Abstract: A linear motor system includes: a mover including permanent magnets arranged in a traveling direction in a plane parallel to a plane formed by the traveling direction and a vertical direction; and a stator including an armature including an iron core in which projections around which windings are wound are arranged in the traveling direction, the armature being disposed to face the permanent magnets of the mover. The mover includes a mover body including a first main roller engaged with a first traveling surface disposed on the stator, a placing table on which a conveyance object is placed, and a sub-roller engaged with a second traveling surface disposed on an upper surface of the stator. The first main roller supports a magnetic attraction force generated between the stator and the mover, and the sub-roller supports a force in a direction opposite the magnetic attraction force acting on the mover.

Abstract: A wear amount estimation device estimates the amount of wear on mover wheels of a conveying device having a mover movable by a wheel-type guide mechanism, the mover being driven and controlled by a linear motor. The wear amount estimation device includes: a data acquisition unit that acquires, as estimation data, information on a control current flowing through the linear motor in order to drive and control the mover and information on a controlled position or speed of the driven mover; a storage unit that stores a wear amount estimation model for estimating the amount of wear; and a calculation unit that estimates the amount of wear by inputting the estimation data to the wear amount estimation model.

Abstract: A linear motor system includes: a mover including permanent magnets arranged in a traveling direction in a plane parallel to a plane formed by the traveling direction and a vertical direction; and a stator including an armature including an iron core in which projections around which windings are wound are arranged in the traveling direction, the armature being disposed to face the permanent magnets of the mover. The mover includes a mover body including a first main roller engaged with a first traveling surface disposed on the stator, a placing table on which a conveyance object is placed, and a sub-roller engaged with a second traveling surface disposed on an upper surface of the stator. The first main roller supports a magnetic attraction force generated between the stator and the mover, and the sub-roller supports a force in a direction opposite the magnetic attraction force acting on the mover.

Abstract: A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.

Abstract: A semiconductor device includes a base plate, a case, and a collar. The base plate includes a metal or an alloy. The base plate has a first bolt hole. The case includes a resin. The case has a first main surface and a second main surface. The second main surface is in contact with the base plate. The case has a through-hole. The collar includes a metal or an alloy. The collar is located within the through-hole. The collar has a first end and a second end. The first end is located on a side where the first main surface is located. The second end is located on a side where the second main surface is located. The collar has a second bolt hole. The first end has a flange. Alternatively, the collar has an outer circumferential surface. The outer circumferential surface has a straight knurling.

Abstract: A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.

Abstract: An object of the present invention is to provide a semiconductor device capable of reducing external stress transmitted to a semiconductor chip through a lead frame. A semiconductor device includes a base plate, a semiconductor element held on the base plate, a housing disposed on the base plate and having a frame shape enclosing the semiconductor element, a terminal section provided in an outer surface of the housing and connectable to an external device, a lead frame that is long and has one end disposed so as to be connectable to the terminal section provided in the housing and another end connected onto the semiconductor element via a bonding material, a sealing material disposed in the housing to seal the lead frame and the semiconductor element, and a fixing section that fixes, in the housing, part of the lead frame to the base plate or the housing.

Abstract: An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.

Abstract: An object of the present invention is to synchronize PWM between individual phases of an IPM, so that the IPM has a simplified-scale circuit. An IPM according to the present invention includes a DC-DC converter including a multi-phase arm having a plurality of phase arms connected in parallel on a secondary side, a secondary-wire-voltage detection circuit configured to detect a secondary wire voltage in each phase arm of the DC-DC converter, and a synchronization-signal generation circuit configured to generate a synchronization signal in each phase arm on the basis of the behavior of the secondary wire voltage.

Abstract: An object of the present invention is to provide a semiconductor device capable of reducing external stress transmitted to a semiconductor chip through a lead frame. A semiconductor device includes a base plate, a semiconductor element held on the base plate, a housing disposed on the base plate and having a frame shape enclosing the semiconductor element, a terminal section provided in an outer surface of the housing and connectable to an external device, a lead frame that is long and has one end disposed so as to be connectable to the terminal section provided in the housing and another end connected onto the semiconductor element via a bonding material, a sealing material disposed in the housing to seal the lead frame and the semiconductor element, and a fixing section that fixes, in the housing, part of the lead frame to the base plate or the housing.

Abstract: An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.

Abstract: An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.

Abstract: An object of the present invention is to synchronize PWM between individual phases of an IPM, so that the IPM has a simplified-scale circuit. An IPM according to the present invention includes a DC-DC converter including a multi-phase arm having a plurality of phase arms connected in parallel on a secondary side, a secondary-wire-voltage detection circuit configured to detect a secondary wire voltage in each phase arm of the DC-DC converter, and a synchronization-signal generation circuit configured to generate a synchronization signal in each phase arm on the basis of the behavior of the secondary wire voltage.

Abstract: An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.

Abstract: A control apparatus comprises: a synchronization unit that transmits control information set in a communication node to another control apparatus that operates in synchronization with the control apparatus and synchronizes with the another control apparatus; and a control information creation unit that creates control information to be set in a communication node to be controlled. If the created control information is first control information set temporarily in accordance with a notification from the communication node to be controlled, the control apparatus sets the first control information in the communication node without waiting to synchronize with the another control apparatus. If control information to be set is second control information other than the first control information, the control apparatus sets the second control information in the communication node after synchronizing with the another control apparatus.

Abstract: A network system of the present invention includes a switch and controllers. The switch processes on a received packet in accordance with a flow entry in which are defined a rule and an action. The controllers set the flow entry to a flow table of the switch. The switch assigns a flow table to each controller, searches when receiving a packet from outside for a flow table matching with the packet in all flow tables, ignores a flow entry set by a controller of which a status of connection is invalid among flow entries matching with the packet and processes the packet in accordance with an action of a flow entry set by a controller of which a status of connection is valid.

Abstract: A control apparatus comprises: a synchronization unit that transmits control information set in a communication node to another control apparatus that operates in synchronization with the control apparatus and synchronizes with the another control apparatus; and a control information creation unit that creates control information to be set in a communication node to be controlled. If the created control information is first control information set temporarily in accordance with a notification from the communication node to be controlled, the control apparatus sets the first control information in the communication node without waiting to synchronize with the another control apparatus. If control information to be set is second control information other than the first control information, the control apparatus sets the second control information in the communication node after synchronizing with the another control apparatus.

Abstract: A network system of the present invention includes a switch and controllers. The switch processes on a received packet in accordance with a flow entry in which are defined a rule and an action. The controllers set the flow entry to a flow table of the switch. The switch assigns a flow table to each controller, searches when receiving a packet from outside for a flow table matching with the packet in all flow tables, ignores a flow entry set by a controller of which a status of connection is invalid among flow entries matching with the packet and processes the packet in accordance with an action of a flow entry set by a controller of which a status of connection is valid.