Abstract: A circuit board includes an insulating layer that is layered on a substrate; and a dam member in a form of a rectangular frame that is formed on the insulating layer. A corner part of the dam member includes a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes contact with the surface of the insulating layer; and a perpendicular part that is perpendicular to the surface of the insulating layer in an upper part separated from the surface of the insulating layer.

Abstract: A terminal structure includes a wiring layer, a protective insulation layer, an open portion, and a connection terminal. The protective insulation layer covers the wiring layer. The open portion extends through the protective insulation layer in a thickness-wise direction to expose part of an upper surface of the wiring layer. The connection terminal is formed on the wiring layer exposed from the open portion. The open portion includes a wall surface, a depression, and a projection. The wall surface extends downward from an upper surface of the protective insulation layer. The depression is depressed into the protective insulation layer from the wall surface toward an outer side of the open portion. The projection is formed under the depression, continuously with the depression, and projected from the depression into the open portion further inward than the wall surface in a plan view. The depression is filled with the connection terminal.

Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.

Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.

Abstract: A wiring substrate includes a first insulation layer, an electronic component including a first surface and a second surface which is an opposite surface to the first surface, the electronic component being mounted on the first insulation layer with the first surface facing toward the first insulation layer, and a second insulation layer including a first layer and a second layer. The first layer is formed on the first insulation layer and configured to cover the second surface of the electronic component, and the second layer is stacked on the first layer. The first layer includes therein fillers. At least one of the fillers is in direct contact with the second surface of the electronic component at one side, and is exposed from the first layer and is thus in direct contact with the second layer at the other side.

Abstract: A terminal structure includes a wiring layer, a protective insulation layer, an open portion, and a connection terminal. The protective insulation layer covers the wiring layer. The open portion extends through the protective insulation layer in a thickness-wise direction to expose part of an upper surface of the wiring layer. The connection terminal is formed on the wiring layer exposed from the open portion. The open portion includes a wall surface, a depression, and a projection. The wall surface extends downward from an upper surface of the protective insulation layer. The depression is depressed into the protective insulation layer from the wall surface toward an outer side of the open portion. The projection is formed under the depression, continuously with the depression, and projected from the depression into the open portion further inward than the wall surface in a plan view. The depression is filled with the connection terminal.

Abstract: A wiring substrate includes a first insulation layer, an electronic component including a first surface and a second surface which is an opposite surface to the first surface, the electronic component being mounted on the first insulation layer with the first surface facing toward the first insulation layer, and a second insulation layer including a first layer and a second layer. The first layer is formed on the first insulation layer and configured to cover the second surface of the electronic component, and the second layer is stacked on the first layer. The first layer includes therein fillers. At least one of the fillers is in direct contact with the second surface of the electronic component at one side, and is exposed from the first layer and is thus in direct contact with the second layer at the other side.

Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.

Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.

Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.

Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.

Abstract: A wiring board, includes a core substrate that includes first pads for mounting a semiconductor chip, second pads provided at the periphery of the first pads, and a solder resist layer that selectively exposes the first pads and the second pads; a first insulation layer, formed on the solder resist layer, including an opening to be formed in a frame shape such that to expose the first pads and cover the second pads; and external connection terminals penetrating the first insulation layer to be electrically connected to the second pads, respectively, and partially exposed from the first insulation layer, wherein the core substrate includes a second insulation layer, wherein the first pads, the second pads and the solder resist layer are directly formed on the second insulation layer, and wherein a rim of an inner wall surface of the opening at the core substrate side contacts the solder resist layer.