cover tape attached thereto travels so as to overlap the through hole. The cavity cleaning mechanism takes in the inside of the pocket through the intake hole and the through hole.