Patents by Inventor Takahiko Ohkohchi

Takahiko Ohkohchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thick film circuit board
    Patent number: 4581279
    Abstract: A thick film circuit board comprises at least parts of SiC substrate at which a thick film resistor is provided being coated with a glass layer having a good adhesion to the SiC substrate and the same or similar coefficient of thermal expansion as or to that of the SiC substrate, and no swelling, cracking and peeling appear on the thick film resistor and no electroconductive component is formed on laser-trimmed parts of the thick film resistor.
    Type: Grant
    Filed: December 29, 1983
    Date of Patent: April 8, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Nobuyuki Sugishita, Hideo Suzuki, Takahiko Ohkohchi