Abstract: The present invention provides a transparent electrically conductive substrate having excellent adhesive strength between a transparent electrically conducting film such as ITO and a metal electrode and between a plastic sheet or film substrate and the transparent electrically conducting film, wherein the transparent plastic film substrate, the transparent electrically conducting film, and the metal electrode are formed in this order. The transparent electrically conductive substrate is provided with a transparent electrically conducting film formed on one or both surfaces of the transparent plastic substrate, and a metal electrode on each transparent electrically conducting film, wherein the transparent electrically conductive substrate has a delamination strength of 0.5 kg/cm or higher between the plastic substrate and each layer.

Abstract: A circuit substrate with a resistance layer and a process for producing the same are disclosed. The circuit substrate comprises an electrically insulating layer, a resistance layer bonded to at least one surface of the electrically insulating layer and a highly conductive material layer bonded to the resistance layer, and has a high sheet resistance value. The resistance layer comprises an alloy containing tin, nickel, sulfur and optionally specific elements.

Abstract: A product with a compound membrane which comprises a molded substrate, a metal membrane having an average thickness equal to or less than the maximum surface roughness of the molded substrate on the molded substrate and a dielectric membrane having a thickness of 100 .ANG. or more on the metal membrane.

Abstract: A transparent electrically conductive film and processes for the production thereof are described, said film comprising a metallic oxide wherein the metallic component comprises from 60 to 95 wt % indium and from 40 to 5 wt % tin formed on the surface of a plastic base, wherein the weight ratio of the tin to the indium changes continuously from the outer surface to the inner surface in such a manner that the ratio on the inner surface of the film is appreciably lower than the average ratio of the film and the ratio on the outer surface of the film is appreciably higher than the average ratio of the film.