Abstract: A main management software equipped on a managing apparatus determines electronic components to be mounted by each electronic components mounting machine on the basis of information relating to a board to be manufactured; sends information relating to the electronic components to be mounted to at least one piece of sub-management software or the main management software itself that has, as a management target, the electronic components mounting machine to mount the electronic components; acquires information relating to preset items extracted from calculation results obtained using a manufacturing program for mounting the electronic components and sent from each of the sub-management software and the main management software itself; and adjusts the electronic components to be mounted by each electronic components mounting machine on the basis of the acquired information relating to the items and the information relating to the board to be manufactured.

Abstract: An electronic component mounting apparatus includes an electronic component supply device for supplying an electronic component, a head including a head main body and a head camera unit, and a control device. The head main body includes nozzles, a nozzle drive unit for driving the nozzles and a head support body for supporting the nozzles and the nozzle drive unit. The head camera unit is fixed to the head support body and has head cameras corresponding to the nozzles respectively for photographing electronic components. The head drives the nozzles to hold the electronic components, transfers the electronic components from the electronic component supply device to the substrate and mounts the electronic components onto the substrate. The control device synthesizes images photographed by the head cameras to generate an image with fields of the head cameras connected together, and determines a process based on the synthesized image synthesized.

Abstract: A main management software equipped on a managing apparatus determines electronic components to be mounted by each electronic components mounting machine on the basis of information relating to a board to be manufactured; sends information relating to the electronic components to be mounted to at least one piece of sub-management software or the main management software itself that has, as a management target, the electronic components mounting machine to mount the electronic components; acquires information relating to preset items extracted from calculation results obtained using a manufacturing program for mounting the electronic components and sent from each of the sub-management software and the main management software itself; and adjusts the electronic components to be mounted by each electronic components mounting machine on the basis of the acquired information relating to the items and the information relating to the board to be manufactured.

Abstract: An electronic component mounting apparatus includes an electronic component supply device for supplying an electronic component, a head including a head main body and a head camera unit, and a control device. The head main body includes nozzles, a nozzle drive unit for driving the nozzles and a head support body for supporting the nozzles and the nozzle drive unit. The head camera unit is fixed to the head support body and has head cameras corresponding to the nozzles respectively for photographing electronic components. The head drives the nozzles to hold the electronic components, transfers the electronic components from the electronic component supply device to the substrate and mounts the electronic components onto the substrate. The control device synthesizes images photographed by the head cameras to generate an image with fields of the head cameras connected together, and determines a process based on the synthesized image synthesized.