Abstract: Use of at least one microRNA comprising a nucleotide sequence set forth in any of SEQ ID NOS: 1 to 15 in a biological sample derived from a subject as a pancreatic cancer biomarker, wherein the pancreatic cancer biomarker is for determining whether the subject suffers from pancreatic cancer, for determining a pathological condition of the subject suffering or suffered from pancreatic cancer, or for identifying a test substance capable of treating pancreatic cancer.

Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.

Abstract: An internal combustion engine exhaust gas purifying catalyst carrier has a core body formed of a CeO2—ZrO2 solid solution or a CeO2—ZrO2—La2O2 solid solution, and CeO2 supported on the surface of the core body, wherein the core body has a CeO2 content of 5 to 35 mass % and an La2O2 content of 0 to 10 mass %, on the basis of the mass of the carrier, and the amount of CeO2 supported on the core body is 5 to 17 mass %, on the basis of the mass of the carrier.

Abstract: An electroconductive particle having a core particle and a tin oxide-containing coating layer on the core particle. The tin oxide of the coating layer has a crystallite size of 70 to 200 ?. The electroconductive particle preferably has a ratio of R3 to R1 of 1 to 250, wherein R1 and R3 are respective surface resistivities of electroconductive films formed of a coating composition containing the electroconductive particle and prepared by 1-hour dispersing and 3-hour dispersing, respectively. The coating layer preferably comprises dopant element-free, electroconductive tin oxide.

Abstract: A silver-coated copper powder includes copper core particles and a silver coat layer located on the surface of the core particles. When S1 is a BET specific surface area (m2/g) of the silver-coated copper powder; S2 is a specific surface area (m2/g) calculated from a particle diameter D50 obtained by the analysis of a microscopic image of the silver-coated copper powder; and t is a thickness of the silver coat layer, the silver-coated copper powder satisfies Expression: (S1/S2)?0.005×t+1.45. The silver-coated copper powder has a volume cumulative particle diameter D50L at a cumulative volume of 50 vol % as measured by laser diffraction-scattering method of 0.01 to 100 ?m.

Abstract: The disclosed composite copper particle includes a core particle including copper, and a coating layer including a copper-tin alloy and formed on the surface of the core particle, the composite copper particle having a particle diameter at 50% cumulative volume in the particle size distribution of 0.1 to 10.0 ?m. The alloy is preferably CuSn. The ratio of tin to the the composite copper particle is preferably 3.0 to 12.0 mass %. The composite copper particle is suitably obtained by a method including a step of mixing a reducing agent for tin and an aqueous slurry containing a tin source compound and core particles which include copper, to form a coating layer including a copper-tin alloy on a surface of the core particles.

Abstract: An electroconductive particle having a core particle and a tin oxide-containing coating layer on the core particle. The tin oxide of the coating layer has a crystallite size of 70 to 200 ?. The electroconductive particle preferably has a ratio of R3 to R1 of 1 to 250, wherein R1 and R3 are respective surface resistivities of electroconductive films formed of a coating composition containing the electroconductive particle and prepared by 1-hour dispersing and 3-hour dispersing, respectively. The coating layer preferably comprises dopant element-free, electroconductive tin oxide.

Abstract: An internal combustion engine exhaust gas purifying catalyst carrier has a core body formed of a CeO2—ZrO2 solid solution or a CeO2—ZrO2—La2O2 solid solution, and CeO2 supported on the surface of the core body, wherein the core body has a CeO2 content of 5 to 35 mass % and an La2O2 content of 0 to 10 mass %, on the basis of the mass of the carrier, and the amount of CeO2 supported on the core body is 5 to 17 mass %, on the basis of the mass of the carrier.

Abstract: Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained.

Abstract: Objects of the present invention are to provide oxidation resistant nickel-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit, and to provide a method for producing the same. In order to achieve the objects, there is provided nickel-coated copper powder which is characterized in that it comprises nickel-coated copper particles in which a core material is copper particles, a catalyst for plating is fixed to a surface of the copper-particles by reduction reaction and electroless plated nickel is applied to the outermost surface. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

Abstract: It is an object to provide a copper-containing tin powder having excellent capabilities in forming fine wiring circuits and filling via holes with ability in bond by melting at a low temperature. In order to achieve the object, it is produced from a copper powder as a starting material by a wet substitution process and it contains remainder of copper un-substituted at 30% by weight or less. The change rate of properties of the copper-containing tin powder, e.g. an average primary particle size or the like is in the range from ?20 to +5% with respect to the starting copper powders. The copper-containing tin powder is produced by a wet substitution process in which a copper powder is brought into contact with a plating solution for tin substitution to make copper component constituting the copper powder dissolve with simultaneous substituted deposition of tin.

Abstract: It is an object to provide a superfine copper powder slurry which enables finer-pitch wirings formation on the substrates when it is used for an electroconductive ink or an electroconductive paste for wirings. In order to achieve the object, a superfine copper powder slurry produced by suspending a superfine copper powder having powder characteristics of the value DTEM (micron meter) of 0.01 to 0.1, the ratio D50/DTEM of 1.0 to 1.5 and the ratio grain size/DTEM of 0.2 to 1 in a solvent, where (DTEM is) an average primary particle diameter of the powder particle diameter directly measured from observation image of TEM and calculated with observation magnification, and D50 is a particle diameter at 50% cumulative particle size examined by Doppler scattering photo analysis.

Abstract: It is an object of the present invention to provide a flaky copper powder composed of fine particles having a sharp distribution particle size, a large crystallite diameter and high oxidation resistance. The flaky copper powder of the present invention contains P and has a crystallite diameter/D1A ratio of 0.01 or more to achieve the object.

Abstract: The objects of the present invention are to provide silver compound-coated silver powder applicable to a conductive paste for forming conductive interconnections for an electronic circuit by the silver powder coated with a silver compound which is thermally decomposed at lower temperature than a melting point of silver, and also to provide a method for producing the same. The means for achieving the objects involves thermal decomposition of the silver compound which is decomposed at much lower temperature than a melting point of silver to fuse silver compound-coated silver particles to each other by silver from the silver compound during sintering of a substrate on which electronic circuit conductive interconnections are to be formed by the conductive paste which contains the silver compound-coated silver powder containing the silver compound-coated silver particles in which the silver particles are coated with the silver compound.

Abstract: The present invention is mainly for providing a flake copper powder for a conductive paste with particle properties which are defined by that the particle thickness is thinner being possible for use to form an electrode or a circuit, and a production process thereof. To achieve the object of producing the following particles, each powder particles shape is plastically processed into a flake-shape, wherein the flake copper powder has a cumulative particle diameter D50 of 10 ?m or smaller measured with laser diffraction scattering particle size distribution method. The D10, D50 and D90 measured with the laser diffraction scattering particle size distribution method are illustrative and the SD/D50 value measured by the standard deviation of particle distribution with the laser diffraction scattering particle size distribution, is 0.55 or larger and/or a D90/D10 of 4.5 or smaller.

Abstract: This invention is a silver powder having a low-temperature sintering performance and dispersibility, which allows the powder particles to be agglomerated to a small degree and be nearly in the monodisperse state. Employed is silver powder of fine silver particles each to which fine silver particles adhere, wherein fine silver particles of nano-order particle size are adhered to the surface of each silver powder particle. The powder particles of the silver powder of fine silver particles each to which fine silver particles adhere have excellent dispersibility.