Abstract: According to one embodiment, an ultrasonic bonding apparatus includes an ultrasonic transducer, a distal-end tool, an ultrasonic horn and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and a control device. The ultrasonic oscillator applies the voltage oscillated by the oscillation circuit to the ultrasonic transducer. The control device is configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.

Abstract: An information processing apparatus that detects touch input at a touch panel disposed on or formed integrally with a display, extracts one or more character strings from a plurality of character strings displayed on the display based on the detected touch input, prioritizes the extracted one or more character strings, and controls the display to display the extracted one or more character strings in order based on the prioritizing.

Abstract: An information processing apparatus that detects touch input at a touch panel disposed on or formed integrally with a display, extracts one or more character strings from a plurality of character strings displayed on the display based on the detected touch input, prioritizes the extracted one or more character strings, and controls the display to display the extracted one or more character strings in order based on the prioritizing.

Abstract: According to one embodiment, an ultrasonic bonding apparatus includes an ultrasonic transducer, a distal-end tool, an ultrasonic horn and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and a control device. The ultrasonic oscillator applies the voltage oscillated by the oscillation circuit to the ultrasonic transducer. The control device is configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.

Abstract: An information processing apparatus that detects touch input at a touch panel disposed on or formed integrally with a display, extracts one or more character strings from a plurality of character strings displayed on the display based on the detected touch input, prioritizes the extracted one or more character strings, and controls the display to display the extracted one or more character strings in order based on the prioritizing.

Abstract: According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of

Abstract: The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

Abstract: An electronic circuit module includes a plurality of electronic parts mounted on a substrate, the space separating the electronic parts being filled with thermosetting insulating resin, the insulating resin being covered by metal foil so as to expose the profiles and the heights of the electronic parts, the outer periphery of the metal foil being electrically connected to a grounding electrode arranged on the substrate by means of a conductive material.

Abstract: The present invention provides a thermosetting polyurethane elastomer that is yellowing-free, has low hardness and does not give rise to bleeding without using any plasticizer, has little tack, and exhibits small changes in hardness with temperature. This is achieved by a composition forming a yellowing-free, low-hardness polyurethane elastomer, containing no plasticizer and having (A) an isocyanate-terminated prepolymer and (B) a polyester polyol, wherein the isocyanate-terminated prepolymer (A) is an isocyanate-terminated prepolymer obtained by reacting hexamethylene diisocyanate with a glycol having an alkyl group as a side chain and having a molecular weight no greater than 500, and the polyester polyol (B) is a polyester polyol obtained from trimethylolpropane, 3-methyl-1,5-pentanediol and adipic acid, and having an average number of functional groups of 2.5 to 3.5 and a number average molecular weight of 800 to 5,000.

Abstract: According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of

Abstract: An example of the invention is a method of manufacturing a semiconductor device including, pressing a part of the connection conductor having a plate-like shape or a belt-like shape against a lead terminal which is formed on a lead frame, is formed into a thin and long plate-like shape, and is supported only at one end in a longitudinal direction of the terminal, in such a manner that the part of the conductor is brought into contact with the lead terminal, and applying ultrasonic vibration substantially in the longitudinal direction in a plane perpendicular to the pressing direction to the connection conductor in the state where the part of the connection conductor is pressed against the lead terminal.