Abstract: A heater unit according to an embodiment includes: a flat heater including a linear heating element arranged in a planar pattern; a first mesh body formed in a mesh pattern using a material with high heat conductivity and placed at least on one side of the flat heater facing the flat heater; and a second mesh body formed in a mesh pattern using a material with lower heat conductivity than that of the first mesh body and placed to face a surface of the first mesh body opposite to the surface of the first mesh body facing the flat heater.

Abstract: A processing apparatus includes: a processing chamber configured to contain a workpiece; a first nozzle provided in the processing chamber, the first nozzle discharging vapor onto the workpiece; a wall enclosing the processing chamber; a fluid channel provided inside the wall; a fluid inlet; and a fluid outlet. The fluid inlet is provided in communication with the fluid channel. The fluid outlet is provided in communication with the fluid channel, where a fluid flows into the fluid inlet, passes through the fluid channel, and flows out of the fluid outlet. A processing method for processing a workpiece moving in a processing chamber, the processing method includes: discharging a vapor from a first nozzle toward the workpiece while flowing a fluid through a fluid channel which is provided inside a wall, the wall enclosing the processing chamber.

Abstract: A heater unit according to an embodiment includes: a flat heater including a linear heating element arranged in a planar pattern; a first mesh body formed in a mesh pattern using a material with high heat conductivity and placed at least on one side of the flat heater facing the flat heater; and a second mesh body formed in a mesh pattern using a material with lower heat conductivity than that of the first mesh body and placed to face a surface of the first mesh body opposite to the surface of the first mesh body facing the flat heater.

Abstract: A processing apparatus includes: a tank configured to store water; vapor generating unit configured to turn the water supplied from the tank into vapor; a processing chamber in which vapor supplied from the vapor generating unit is used to remove residues from a workpiece; cooling unit; and filtering unit. The cooling unit cools waste liquid ejected from the processing chamber. The filtering unit is provided between the cooling unit and the tank, and the filtering unit filters the waste liquid cooled in the cooling unit. A processing method includes: supplying vapor into a processing chamber; removing residues from a workpiece using the vapor; cooling waste liquid containing the removed residues to precipitate the residues as solids; and filtering the waste liquid containing the precipitates.

Abstract: A processing apparatus includes: a tank configured to store water; vapor generating unit configured to turn the water supplied from the tank into vapor; a processing chamber in which vapor supplied from the vapor generating unit is used to remove residues from a workpiece; cooling unit; and filtering unit. The cooling unit cools waste liquid ejected from the processing chamber. The filtering unit is provided between the cooling unit and the tank, and the filtering unit filters the waste liquid cooled in the cooling unit. A processing method includes: supplying vapor into a processing chamber; removing residues from a workpiece using the vapor; cooling waste liquid containing the removed residues to precipitate the residues as solids; and filtering the waste liquid containing the precipitates.

Abstract: A cleaning apparatus to remove organic substances deposited onto a substrate, the apparatus includes a transport unit configured to transport the substrate, a water steam ejection unit configured to eject a heated water steam to a face of the substrate to be transported deposited with the organic substances, and a physical force applying unit configured to apply a physical force to the organic substances deposited onto the substrate to be transported.

Abstract: A processing apparatus includes: a processing chamber configured to contain a workpiece; a first nozzle provided in the processing chamber, the first nozzle discharging vapor onto the workpiece; a wall enclosing the processing chamber; a fluid channel provided inside the wall; a fluid inlet; and a fluid outlet. The fluid inlet is provided in communication with the fluid channel. The fluid outlet is provided in communication with the fluid channel, where a fluid flows into the fluid inlet, passes through the fluid channel, and flows out of the fluid outlet. A processing method for processing a workpiece moving in a processing chamber, the processing method includes: discharging a vapor from a first nozzle toward the workpiece while flowing a fluid through a fluid channel which is provided inside a wall, the wall enclosing the processing chamber.

Abstract: A processing apparatus includes: a processing chamber configured to process a workpiece; a moving unit configured to move the workpiece in the processing chamber; a first nozzle; a partition member; an inlet provided in communication with the downstream space; and an outlet provided in communication with the upstream space. The first nozzle has a discharge port configured to discharge a processing liquid or a processing gas. The discharge port is opposed to a moving path of the workpiece and the processing liquid or the processing gas is discharged from the discharge port in a discharge direction directed to an upstream side of a moving direction of the workpiece relative to a direction perpendicular to the moving direction. The partition member partitions a space above the moving path in the processing chamber, and the space is partitioned at a position of the first nozzle into an upstream space on the upstream side of the moving direction and a downstream space on a downstream side of the moving direction.