Abstract: The CPU includes a plurality of CPU cores. The temperature determination unit determines whether or not the temperature indicated by the acquired temperature information is equal to or higher than a threshold value. When it is determined that the temperature indicated by the temperature data is equal to or higher than the threshold value, the thermal generation control unit performs thermal generation control on the CPU. The group data includes high-priority group information specifying a CPU core of a first group to which execute of a high-priority application is allocated in the CPU, and low-priority group information specifying a CPU core of a low-priority group to which execution of a low-priority application is allocated in the CPU. Based on the group data, the control target determining unit determines a CPU core to be subjected to thermal generation control from among the CPU cores of the low priority group.

Abstract: A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.

Abstract: The semiconductor device includes a plurality of cores, a sensor for detecting a temperature, and a control circuit configured to obtain each power consumption of the respective cores so as to select the core as a control object in accordance with the obtained power consumption.

Abstract: The CPU includes a plurality of CPU cores. The temperature determination unit determines whether or not the temperature indicated by the acquired temperature information is equal to or higher than a threshold value. When it is determined that the temperature indicated by the temperature data is equal to or higher than the threshold value, the thermal generation control unit performs thermal generation control on the CPU. The group data includes high-priority group information specifying a CPU core of a first group to which execute of a high-priority application is allocated in the CPU, and low-priority group information specifying a CPU core of a low-priority group to which execution of a low-priority application is allocated in the CPU. Based on the group data, the control target determining unit determines a CPU core to be subjected to thermal generation control from among the CPU cores of the low priority group.

Abstract: An operating condition is controlled from viewpoints both processing capacity and power consumption. A CPU 11 includes, for example, a plurality of CPU cores 11a to 11d, and configured to such that an operating condition can be varied. A performance table 26 is a table representing a relationship between the operating condition of the CPU 11 and the processing capacity of the CPU 11. A power consumption table 27 is a table representing a relationship between the operating condition of the CPU 11 and power consumption. An operation control unit 22 controls the operating condition of the CPU 11 referring to the performance table 26 and the power consumption table 27.

Abstract: The semiconductor integrated circuit includes a plurality of CPUs (big CPU and LITTLE CPU). Each of CPUs has a different performance respectively. The semiconductor integrated circuit determines an effective CPU allocated to a task realized by at least one of the plurality of functional blocks according to the device table defining a relationship between the plurality of functional blocks and any one of the plurality of CPUs.

Abstract: A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.

Abstract: A semiconductor device includes a mode determination unit configured to determine a power mode based on a temperature of the semiconductor device and a reference temperature, the power mode including one of a first mode which sets the operating frequency of the operation clock to be a first operating frequency and a second mode which sets the operating frequency of the operation clock to be a second operating frequency, and output a control signal according to the power mode to a clock generating unit.

Abstract: The semiconductor device includes a plurality of cores, a sensor for detecting a temperature, and a control circuit configured to obtain each power consumption of the respective cores so as to select the core as a control object in accordance with the obtained power consumption.

Abstract: An operating condition is controlled from viewpoints both processing capacity and power consumption. A CPU 11 includes, for example, a plurality of CPU cores 11a to 11d, and configured to such that an operating condition can be varied. A performance table 26 is a table representing a relationship between the operating condition of the CPU 11 and the processing capacity of the CPU 11. A power consumption table 27 is a table representing a relationship between the operating condition of the CPU 11 and power consumption. An operation control unit 22 controls the operating condition of the CPU 11 referring to the performance table 26 and the power consumption table 27.

Abstract: A semiconductor device includes a mode determination unit configured to determine a power mode based on a temperature of the semiconductor device and a reference temperature, the power mode including one of a first mode which sets the operating frequency of the operation clock to be a first operating frequency and a second mode which sets the operating frequency of the operation clock to be a second operating frequency, and output a control signal according to the power mode to a clock generating unit.

Abstract: A semiconductor device includes an operation unit (CPU) provided in a semiconductor chip and a temperature sensor (TS) that measures a temperature of the semiconductor chip. The semiconductor device compares a measured temperature (Ta) measured by the temperature sensor (TS) with a predetermined reference temperature (Tref). When the measured temperature (Ta) is higher than the reference temperature (Tref), the semiconductor device switches a frequency of an operation clock to be supplied to the operation unit (CPU) from a first frequency to a second frequency higher than the first frequency.

Abstract: A semiconductor device includes an operation unit (CPU) provided in a semiconductor chip and a temperature sensor (TS) that measures a temperature of the semiconductor chip. The semiconductor device compares a measured temperature (Ta) measured by the temperature sensor (TS) with a predetermined reference temperature (Tref). When the measured temperature (Ta) is higher than the reference temperature (Tref), the semiconductor device switches a frequency of an operation clock to be supplied to the operation unit (CPU) from a first frequency to a second frequency higher than the first frequency.